# US 11,910,568 B2 · Heat dissipation system with microelectromechanical system (MEMS) for cooling electronic or photonic components

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- Number: US 11,910,568 B2
- Document ID: US11910568B2
- Status: Granted
- Kind: B2
- Application number: 17/083,152
- Filed: 2020-10-28
- Published: 2021-10-21
- Granted: 2024-02-20
- Earliest claimed: 2020-04-20
- Assignees: Cisco Technology, Inc.
- Applicants: Cisco Technology, Inc.
- Inventors: Joel Richard Goergen
- Web page: https://patentgrep.com/patent/US11910568B2

## CPC

- G02B 6/4269: {with heat sinks or radiation fins}
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- G02B 6/12: of the integrated circuit kind (electric integrated circuits H10B, H10D84/00 - H10D89/00, H10F19/00, H10F39/00, H10H29/00, H10K19/00, H10K39/00, H10K59/00, H10N19/00, H10N39/00, H10N59/00, H10N69/00, H10N79/00, H10N89/00)
- H10W 40/73: for cooling by change of state
- B81B 7/008: {MEMS characterised by an electronic circuit specially adapted for controlling or driving the same (B81B7/0087 takes precedence; arrangements for starting, regulating, braking, or otherwise controlling an actuator H02N; control arrangements or circuits for visual indicators G09G3/00)}
- B81B 2201/058: Microfluidics not provided for in B81B2201/051 - B81B2201/054
- B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)

## Abstract

In one or more embodiments, an apparatus includes a substrate and die package, a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through the thermal transfer plate for transmitting power from a power module to the substrate and die package, and a microelectromechanical system (MEMS) module comprising a plurality of air movement cells for dissipating heat from the thermal transfer plate.

## Claims

### Claim 1

An apparatus comprising:
a substrate and die package;
a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through a first surface of the thermal transfer plate to a second surface of the thermal transfer plate for transmitting power from a power module to the substrate and die package, and wherein at least one optical path extends through the substrate and die package, and extends from the first surface of the thermal transfer plate to the second surface of the thermal transfer plate; and
a microelectromechanical system (MEMS) module comprising a plurality of air movement cells for dissipating heat from the thermal transfer plate.

### Claim 2 (depends on 1)

The apparatus of claim 1 wherein the thermal transfer plate comprises a multi-phase heat transfer system.

### Claim 3 (depends on 2)

The apparatus of claim 2 wherein the multi-phase heat transfer system comprises a vapor chamber.

### Claim 4 (depends on 2)

The apparatus of claim 2 wherein the multi-phase heat transfer system comprises a heat pipe.

### Claim 5 (depends on 1)

The apparatus of claim 1 further comprising a heat transfer element extending from at least one side of the thermal transfer plate and positioned adjacent to an air outlet of the MEMS module.

### Claim 6 (depends on 5)

The apparatus of claim 5 wherein the heat transfer element comprises graphene enhanced copper.

### Claim 7 (depends on 5)

The apparatus of claim 5 wherein the heat transfer element comprises a heat pipe.

### Claim 8 (depends on 5)

The apparatus of claim 5 wherein the heat transfer element comprises a plurality of tubes extending from opposite sides of the thermal transfer plate.

### Claim 9 (depends on 5)

The apparatus of claim 5 further comprising a plurality of fins, wherein the heat transfer element is interposed between the plurality of fins and the MEMS module.

### Claim 10 (depends on 1)

The apparatus of claim 1 further comprising a power unit operable to control said plurality of air movement cells and comprising a pulse width modulation power controller.

### Claim 11 (depends on 1)

The apparatus of claim 1 further comprising a second electrical path extending through the thermal transfer plate for transmitting an electrical signal to the substrate and die package.

### Claim 12 (depends on 1)

The apparatus of claim 1 wherein the at least one electrical path comprises a power via formed in a power delivery block.

### Claim 13 (depends on 1)

The apparatus of claim 1 further comprising an optical engine on the substrate and die package that transmits an optical signal through the at least one optical path.

### Claim 14 (depends on 13)

The apparatus of claim 13 wherein the at least one optical path comprises a waveguide for transmitting light through the thermal transfer plate and to or from the optical engine.

### Claim 15 (depends on 1)

The apparatus of claim 1 wherein at least one electrical connector and at least one optical connector are mounted on one side of the thermal transfer plate and the thermal transfer plate comprises a plurality of electrical paths and optical paths for transmitting power from the at least electrical connector and optical signals from the at least optical connector to the substrate and die package, wherein the substrate and die package comprises at least electronic integrated circuit and at least one photonic integrated circuit.

### Claim 16 (depends on 1)

The apparatus of claim 1 further comprising a second thermal transfer plate, the substrate and die package interposed between the thermal transfer plates.

### Claim 17 (depends on 16)

The apparatus of claim 16 wherein each of the thermal transfer plates comprises at least one electrical path and at least one optical path for transmitting power and an optical signal through the thermal transfer plate.

### Claim 18

An apparatus comprising:
a substrate and die package comprising at least one electronic integrated circuit and at least one photonic integrated circuit; and
a heat dissipation system for dissipating heat from the substrate and die package comprising:
a vapor chamber;
heat sink fins coupled to the vapor chamber; and
a microelectromechanical system (MEMS) module comprising a plurality of air movement cells operable to push air over the heat sink fins;
wherein the heat dissipation system comprises at least one electrical path for transmitting power or an electrical signal to the at least one electronic integrated circuit and at least one optical path for transmitting an optical signal to the at least one photonic integrated circuit, wherein the at least one electrical path extends through a first surface of the heat dissipation system to a second surface of the heat dissipation system, and wherein the at least one optical path extends through the substrate and die package, and extends from the first surface the heat dissipation system to the second surface of the heat dissipation system.

### Claim 19 (depends on 18)

The apparatus of claim 18 wherein the vapor chamber comprises a vapor chamber positioned in a thermal transfer plate and a heat pipe.

### Claim 20 (depends on 18)

The apparatus of claim 18 wherein the vapor chamber comprises a vapor chamber positioned in a thermal transfer plate and at least one heat transfer element coupled to the vapor chamber, wherein the heat sink fins are coupled to the at least one heat transfer element.

### Claim 21 (depends on 18)

The apparatus of claim 18 further comprising a second heat dissipation system, wherein the substrate and die package is interposed between the heat dissipation systems.

### Claim 22 (depends on 21)

The apparatus of claim 21 wherein said second heat dissipation system comprises a second electrical path for transmitting power or an electrical signal to the at least one electronic integrated circuit and a second optical path for transmitting an optical signal to the at least one photonic integrated circuit.

### Claim 23 (depends on 18)

The apparatus of claim 18 wherein the heat dissipation system is configured for receiving cooling airflow from a fan.

### Claim 24

An apparatus comprising:
a thermal transfer plate configured for dissipating heat from an electronic component or a photonic component associated with a substrate and die package;
a heat transfer element coupled to the thermal transfer plate; and
a microelectromechanical system (MEMS) module comprising a plurality of air movement cells operable to push air over the heat transfer element;
wherein the thermal transfer plate comprises at least one path for transmitting power to the electronic component, and at least one path for an optical signal to the photonic component, wherein the at least one path for transmitting power extends through a first surface of the thermal transfer plate to a second surface of the thermal transfer plate, and wherein the at least one path for the optical signal extends through the substrate and die package, and extends from the first surface of the thermal transfer plate to the second surface of the thermal transfer plate.

### Claim 25 (depends on 24)

The apparatus of claim 24 wherein the heat transfer element comprises a heat pipe.

### Claim 26 (depends on 24)

The apparatus of claim 24 wherein the heat transfer element comprises a graphene enhanced copper tube.

### Claim 27 (depends on 24)

The apparatus of claim 24 further comprising fins coupled to the heat transfer element.

### Claim 28 (depends on 24)

The apparatus of claim 24 wherein the thermal transfer plate is configured for dissipating heat from in-package optics comprising the electronic component and the photonic component.