Injection molding system
AssigneeSeiko Epson Corporation
InventorsHidenobu Maruyama, Kazunobu Maruyama, Masato Sugano
Life of this patent
Estimating the term…
Abstract
An injection molding system includes a first unit in which an injection molding machine is disposed and an option unit. The injection molding machine is configured to be attachable with a stationary die and a movable die that moves with respect to the stationary die. The option unit includes at least one of a second unit in which a robot that moves a molded article molded by the injection molding machine is disposed and a third unit in which at least one of a material dryer that dries a material supplied to the injection molding machine and a material supply section that supplies the material to the injection molding machine is disposed. The first unit is configured to be detachably attachable with the option unit.
Claims11
An injection molding system comprising:
- a first unit in which an injection molding machine is disposed;
- and
- an option unit, wherein
- the injection molding machine is configured to be attachable with a stationary die and a movable die that moves with respect to the stationary die,
- the option unit includes:
- a second unit in which a robot that moves a molded article molded by the injection molding machine is disposed;
- and
- a third unit in which at least one of a material dryer is configured to dry a material supplied to the injection molding machine and a material supply section that supplies the material to the injection molding machine is disposed, and
- the first unit is configured to be detachably attachable with the option unit.
Dependencies are inferred from the claim text.