Curable film composition, curable film, and cured product thereof
AssigneeThintronics, Inc.
InventorsStefan J. Pastine, Yaroslav Klichko
Life of this patent
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Abstract
A curable film and a cured product obtained by curing the curable film are disclosed. The curable film contains, as essential components, hollow glass microspheres and a rubber composition containing at least one diene-based rubber. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.
Claims21
A curable film, comprising:
- (A) hollow glass microspheres having D50 of equal to or less than 12 μm;
- and
- (B) a rubber composition containing at least one diene-based rubber.
A curable film, comprising:
- (A) hollow glass microspheres, which have D50 of equal to or less than 19.5 μm and are not subjected to an acid or alkaline wash before incorporation into the curable film;
- and
- (B) a rubber composition containing at least one diene-based rubber.
A cured film obtained by curing a curable film comprising:
- (A) hollow glass microspheres having D50 of equal to or less than 19.5 μm;
- and
- (B) a rubber composition containing at least one diene-based rubber,
- wherein the cured film has a dielectric constant at 10 GHz of less than 2.45.
Dependencies are inferred from the claim text.