# US 11,910,562 B2 · Localized thermal accelerator in an immersion environment > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,562 B2 - Document ID: US11910562B2 - Status: Granted - Kind: B2 - Application number: 17/557,672 - Filed: 2021-12-21 - Published: 2023-06-22 - Granted: 2024-02-20 - Earliest claimed: 2021-12-21 - Assignees: Baidu USA LLC - Applicants: Baidu USA LLC - Inventors: Tianyi Gao - Web page: https://patentgrep.com/patent/US11910562B2 ## CPC - H05K 7/20236: {by immersion} - H05K 7/20263: {Heat dissipaters releasing heat from coolant} - H05K 7/20309: {Evaporators} - H05K 7/20327: {Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds} - H05K 7/20781: {within cabinets for removing heat from server blades} - H05K 7/20809: {within server blades for removing heat from heat source} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A cooling plate includes a fluid inlet port, a cooling enclosure, and an inlet channel coupled between the fluid inlet port and the cooling enclosure to channel a two-phase fluid entering from the inlet port to the cooling enclosure. The cooling enclosure includes a number of heat spreading structures coupled to an inner surface of the cooling enclosure to form spacings, where the two-phase fluid in contact with the heat spreading structures causes portions of the two-phase fluid to change into a vapor phase. The cooling plate includes an extended vapor channel coupled to the cooling enclosure to collect the two-phase fluid in vapor phase. The cooling plate includes a vapor outlet port coupled to the extended vapor channel for the two-phase fluid in vapor phase to exit the vapor outlet port, where the cooling plate is submersible in an immersion tank containing a single-phase immersion fluid. ## Claims ### Claim 1 A cooling plate, comprising: a fluid inlet port coupled to at least one inlet extensible line to receive a two-phase fluid from at least one server inlet port; a cooling enclosure thermally coupled to server electronics for cooling acceleration; an inlet channel coupled between the fluid inlet port and the cooling enclosure to channel the two-phase fluid entering from the fluid inlet port to the cooling enclosure, wherein the cooling enclosure is surrounded by a single-phase fluid, the cooling enclosure comprising: a plurality of heat spreading structures coupled to an inner surface of the cooling enclosure to form a plurality of spacings between the plurality of heat spreading structures, wherein the plurality of spacings increase a surface contact area of the two-phase fluid containable within the cooling enclosure with the plurality of heat spreading structures to distribute heat from the plurality of heat spreading structures to the two-phase fluid to cause at least a portion of the two-phase fluid to change into a vapor phase; an extended vapor channel coupled to the cooling enclosure to collect the two-phase fluid in vapor phase; and a vapor outlet port coupled between the extended vapor channel and at least one outlet extensible line to return the two-phase fluid in vapor phase from the extended vapor channel to at least one server outlet port to exit the cooling plate. ### Claim 2 (depends on 1) The cooling plate of claim 1, wherein the spacings between the heat spreading structures form fluid channels along a longitudinal direction of the heat spreading structures. ### Claim 3 (depends on 1) The cooling plate of claim 1, wherein the cooling enclosure includes an internal region to contain the two-phase fluid and the cooling enclosure separates the single-phase fluid surrounding the cooling enclosure from the two-phase fluid contained therein when the cooling plate is submerged into the single-phase fluid. ### Claim 4 (depends on 1) The cooling plate of claim 1, wherein the fluid inlet port is connected to a two-phase liquid supply and the vapor outlet port is connected to a vapor return connectors of an immersion tank when the cooling plate is submerged into the immersion tank. ### Claim 5 (depends on 1) The cooling plate of claim 1, wherein the extended vapor channel includes an intermediate holding region for the two-phase fluid in vapor phase prior to transporting the two-phase fluid in vapor phase to the vapor outlet port. ### Claim 6 (depends on 5) The cooling plate of claim 5, wherein the extended vapor channel is submersible within the single-phase fluid to exchange heat between the single-phase fluid and the two-phase fluid in vapor phase contained within the extended vapor channel to condense at least a portion of the two-phase fluid in vapor phase back to a liquid phase, wherein the two-phase fluid in liquid phase returns directly to an internal region of the cooling enclosure. ### Claim 7 (depends on 1) The cooling plate of claim 1, wherein the cooling plate is submersible in an immersion tank containing the single-phase fluid, wherein a fluid flow of the single-phase fluid is separated from a fluid flow of the two-phase fluid within an internal region of the cooling enclosure. ### Claim 8 (depends on 1) The cooling plate of claim 1, wherein the plurality of heat spreading structures are assembled or directly molded on the cooling enclosure. ### Claim 9 (depends on 1) The cooling plate of claim 1, wherein a surface of the cooling enclosure interfaces with a chip to provide two-phase thermal cooling to the chip. ### Claim 10 (depends on 1) The cooling plate of claim 1, wherein the vapor outlet port is coupled to the extended vapor channel via a first flexible hose and the fluid inlet port is coupled to the inlet channel via a second flexible hose. ### Claim 11 A server configuration, comprising: a server enclosure having server electronics housed within; at least one server inlet port; at least one server outlet port; at least one inlet extensible line coupled to the at least one server inlet port; at least one outlet extensible line coupled to the at least one server outlet port; and a cooling plate, comprising: a fluid inlet port coupled to the at least one inlet extensible line to receive a two-phase fluid from the at least one server inlet port; a cooling enclosure thermally coupled to portions of the server electronics for cooling acceleration; an inlet channel coupled between the fluid inlet port and the cooling enclosure to channel the two-phase fluid entering from the fluid inlet port to the cooling enclosure, the cooling enclosure comprising: a plurality of heat spreading structures coupled to an inner surface of the cooling enclosure to form a plurality of spacings between the plurality of heat spreading structures, wherein the plurality of spacings increase a surface contact area of the two-phase fluid containable within the cooling enclosure with the plurality of heat spreading structures to distribute heat from the plurality of heat spreading structures to the two-phase fluid to cause at least a portion of the two-phase fluid to change into a vapor phase; an extended vapor channel coupled to the cooling enclosure to collect the two-phase fluid in vapor phase; and a vapor outlet port coupled between the extended vapor channel and the at least one outlet extensible line to return the two-phase fluid in vapor phase from the extended vapor channel to the at least one server outlet port, wherein the cooling plate is submersible in an immersion tank containing a single-phase fluid. ### Claim 12 (depends on 11) The server configuration of claim 11, wherein the cooling enclosure includes an internal region to contain the two-phase fluid and the cooling enclosure separates the single-phase fluid surrounding the cooling enclosure from the two-phase fluid contained therein. ### Claim 13 (depends on 12) The server configuration of claim 12, wherein the extended vapor channel includes an intermediate holding region for the two-phase fluid in vapor phase prior to transporting the two-phase fluid in vapor phase to the vapor outlet port. ### Claim 14 (depends on 12) The server configuration of claim 12, wherein the extended vapor channel is submersible within the single-phase fluid to exchange heat between the single-phase fluid and the two-phase fluid in vapor phase contained within the extended vapor channel to condense at least a portion of the two-phase fluid in vapor phase to liquid phase, wherein the two-phase fluid in liquid phase returns directly to the internal region of the cooling enclosure. ### Claim 15 (depends on 11) The server configuration of claim 11, wherein the spacings between the heat spreading structures form fluid channels along a longitudinal direction of the heat spreading structures. ### Claim 16 (depends on 11) The server configuration of claim 11, wherein the fluid inlet port is connected to a two-phase liquid supply and the vapor outlet port is connected to a vapor return connectors of the immersion tank when the cooling plate is submerged into the immersion tank. ### Claim 17 (depends on 11) The server configuration of claim 11, wherein the cooling plate is submersible in the immersion tank containing the single-phase fluid, wherein a fluid flow of the single-phase fluid is separated from a fluid flow of the two-phase fluid within an internal region of the cooling enclosure. ### Claim 18 (depends on 11) The server configuration of claim 11, wherein the plurality of heat spreading structures are assembled or directly molded on the cooling enclosure. ### Claim 19 (depends on 11) The server configuration of claim 11, wherein a surface of the cooling enclosure interfaces with a chip to provide two-phase thermal cooling to the chip. ### Claim 20 (depends on 11) The server configuration of claim 11, wherein the vapor outlet port is coupled to the extended vapor channel via a first flexible hose and the fluid inlet port is coupled to the inlet channel via a second flexible hose.