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US 11,919,032 B2Granted
Film forming apparatus and method for manufacturing part having film containing silicon
AssigneeTokyo Electron Limited
InventorsTakayuki Ishii, Kazuya Nagaseki, Michishige Saito
Life of this patent
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Abstract
A film forming apparatus is disclosed. The apparatus comprises a chamber; an exhaust unit configured to reduce the pressure in the chamber to a predetermined vacuum level; a holder disposed in the chamber and configured to hold a film forming target member on which a film is to be formed; a supply unit configured to supply a film forming material containing silicon to a surface of the film forming target member; and a heat source configured to perform heating at the predetermined vacuum level to melt the supplied film forming material.
Claims25
A film forming apparatus comprising:
- a chamber;
- an exhaust unit configured to reduce the pressure in the chamber to a predetermined vacuum level;
- a holder disposed in the chamber and configured to hold a film forming target member on which a film is to be formed;
- a supply unit configured to supply a film forming material containing silicon to a surface of the film forming target member;
- a heat source configured to perform heating at the predetermined vacuum level to melt the supplied film forming material;
- and
- a controller, wherein the controller is configured to control the apparatus to provide the predetermined vacuum level in the chamber by the exhaust unit during supply of the film forming material containing silicon by the supply unit and during the heating by the heat source.
4 more elements
Dependencies are inferred from the claim text.