# US 11,910,566 B1 · Processor heat exchanger with separate mounting structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,566 B1 - Document ID: US11910566B1 - Status: Granted - Kind: B1 - Application number: 17/206,023 - Filed: 2021-03-18 - Granted: 2024-02-20 - Earliest claimed: 2021-03-18 - Assignees: Amazon Technologies, Inc. - Applicants: Amazon Technologies, Inc. - Inventors: Luke Thomas Gregory; Darin Lee Frink; Rick Chun Kit Cheung; Nafea Bshara; Kenny Kiet Huynh; Noah Kelly; Priti Choudhary; Ali Elashri - Web page: https://patentgrep.com/patent/US11910566B1 ## CPC - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - H05K 7/20281: {Thermal management, e.g. liquid flow control} - H05K 7/20263: {Heat dissipaters releasing heat from coolant} - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 7/20772: {within server blades for removing heat from heat source} - H10W 40/10: Arrangements for heating - H10W 40/611: {Bolts or screws} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A commonly designed processor heat exchanger decouples the mounting hardware used to mount the heat exchanger to a processor from the heat exchanger itself. This allows a single heat exchanger design to be mounted to various different types of processors using processor customized mounting brackets that engage with flanges extending out from a body of the heat exchanger. ## Claims ### Claim 1 A method, comprising: providing a heat exchanger for removing heat from a selected processor or a selected processor package selected from a plurality of different types of processors or different processor packages, wherein the heat exchanger comprises: a surface configured to be positioned proximate to a surface of a package of the processor such that waste heat from the processor is conducted to the heat exchanger; a heat transfer portion configured to transfer at least a portion of the heat conducted to the heat exchanger from the processor to a cooling fluid in fluid communication with the heat exchanger; and mounting flanges extending out from respective sides of the heat exchanger, wherein the mounting flanges are configured to engage with a mounting structure for coupling the heat exchanger to the selected processor or the selected processor package; selecting the mounting structure for the heat exchanger from different mounting structures with which the mounting flanges of the heat exchanger are configured to engage, wherein: respective ones of the different mounting structures have different lengths, widths, or bolt patterns; the different types of processors or the different processor packages require different complementary mounting structures having the different lengths, widths, or bolt patterns to mount the heat exchanger to the different types of processors or the different processor packages, via a set of fasteners, wherein the heat exchanger is configured to be mounted on any of the different types of processors or the different processor packages via the different mounting structures with which the mounting flanges of the heat exchanger are configured to engage; and the mounting flanges of the heat exchanger comprise open corners and center openings configured to accommodate passage of respective fasteners of the set of fasteners laid out according to the different lengths, widths, or bolt patterns of the selected mounting structure; and coupling the heat exchanger with the selected processor or the selected processor package via the selected mounting structure that complements mounting hardware of the selected processor or the selected processor package. ### Claim 2 (depends on 1) The method of claim 1, wherein the heat transfer portion of the heat exchanger comprises: a convection cooled heat sink; or a liquid cooled cold plate. ### Claim 3 (depends on 1) The method of claim 1, wherein the mounting flanges extend out from respective first and second sides of the heat exchanger a distance such that the mounting flanges are configured to engage with the respective ones of the different mounting structures having different lengths, widths, or bolt patterns. ### Claim 4 (depends on 1) The method of claim 1, wherein the different types of processors or the different processor packages comprise processors designed or manufactured by different entities. ### Claim 5 (depends on 1) The method of claim 1, further comprising: adjusting a flow rate of the cooling fluid that removes heat from the heat exchanger such that the heat exchanger removes waste heat from the selected processor or the selected processor package at a rate corresponding to a rate at which the selected processor or the selected processor package generates waste heat. ### Claim 6 (depends on 1) The method of claim 1, further comprising: decoupling the heat exchanger from the selected processor or the selected processor package; removing the heat exchanger from the selected mounting structure; selecting another one of the mounting structures for the heat exchanger, wherein the selected other mounting structure complements mounting hardware of another selected processor or another selected processor package; and coupling the heat exchanger with the other selected processor or other selected processor package via the selected other mounting structure that complements the mounting hardware of the other selected processor or other selected processor package. ### Claim 7 A heat exchanger for removing waste heat from a selected processor or a selected processor package selected from a plurality of different types of processors or different processor packages, the heat exchanger comprising: a surface configured to be positioned proximate to a surface of a package of the selected processor or the selected processor package such that waste heat from the selected processor or the selected processor package is conducted to the heat exchanger; a heat transfer portion configured to transfer at least a portion of the heat conducted to the heat exchanger from the selected processor or the selected processor package to a cooling fluid in fluid communication with the heat exchanger; and mounting flanges extending out from respective sides of the heat exchanger; wherein: the heat exchanger is configured to be mounted on any of a plurality of the different types of processors or the different processor packages via different mounting structures with which the mounting flanges of the heat exchanger are configured to engage; respective ones of the different mounting structures have different lengths, widths, or bolt patterns; and the mounting flanges of the heat exchanger comprise open corners and center openings configured to accommodate passage of respective ones of a set of fasteners laid out according to the different lengths, widths, or bolt patterns. ### Claim 8 (depends on 7) The heat exchanger of claim 7, wherein the different types of processors or the different processor packages from which the heat exchanger is configured to remove waste heat comprise one or more of: a central processing unit (CPU): a graphics processing unit (GPU); an application specific integrated circuit (ASIC); or a field programmable gate array (FPGA). ### Claim 9 (depends on 7) The heat exchanger of claim 7, wherein the different types of processors or the different processor packages from which the heat exchanger is configured to remove waste heat comprise processors designed or manufactured by different entities. ### Claim 10 (depends on 7) The heat exchanger of claim 7, wherein the heat transfer portion comprises: fins; or pins, configured to transfer heat to air via convective heat transfer. ### Claim 11 (depends on 7) The heat exchanger of claim 7, wherein the heat transfer portion comprises: passages configured to flow a cooling fluid through the heat transfer portion to transfer heat from the heat transfer portion to the flowing cooling fluid. ### Claim 12 (depends on 11) The heat exchanger of claim 11, further comprising: hose or tube fittings configured to couple a hose or a tube to the heat transfer portion of the heat exchanger such that the cooling fluid flows into the heat transfer portion via the hose or tube and flows out of the heat transfer portion via another hose or tube. ### Claim 13 (depends on 7) The heat exchanger of claim 7, further comprising: an anti-tilt pin configured to slide into an anti-tilt hole of a respective one of the different mounting structures that is being used to mount the heat exchanger to the selected processor or the selected processor package. ### Claim 14 A mounting assembly for mounting a heat exchanger to a processor, the mounting assembly comprising: a mounting bracket configured to accept the heat exchanger positioned within an opening in the mounting bracket, wherein the mounting bracket is further configured to engage flanges of at least four respective sides of the heat exchanger when the heat exchanger is positioned in the opening of the mounting bracket; fastener passages in the mounting bracket configured to accept fasteners that couple the mounting bracket to mounting hardware for the processor, wherein the fasteners, when coupled to the mounting hardware for the processor, cause the mounting bracket to exert a compressive force on the flanges of the heat exchanger; and an anti-tilt hole in the mounting bracket configured to accept insertion of an anti-tilt pin mounted at a first end on a given one of the flanges of the heat exchanger and extending up from the given flange, wherein the anti-tilt pin, when inserted in the anti-tilt hole, restricts rotation of the mounting bracket relative to the heat exchanger; wherein the fastener passages in the mounting bracket are positioned and sized to complement a corresponding fastener layout of the mounting hardware for the processor. ### Claim 15 (depends on 14) The mounting assembly of claim 14, wherein the mounting bracket further comprises: an additional anti-tilt hole configured to accept an additional anti-tilt pin extending up from a given one of the flanges of the heat exchanger; or an anti-tilt pin extending down from the mounting bracket and configured to fit into an anti-tilt hole in a given one of the flanges of the heat exchanger. ### Claim 16 (depends on 14) The mounting assembly of claim 14, further comprising: the fasteners, wherein the fasteners comprise screws or push pins. ### Claim 17 (depends on 16) The mounting assembly of claim 16, wherein the fasteners and an arrangement of the fastener passages in the mounting bracket are configured to: match corresponding bolt holes in the mounting hardware for the processor. ### Claim 18 (depends on 17) The mounting assembly of claim 17, wherein the fasteners are spring screws that exert a compressive force that corresponds to a fastener force requirement of the mounting hardware for the processor. ### Claim 19 (depends on 14) The mounting assembly of claim 14, wherein: the mounting hardware for the processor is coupled to a printed circuit board; the processor couples into a socket of the mounting hardware; and the compressive force exerted on the flanges of the heat exchanger by the mounting bracket causes the heat exchanger to exert a compressive force pushing down on the processor in the socket. ### Claim 20 (depends on 14) The mounting assembly of claim 14, wherein the mounting bracket comprises: a first “C” shaped section; a second “C” shaped section; and a set of fasteners configured to couple the first and second “C” shaped section together to surround the heat exchanger. ### Claim 21 (depends on 14) The mounting assembly of claim 14, further comprising: the heat exchanger positioned within the opening of the mounting bracket; and the fasteners positioned in the fastener passages, wherein the mounting assembly is configured to mount the heat exchanger to the processor via coupling the fasteners to the mounting hardware for the processor.