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US 11,912,612 B2Granted
Plating film and plating film production method
AssigneesOkuno Chemical Industries Co., Ltd., Panasonic Holdings Corporation
InventorsMayu Tsukuda, Toshimitsu Nagao, Junichi Katayama, Kazuya Shimada, Masahito Hayamizu, Toshihiko Sakata, Shuhei Fuku, Asuka Hirooka
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Abstract
The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.
Claims14
A method for producing a plating film to be formed on a glass substrate, comprising:
- (I) step I of bringing a reaction solution containing fluorine and an oxide precursor into contact with a surface of a glass substrate to form an oxide layer on the glass substrate;
- (II) step II of adding a catalyst to the oxide layer;
- (III) step III of removing fluorine in the oxide layer to which the catalyst has been added;
- (IV) step IV of forming an electroless plating film on the oxide layer to which the catalyst has been added;
- and
- (V) step V of forming an electrolytic copper plating film on the electroless plating film.
3 more elements
Dependencies are inferred from the claim text.