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US 11,926,763 B2Granted
Hollow resin particles and sheet
AssigneeZeon Corporation
InventorsTakashi Iga, Takeshi Hirata, Nozomi Yabuki
Life of this patent
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Abstract
Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 μm to 9.0 μm, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.
Claims12
Hollow resin particles each having one or two or more hollow portions,
- wherein a number average particle diameter is from 0.1 μm to 9.0 μm, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less,
- wherein a repeating unit constituting the resin contains a crosslinkable monomer unit, and
- wherein, with respect to 100 parts by mass of a total mass of the repeating unit constituting the resin, a content ratio of the crosslinkable monomer unit is from 25 parts by mass to 59 parts by mass.
Dependencies are inferred from the claim text.