Pinhole camera, electronic apparatus and manufacturing method

A electronic apparatus, comprising:

• a semiconductor device that includes:
• a semiconductor substrate;
• a pixel array unit on the semiconductor substrate, wherein the pixel array unit includes a plurality of pixels;
• a microlens layer on the semiconductor substrate;
• a transparent seal resin that pastes the microlens layer and a protective substrate;
• and
• a light shielding film on the protective substrate, wherein
• the light shielding film is configured to block light irradiated on the semiconductor substrate, and
• the light shielding film includes a hole.

A manufacturing method, comprising:

• forming a pixel array unit on a semiconductor substrate, wherein the pixel array unit includes a plurality of pixels;
• forming a microlens layer on the semiconductor substrate;
• stacking a protective structure including a protective substrate on the semiconductor substrate;
• pasting, by a transparent seal resin, the microlens layer and the protective structure;
• forming a light shielding film on the protective structure, wherein the light shielding film is configured to block light irradiated on the semiconductor substrate;
• and
• forming a hole in the light shielding film.