Method for routing local interconnect structure at same level as reference metal line

A method, comprising:

• coupling a first reference metal line to a first/source drain terminal of a first transistor with a first gate terminal, the first source/drain terminal, and a second source/drain terminal;
• coupling a second reference metal line to a third source/drain terminal of a second transistor with a second gate terminal, the third source/drain terminal, and a fourth source/drain terminal;
• coupling, at a same interconnect level as the first and second reference metal lines, a local interconnect structure to the first and second gate terminals;
• coupling, above an interconnect level of the local interconnect structure, a first interconnect structure to the second source/drain terminal;
• coupling, above the interconnect level of the local interconnect structure, a second interconnect structure to the third source/drain terminal;
• and
• routing, above the interconnect level of the local interconnect structure and at a same interconnect level as the first and second interconnect structures, a third interconnect structure.

A method, comprising:

• routing a first reference metal line to couple to a first source/drain terminal of a first fin field effect transistor (finFET) with a first gate terminal, the first source/drain terminal, and a second source/drain terminal;
• routing a second reference metal line to couple to a third source/drain terminal of a second finFET with a second gate terminal, the third source/drain terminal, and a fourth source/drain terminal;
• routing a local interconnect structure to the first and second gate terminals;
• routing, through the first reference metal line, a first interconnect structure to the second source/drain terminal;
• routing, through the second reference metal line, a second interconnect structure to the third source/drain terminal;
• routing, at a same interconnect level as the first and second interconnect structures, a third interconnect structure,
• wherein the local interconnect structure, the first reference metal line, and the second reference metal line are routed at a first interconnect level, and
• wherein the first interconnect structure, the second interconnect structure, and the third interconnect structure are routed at a second interconnect level.