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US 11,932,598 B2Granted
Polyacyloxymethyl-4,4′-acyloxybiphenyl compound
AssigneeHonshu Chemical Industry Co., Ltd.
InventorAkihito Nasu
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Abstract
The present invention addresses the problem of providing a novel compound which readily dissolves in liquid epoxy resins and which can be a hardener for epoxy resins to give cured objects excellent in terms of heat resistance and chemical resistance. Provided as a means for solving the problem is a polyacyloxymethyl-4,4′-acyloxybiphenyl compound represented by formula (1).
Claims1
A polyacyloxymethyl-4,4′-acyloxybiphenyl compound represented by a following formula (1):
- wherein, R1, R2, R3, and R4 each independently represent an alkyl group having 1 to 8 carbon atoms;
- R5 and R6 each independently represent —CH2OCOR7, R7 represents an alkyl group having 1 to 8 carbon atoms;
- and n and m each independently represent any one of 1, 2, and 3.
Dependencies are inferred from the claim text.