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US 11,930,596 B2Granted
Materials for printed circuit boards
AssigneeThintronics, Inc.
InventorsTarun Amla, Stefan J. Pastine
Life of this patent
Estimating the term…
Abstract
Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
Claims17
A printed circuit board, comprising a transmission line, which contains a dielectric polymer film having:
- (i) a glass transition temperature less than or equal to about 130° C.;
- (ii) a dielectric constant less than 2.8;
- and
- (iii) a substantially isotropic elastic modulus less than or equal to about 6 GPa when an average temperature of the dielectric polymer film is below the glass transition temperature,
- wherein a width of the transmission line is greater than or equal to about 5 Mils.
2 more elements
A printed circuit board, comprising
- a first transmission line;
- a second transmission line;
- and
- a dielectric layer between the first transmission line and the second transmission line,
- wherein
- the first transmission line and the second transmission line contain a dielectric polymer film having:
- (i) a glass transition temperature less than or equal to about 130° C., (ii) a dielectric constant less than 2.8, and (iii) a substantially isotropic elastic modulus less than or equal to about 6 GPa when an average temperature of the dielectric polymer film is below the glass transition temperature,
- the first transmission line has a width greater than or equal to about 5 Mils, and
- the dielectric layer between the first transmission line and the second transmission line has a thickness between 0.1 Mils and 4 Mils.
6 more elements
Dependencies are inferred from the claim text.