Housing parts, housings and processes for preparing the same

Abstract

The present invention relates to a housing part, a housing and an electronic device. The housing part according to this invention comprises a first layer, said first layer being molded from a first composition comprising a1) 50-90 wt. % of a first amorphous polymer and b1) 10-50 wt. % of a first thermally conductive filler, the first composition having a thermal conductivity (TC1) of 4-40 W/(m*K), a second layer, said second layer being molded from a second composition comprising a2) 50-90 wt. % of a second amorphous polymer and b2) 10-50 wt. % of a second thermally conductive filler, the second composition having a thermal conductivity (TC2) of 0.5-10 W/(m*K), and the second layer being molded over the first layer by leaving at least one area of the first layer not being over-molded with the second layer for being exposed to at least one heat source, wherein, TC1 is at least 2 W/(m*K) larger than TC2, the amounts of al and b1 are based on the total weight of the first composition, the amounts of a2 and b2 are based on the total weight of the second composition, and the thermal conductivity is measured in-plane according to ASTM E1461-01. The housing part provided in this invention has high heat dissipating efficiency and mechanical properties as well as high dimensional stability.

Dependencies are inferred from the claim text.