Activating surfaces for subsequent bonding

A method of activating a surface of a plastics substrate formed from:

• (a) a polyaryletherketone;
• (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group;
• (c) polyphenylene sulfide (PPS);
• or
• (d) polyetherimide (PEI);
• for subsequent bonding,
• the method comprising a step of exposing the surface to actinic radiation wherein the actinic radiation:
• includes radiation with wavelength in a range from about 10 nm to about 1000 nm;
• and energy of the actinic radiation to which the surface is exposed is in a range from about 0.5 J/cm2 to about 300 J/cm2, the method comprising the step of treating the surface with copper acrylate, prior to exposing the surface to actinic radiation.

A method of bonding a first substrate formed from:

• (a) polyaryletherketone;
• (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group;
• (c) polyphenylene sulfide (PPS);
• or
• (d) polyetherimide (PEI);
• to a second substrate comprising the steps of:
• (i) exposing the surface of the first substrate to actinic radiation to activate the surface for subsequent bonding wherein the actinic radiation includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and the energy of the actinic radiation to which the surface is exposed is in the range from about 4 J/cm2 to about 300 J/cm2,
• (ii) subsequently, bonding the activated surface of the first substrate to the second substrate utilising adhesive.

A method of bonding a first substrate formed from:

• (a) a polyaryletherketone;
• (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group;
• (c) polyphenylene sulfide (PPS);
• or
• (d) polyetherimide (PEI);
• to a second substrate comprising the steps of:
• (i) exposing a surface of the first substrate to actinic radiation to activate the surface for subsequent bonding wherein the actinic radiation includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2,
• (ii) subsequently, bonding the activated surface of the first substrate to the second substrate utilising adhesive,
• the method comprising the step of treating the surface with copper acrylate, prior to step (i) exposing the surface to actinic radiation.

A method of activating a surface of a plastics substrate formed from:

• polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK);
• polyether ether ketone ketone (PEEKK);
• or polyether ketone ether ketone ketone (PEKEKK);
• for subsequent bonding,
• the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
• includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and the energy of the actinic radiation to which the surface is exposed is in the range from 4 J/cm2 to about 40 J/cm2 for subsequent bonding with acrylic adhesive;
• or
• the energy of the actinic radiation to which the surface is exposed is in the range from about 4 J/cm2 to about 850 J/cm2 for subsequent bonding with epoxy adhesive.

A method of activating a surface of a plastics substrate formed from polyarylamide (PARA), for subsequent bonding,

• the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
• includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and
• the energy of the actinic radiation to which the surface is exposed is in the range from about 10 J/cm2 to about 30 J/cm2 for subsequent bonding with acrylic adhesive.

A method of activating a surface of a plastics substrate formed from polyphenylene sulfide (PPS), for subsequent bonding,

• the method comprising the step of applying copper acrylate to the surface and then exposing the surface to actinic radiation wherein the actinic radiation
• includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and
• the energy of the actinic radiation to which the surface is exposed is in the range from about 2 J/cm2 to about 240 J/cm2 for subsequent bonding with acrylic adhesive optionally wherein the surface is treated with (meth)acrylate, prior to exposing the surface to the actinic radiation,
• or the energy of the actinic radiation to which the surface is exposed is in the range from about 5 J/cm2 to about 312 J/cm2 for subsequent bonding with epoxy adhesive.

A method of activating a surface of a plastics substrate formed from polyetherimide (PEI), for subsequent bonding,

• the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
• includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• the energy of the actinic radiation to which the surface is exposed is in the range from 4 J/cm2 to about 10 J/cm2 for subsequent bonding with acrylic adhesive,
• or the energy of the actinic radiation to which the surface is exposed is in the range from about 6 J/cm2 to about 120 J/cm2 for subsequent bonding with epoxy adhesive.

A method of activating a surface of a plastics substrate formed from:

• a polyaryletherketone;
• for subsequent bonding,
• the method comprising the steps of
• treating the surface with copper acrylate, prior to exposing the surface to actinic radiation,
• exposing the surface to actinic radiation wherein the actinic radiation:
• includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and the energy of the actinic radiation to which the surface is exposed is in the range from about 9 J/cm2 to about 240 J/cm2 for subsequent bonding with anaerobic adhesive.

A method of activating a surface of a plastics substrate formed from:

• polyarylamide (PPS) for subsequent bonding,
• the method comprising the steps of
• treating the surface with copper acrylate, prior to exposing the surface to actinic radiation,
• exposing the surface to actinic radiation wherein the actinic radiation:
• includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and the energy of the actinic radiation to which the surface is exposed is in the range from about 14 J/cm2 to about 30 J/cm2 for subsequent bonding with anaerobic adhesive.

A method of activating a surface of a plastics substrate formed from:

• polyarylamide (PARA) or polybutadiene terephthalate (PBT) for subsequent bonding,
• the method comprising the steps of
• treating the surface with copper acrylate, prior to exposing the surface to actinic radiation,
• exposing the surface to actinic radiation wherein the actinic radiation:
• includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and the energy of the actinic radiation to which the surface is exposed is in the range from about 10 J/cm2 to about 30 J/cm2 for subsequent bonding with anaerobic adhesive.

A method of activating a surface of a plastics substrate formed from:

• polyetherimide (PEI) for subsequent bonding,
• the method comprising the steps of
• treating the surface with copper acrylate, prior to exposing the surface to actinic radiation,
• exposing the surface to actinic radiation wherein the actinic radiation:
• includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
• and the energy of the actinic radiation to which the surface is exposed is in the range from about 3 J/cm2 to about 30 J/cm2 for subsequent bonding with anaerobic adhesive.