Temperature-dependent capacitor
AssigneeInternational Business Machines Corporation
InventorsKyle Schoneck, Matthew A. Walther, Jason J. Bjorgaard, John R. Dangler, Layne A. Berge, Thomas W. Liang, Matthew Doyle
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Abstract
A temperature-dependent capacitor comprises a first conductive plate, a second conductive plate located in a parallel-planar orientation to the first conductive plate, and a dielectric material located between the first conductive plate and the second conductive plate, the dielectric material having a temperature-dependent dielectric constant (ε) value, wherein the temperature-dependent capacitor has a positive correlation of an operating temperature of the temperature-dependent capacitor to a capacitance value of the temperature-dependent capacitor.
Claims20
A temperature-dependent capacitor comprising:
- a first conductive plate;
- a second conductive plate located in a parallel-planar orientation to the first conductive plate;
- and
- a dielectric separating the first conductive plate from the second conductive plate, wherein:
- the dielectric is sufficiently flexible to allow movement of the first conductive plate relative to the second conductive plate in response to an increase in temperature of the first conductive plate, wherein the dielectric includes a combination of two or more distinct dielectric materials comprising:
- a first dielectric material arranged adjacent to the second conductive plate, wherein there is—a positive correlation between temperature of the first dielectric-material—and dielectric constant (ε) value of the first dielectric material;
- and
- a second dielectric material arranged adjacent to the first conductive plate;
- and
- the first conductive plate is adapted such that a distance between at least a portion of the first conductive plate and at least a portion of the second conductive plate decreases as a temperature of the first conductive plate increases.
An electronic system comprising:
- a printed circuit board (PCB);
- a component electrically and mechanically attached to the PCB;
- a temperature-dependent decoupling capacitor affixed to the PCB, the temperature-dependent decoupling capacitor electrically coupled to the component, the temperature-dependent decoupling capacitor comprising:
- a first conductive plate;
- a second conductive plate located in a parallel-planar orientation to the first conductive plate;
- and
- a dielectric material including at least two distinctive dielectrics located between the first conductive plate and the second conductive plate, wherein:
- the dielectric is sufficiently flexible to allow movement of the first conductive plate relative to the second conductive plate in response to an increase in temperature of the first conductive plate, wherein the dielectric includes a combination of two or more distinct dielectric materials comprising:
- a first dielectric material arranged adjacent to the second conductive plate, wherein there is a positive correlation between temperature of the dielectric material and dielectric constant (ε) value of the dielectric material;
- and
- a second dielectric material arranged adjacent to the first conductive plate;
- and
- the first conductive plate is adapted such that a distance between at least a portion of the first conductive plate and at least a portion of the second conductive plate decreases as a temperature of the first conductive plate increases.
A temperature-dependent capacitor comprising:
- a first conductive plate;
- a second conductive plate located in a parallel-planar orientation to the first conductive plate,
- wherein the first conductive plate is adapted such that a distance between at least a portion of the first conductive plate and at least a portion of the second conductive plate decreases as a temperature of the first conductive plate increases;
- and
- a dielectric separating the first conductive plate from the second conductive plate, the dielectric including a combination of two or more distinct dielectric materials arranged in layers between the first and second conductive plates, the two or more distinct dielectric materials including:
- a first dielectric material arranged adjacent to the second conductive plate, wherein there is a positive correlation between temperature of the first dielectric material and dielectric constant (ε) value of the first dielectric material;
- and
- a second dielectric material arranged adjacent to the first conductive plate, the first dielectric material being sufficiently flexible to allow movement of the first conductive plate relative to the second conductive plate in response to the increase in the temperature of the first conductive plate.
Dependencies are inferred from the claim text.