# US 11,910,720 B2 · Piezoelectric device and MEMS device

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- Number: US 11,910,720 B2
- Document ID: US11910720B2
- Status: Granted
- Kind: B2
- Application number: 17/135,257
- Filed: 2020-12-28
- Published: 2021-07-01
- Granted: 2024-02-20
- Earliest claimed: 2019-12-26
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Eiji Osawa; Hikaru Iwai
- Web page: https://patentgrep.com/patent/US11910720B2

## CPC

- B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm}
- H10N 30/875: {Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins}
- B06B 1/0629: {Square array}
- B06B 1/0692: {with a continuous electrode on one side and a plurality of electrodes on the other side}
- B41J 2/14201: {Structure of print heads with piezoelectric elements}
- H10N 30/02: Forming enclosures or casings
- H10N 30/06: Forming electrodes or interconnections, e.g. leads or terminals
- H10N 30/2047: {Membrane type}
- H10N 30/802: {Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits}
- H10N 30/88: Mounts; Supports; Enclosures; Casings
- B41J 2002/14241: {having a cover around the piezoelectric thin film element}
- B41J 2002/14491: {Electrical connection}
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R)

## Abstract

Provided is a piezoelectric device and an MEMS device whose size can be reduced. The piezoelectric device includes: a first substrate that includes a first surface on which a piezoelectric element and a first electrode coupled to the piezoelectric element are disposed; a second substrate that includes a second surface on which a second electrode configured to be coupled to a control circuit is disposed; and a third substrate that is disposed between the first substrate and the second substrate, and includes a third surface bonded to the first surface and a fourth surface facing the second surface, in which the third substrate has a through hole passing through from the third surface to the fourth surface, and a third electrode provided in the through hole and coupled to the first electrode, and the second electrode is coupled to the third electrode and is electrically coupled to the first electrode via the third electrode.

## Claims

### Claim 1

A piezoelectric device, comprising:
a first substrate that includes a first surface on which a piezoelectric element and a first electrode coupled to the piezoelectric element are disposed, wherein the first substrate is provided with a plurality of the first electrodes;
a second substrate that includes a second surface on which a second electrode configured to be coupled to a control circuit is disposed, wherein the second substrate is provided with a plurality of the second electrodes corresponding to the plurality of the first electrodes;
a third substrate that is disposed between the first substrate and the second substrate, and includes a third surface bonded to the first surface and a fourth surface facing the second surface, wherein
the third substrate has a through hole passing through from the third surface to the fourth surface, and a third electrode provided in the through hole and coupled to the first electrode,
the third substrate is provided with a plurality of the through holes and a plurality of the third electrodes corresponding to the plurality of the first electrodes, and each one of the third electrodes is coupled to each one of the second electrodes, and
the second electrode is coupled to the third electrode and is electrically coupled to the first electrode via the third electrode; and
a wall portion that partitions between adjacent ones of the second electrodes is provided between the second substrate and the third substrate.

### Claim 2 (depends on 1)

The piezoelectric device according to claim 1, wherein
the third electrode is bonded to the second electrode.

### Claim 3 (depends on 2)

The piezoelectric device according to claim 2, wherein
the third electrode is a resin-based bonding agent including a metal filler.

### Claim 4 (depends on 1)

The piezoelectric device according to claim 1, wherein
the wall portion is formed of an insulating resin-based bonding agent.

### Claim 5 (depends on 1)

The piezoelectric device according to claim 1, wherein
an insulating resin-based bonding agent for bonding the second substrate and the third substrate is further provided between the second substrate and the third substrate.

### Claim 6 (depends on 1)

The piezoelectric device according to claim 1, wherein
the second substrate includes a first region in which the third substrate and the first substrate are stacked, and a second region that surrounds the first region at an outer side of the first region, and
a tubular portion that protrudes in a stacking direction in which the third substrate and the first substrate are stacked is provided in the second region of the second substrate, and the second substrate and the third substrate are disposed in a tube of the tubular portion.

### Claim 7 (depends on 2)

The piezoelectric device according to claim 2, wherein
the second substrate includes a first region in which the third substrate and the first substrate are stacked, and a second region that surrounds the first region at an outer side of the first region, and
a tubular portion that protrudes in a stacking direction in which the third substrate and the first substrate are stacked is provided in the second region of the second substrate, and the second substrate and the third substrate are disposed in a tube of the tubular portion.

### Claim 8 (depends on 3)

The piezoelectric device according to claim 3, wherein
the second substrate includes a first region in which the third substrate and the first substrate are stacked, and a second region that surrounds the first region at an outer side of the first region, and
a tubular portion that protrudes in a stacking direction in which the third substrate and the first substrate are stacked is provided in the second region of the second substrate, and the second substrate and the third substrate are disposed in a tube of the tubular portion.

### Claim 9 (depends on 1)

The piezoelectric device according to claim 1, wherein
the second substrate includes a first region in which the third substrate and the first substrate are stacked, and a second region that surrounds the first region at an outer side of the first region, and
a tubular portion that protrudes in a stacking direction in which the third substrate and the first substrate are stacked is provided in the second region of the second substrate, and the second substrate and the third substrate are disposed in a tube of the tubular portion.

### Claim 10 (depends on 4)

The piezoelectric device according to claim 4, wherein
the second substrate includes a first region in which the third substrate and the first substrate are stacked, and a second region that surrounds the first region at an outer side of the first region, and
a tubular portion that protrudes in a stacking direction in which the third substrate and the first substrate are stacked is provided in the second region of the second substrate, and the second substrate and the third substrate are disposed in a tube of the tubular portion.

### Claim 11 (depends on 5)

The piezoelectric device according to claim 5, wherein
the second substrate includes a first region in which the third substrate and the first substrate are stacked, and a second region that surrounds the first region at an outer side of the first region, and
a tubular portion that protrudes in a stacking direction in which the third substrate and the first substrate are stacked is provided in the second region of the second substrate, and the second substrate and the third substrate are disposed in a tube of the tubular portion.

### Claim 12

An MEMS device, comprising:
a first substrate on which an MEMS element is disposed and a first electrode coupled to the MEMS element is provided on a first surface, wherein the first substrate is provided with a plurality of the first electrodes;
a second substrate that has a second surface provided with a second electrode configured to be coupled to a control circuit, wherein the second substrate is provided with a plurality of the second electrodes corresponding to the plurality of the first electrodes;
a third substrate that has a third surface disposed between the first substrate and the second substrate and bonded to the first surface of the first substrate, and a fourth surface facing the second surface of the second substrate, wherein
the third substrate has a through hole passing through from the third surface to the fourth surface, and a third electrode provided in the through hole and coupled to the first electrode,
the third substrate is provided with a plurality of the through holes and a plurality of the third electrodes corresponding to the plurality of the first electrodes, and each one of the third electrodes is coupled to each one of the second electrodes, and
the second electrode is coupled to the third electrode and is electrically coupled to the first electrode via the third electrode; and
a wall portion that partitions between adjacent ones of the second electrodes is provided between the second substrate and the third substrate.

### Claim 13

A piezoelectric device, comprising:
a first substrate that includes a first surface on which a piezoelectric element and a first electrode coupled to the piezoelectric element are disposed;
a second substrate that includes a second surface on which a second electrode configured to be coupled to a control circuit is disposed;
a third substrate that is disposed between the first substrate and the second substrate, and includes a third surface bonded to the first surface and a fourth surface facing the second surface, wherein
the second substrate includes a first region in which the third substrate and the first substrate are stacked, and a second region that surrounds the first region at an outer side of the first region,
the third substrate has a through hole passing through from the third surface to the fourth surface, and a third electrode provided in the through hole and coupled to the first electrode, and
the second electrode is coupled to the third electrode and is electrically coupled to the first electrode via the third electrode; and
a tubular portion that protrudes in a stacking direction in which the third substrate and the first substrate are stacked is provided in the second region of the second substrate, and the second substrate and the third substrate are disposed in a tube of the tubular portion.