Curable film composition, curable film, and cured product thereof
AssigneeThintronics, Inc.
InventorsStefan J. Pastine, Yaroslav Klichko
Life of this patent
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Abstract
A composition for curable films, a curable film made thereof, and a cured product obtained by curing the curable film are disclosed. The curable film contains fused silica and/or hollow glass microspheres, a rubber composition containing at least one diene-based rubber, and a toluene soluble maleimide resin. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.
Claims17
A curable film composition, comprising:
- (A) fillers in an amount of 10 wt % to 80 wt %, relative to a total weight of the curable film composition,
- (B) a rubber composition containing at least one diene-based rubber, and
- (C) a maleimide resin having a solubility in toluene of at least 15 g/100 ml at ambient temperature.
A curable film composition comprising:
- (A) fillers in an amount of 10 wt % to 80 wt %, relative to a total weight of the curable film composition,
- (B) a rubber composition containing at least one diene-based rubber and at least one liquid rubber, and
- (C) a maleimide resin having a solubility in toluene of at least 5 g/100 ml at ambient temperature.
Dependencies are inferred from the claim text.