# US 11,910,694 B2 · Vapor deposition method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,694 B2 - Document ID: US11910694B2 - Status: Granted - Kind: B2 - Application number: 17/200,917 - Filed: 2021-03-15 - Published: 2021-07-01 - Granted: 2024-02-20 - Earliest claimed: 2018-10-23 - Assignees: Japan Display Inc. - Applicants: Japan Display Inc. - Inventors: Shigeki Terada - Web page: https://patentgrep.com/patent/US11910694B2 ## CPC - C23C 14/04: Coating on selected surface areas, e.g. using masks - C23C 14/042: {using masks} - C23C 14/24: Vacuum evaporation - H05B 33/10: Apparatus or processes specially adapted to the manufacture of electroluminescent light sources - H10K 71/164: {using vacuum deposition} - H10K 71/166: {using selective deposition, e.g. using a mask} - H10P 72/57: {Mask-wafer alignment} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A vapor deposition method for depositing evaporated materials on a substrate using a mask includes arranging a mask frame and correcting a deflection of the mask frame in the direction of gravity after the mask frame is placed. The mask frame faces the substrate so that a first side is higher than a second side in a direction of gravity. The mask frame is provided with a mask and has the first side and the second side facing each other. ## Claims ### Claim 1 A vapor deposition method for depositing evaporated materials on a substrate using a mask, the vapor deposition method comprising: arranging a mask frame facing the substrate so that a first side is higher than a second side in a direction of gravity, the mask frame being provided with a mask and having the first side and the second side facing each other; and correcting a deflection of the mask frame in the direction of gravity after the mask frame is placed using a correction mechanism including a first moving member, a second moving member located in contact with the mask frame, and a reduction mechanism moving the second moving member by a second displacement amount smaller than a first displacement amount when the first moving member moves by the first displacement amount. ### Claim 2 (depends on 1) The vapor deposition method according to claim 1, wherein correcting the deflection of the mask frame includes applying a force to a position of the mask frame where the deflection occurs. ### Claim 3 (depends on 1) The vapor deposition method according to claim 1, wherein correcting the deflection of the mask frame includes applying a force to the center of the first side or the center of the second side. ### Claim 4 (depends on 1) The vapor deposition method according to claim 1, wherein correcting the deflection of the mask frame includes applying a force to at least two positions across an axis passing through the center of the first side and the second side. ### Claim 5 (depends on 1) The vapor deposition method according to claim 1, wherein the mask frame includes a partition dividing an inner space of the mask frame into a plurality of sections and intersecting the first side and the second side, and correcting the deflection of the mask frame includes applying a force to a position where the second side intersects with the partition. ### Claim 6 (depends on 1) The vapor deposition method according to claim 1, wherein correcting the deflection of the mask frame includes applying a force to a position on the first side. ### Claim 7 (depends on 1) The vapor deposition method according to claim 1, wherein the mask frame includes a partition dividing an inner space of the mask frame into a plurality of sections and intersecting the first side and the second side, and correcting the deflection of the mask frame includes applying a force to a position other than where the first side intersects with the partition. ### Claim 8 (depends on 1) The vapor deposition method according to claim 1, wherein at least a part of a sliding surface included in the reduction mechanism is coated to reduce a coefficient of friction of the sliding surface. ### Claim 9 (depends on 1) The vapor deposition method according to claim 1, wherein the reduction mechanism is arranged in a base frame opposite the substrate. ### Claim 10 (depends on 1) The vapor deposition method according to claim 1, wherein arranging the mask frame opposite the substrate includes aligning a first position in the mask frame with a second position in the substrate and identifying a magnitude of the deflection in the direction of gravity at a third position of the mask frame different from the first position after arranging the mask frame, and correcting a deflection of the mask frame includes correcting the deflection in the direction of gravity at the third position based on the magnitude of the deflection. ### Claim 11 (depends on 1) The vapor deposition method according to claim 1, wherein the deposition material is an organic EL material.