# US 11,910,573 B2 · Mechanical device for cooling an electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,573 B2 - Document ID: US11910573B2 - Status: Granted - Kind: B2 - Application number: 17/509,233 - Filed: 2021-10-25 - Published: 2023-04-27 - Granted: 2024-02-20 - Earliest claimed: 2021-10-25 - Assignees: Mellanox Technologies, Ltd. - Applicants: Mellanox Technologies Ltd. - Inventors: Alon Rokach; Ayal Shabtay; David Fischer; Nimer Hazin; Jamal Mousa - Web page: https://patentgrep.com/patent/US11910573B2 ## CPC - H05K 7/205: {Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 13/04: Mounting of components {, e.g. of leadless components} - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM). ## Claims ### Claim 1 A mechanical device for cooling an electronic component, the device comprising: a surface comprising an aperture; and a first support protruding from the surface and a second support protruding from the surface; a thermal interface material (TIM) disposed within the aperture; wherein a height of the first support and a height of the second support are greater than a height of the electronic component such that when the device is placed on a Printed Circuit Board (PCB), a gap is formed between the surface of the device and the electronic component; wherein the gap between the surface of the device and the electronic component is smaller than the grain size of the TIM to prevent unintentional leak of the TIM onto the PCB upon application of the TIM within the aperture. ### Claim 2 (depends on 1) The device of claim 1, wherein the first support and the second support are at opposite sides of the aperture with respect to each other. ### Claim 3 (depends on 1) The device of claim 1, wherein the first support and the second support are configured to contact at their free ends the PCB to align the aperture with at least a portion of the electronic component. ### Claim 4 (depends on 1) The device of claim 1, wherein a shape of the aperture substantially corresponds to a shape of the electronic component. ### Claim 5 (depends on 1) The device of claim 1, wherein an area of the aperture is smaller than an area of the electronic component. ### Claim 6 (depends on 1) The device of claim 1, comprising a material having greater thermal conductivity than the PCB. ### Claim 7 An electronic assembly comprising: a Printed Circuit Board (PCB); an electronic component connected to the PCB; a device comprising: a surface comprising an aperture aligned with the electronic component, and a first support protruding from the surface and a second support protruding from the surface and placed at their free ends on the PCB; and a thermal interface material (TIM) disposed within the aperture of the device; wherein the device is formed of a material having greater thermal conductivity than the PCB to cause heat to flow from the electronic component through the TIM to the device and dissipate from the device and the TIM to air or to a shell. ### Claim 8 (depends on 7) The electronic assembly of claim 7, wherein the first support and the second support of the device are at opposite sides of the aperture of the device with respect to each other. ### Claim 9 (depends on 7) The electronic assembly of claim 7, wherein a shape of the aperture of the device substantially corresponds to a shape of the electronic component. ### Claim 10 (depends on 7) The electronic assembly of claim 7, wherein an area of the aperture of the device is smaller than an area of the electronic component. ### Claim 11 (depends on 10) The electronic assembly of claim 10, wherein a height of the first support and a height of the second support of the device are greater than a height of the electronic component such that a gap is formed between the surface of the device and the electronic component. ### Claim 12 (depends on 11) The electronic assembly of claim 11, wherein the gap is smaller than a grain size of the TIM. ### Claim 13 (depends on 7) The electronic assembly of claim 7, wherein the TIM further covers at least a portion of the surface of the device. ### Claim 14 A method of assembling an electronic assembly, the method comprising: placing an electronic component on a Printed Circuit Board (PCB); providing a device comprising: a surface comprising an aperture configured to receive and hold in place a thermal interface material (TIM), and a first support protruding from the surface and a second support protruding from the surface, wherein a height of the first support and a height of the second support are greater than a height of the electronic component such that a gap is formed between the surface of the device and the electronic component; aligning the aperture in the surface of the device with the electronic component; and placing a free end of the first support and a free end of the second support of the device on the PCB; applying the TIM within the aperture of the device; wherein the gap between the surface of the device and the electronic component is smaller than the grain size of the TIM to prevent unintentional leak of the TIM onto the PCB upon application of the TIM within the aperture. ### Claim 15 (depends on 14) The method of claim 14, further comprising applying the TIM to at least a portion of the surface of the device.