# US 11,910,564 B2 · Liquid cooling device and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,564 B2 - Document ID: US11910564B2 - Status: Granted - Kind: B2 - Application number: 17/398,737 - Filed: 2021-08-10 - Published: 2022-03-03 - Granted: 2024-02-20 - Earliest claimed: 2020-08-27 - Assignees: Cooler Master Co., Ltd. - Applicants: Cooler Master Co., Ltd. - Inventors: Wei-Pin Lin; Zhong-Long Zhu; Yi-Cheng Chen - Web page: https://patentgrep.com/patent/US11910564B2 ## CPC - H05K 7/20263: {Heat dissipaters releasing heat from coolant} - F28D 1/035: {with U-flow or serpentine-flow inside the conduits (F28D1/0341 takes precedence)} - F28F 3/08: Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning - F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - H05K 7/20309: {Evaporators} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H10W 40/47: by flowing liquids, e.g. forced water cooling - F28D 2021/0029: {Heat sinks} - F28F 2255/00: Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A liquid cooling device includes a thermally conductive base, a cover, and a metallic partition. The thermally conductive base has a fluid chamber and a plurality of fins. The fins are located in the fluid chamber and protrudes from an inner surface of the thermally conductive base facing the fluid chamber. Every two of the fins located adjacent to each other define a channel therebetween. Distal ends of at least part of the fins located away from the inner surface together form a covering structure partially coving the channels. The metallic partition is located between and welded to the covering structure and the cover. ## Claims ### Claim 1 A liquid cooling device, comprising: a thermally conductive base, having a fluid chamber and a plurality of fins, wherein the plurality of fins are located in the fluid chamber and protrudes from an inner surface of the thermally conductive base facing the fluid chamber, every two of the plurality of fins located adjacent to each other define a channel therebetween, distal ends of at least adjacent three of the plurality of fins located away from the inner surface together form a covering structure integrally formed as one piece with the at least adjacent three of the plurality of fins, and the covering structure partially covers the channel and extends between the at least adjacent three of the plurality of fins, the covering structure has an opening in fluid communication with the channel; a cover, having an inlet and an outlet, wherein the cover is mounted on the thermally conductive base and covers the fluid chamber, and the inlet is in fluid communication with the outlet via the fluid chamber; and a metallic partition, located between and welded to the covering structure and the cover. ### Claim 2 (depends on 1) The liquid cooling device according to claim 1, wherein the plurality of fins are formed by skiving process. ### Claim 3 (depends on 1) The liquid cooling device according to claim 1, wherein the metallic partition has a first through hole, the first through hole is in fluid communication with the channel via the opening, and the inlet is in fluid communication with the outlet via the first through hole, the opening, and the channel in the fluid chamber. ### Claim 4 (depends on 1) The liquid cooling device according to claim 1, wherein the thermally conductive base has a contact surface facing away from the inner surface. ### Claim 5 A manufacturing method of a liquid cooling device, comprising: forming a plurality of fins on a thermally conductive base; forming a covering structure integrally formed as one piece with the plurality of fins on ends of the plurality of fins, wherein the covering structure partially covers a plurality of channels between the plurality of fins, and the covering structure extends between at least three of the plurality of fins which are adjacent, the covering structure has an opening in fluid communication with the plurality of channels; and welding a metallic partition on the covering structure. ### Claim 6 (depends on 5) The manufacturing method according to claim 5, further comprising welding a cover on a surface of the metallic partition facing away from the covering structure. ### Claim 7 (depends on 5) The manufacturing method according to claim 5, wherein the plurality of fins are formed by skiving process. ### Claim 8 (depends on 5) The manufacturing method according to claim 5, wherein the step of forming the covering structure on the ends of the plurality of fins comprises compressing the ends of the plurality of fins to form the covering structure.