# US 11,910,557 B2 · Transportable datacenter > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,557 B2 - Document ID: US11910557B2 - Status: Granted - Kind: B2 - Application number: 16/791,528 - Filed: 2020-02-14 - Published: 2021-01-14 - Granted: 2024-02-20 - Earliest claimed: 2019-02-15 - Assignees: Digital Shovel Holdings Inc. - Applicants: Scot Arthur Johnson - Inventors: Scot Arthur Johnson - Web page: https://patentgrep.com/patent/US11910557B2 ## CPC - H05K 7/1492: {having electrical distribution arrangements, e.g. power supply or data communications} - F24F 7/013: using wall or window fans, displacing air through the wall or window - G06F 1/181: {Enclosures (for portable computers G06F1/1613)} - G06F 1/20: Cooling means - H05K 7/1497: {Rooms for data centers; Shipping containers therefor} - H05K 7/20145: {Means for directing air flow, e.g. ducts, deflectors, plenum or guides} - H05K 7/20172: {Fan mounting or fan specifications} - H05K 7/20718: {Forced ventilation of a gaseous coolant (in closed loop H05K7/20754)} - H05K 7/20736: {within cabinets for removing heat from server blades} - H05K 7/20745: {within rooms for removing heat from cabinets, e.g. by air conditioning device} - H05K 7/20836: {Thermal management, e.g. server temperature control} - F24F 2221/12: transportable - H05K 7/20209: {Thermal management, e.g. fan control} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F24F: AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING (removing dirt or fumes from areas where they are produced B08B15/00; vertical ducts for carrying away waste gases from buildings E04F17/02; tops for chimneys or ventilating shafts, terminals for flues F23L17/02) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment. ## Claims ### Claim 1 A method of assembling a transportable datacenter, including: providing a housing, wherein the housing includes: one or more air intake openings for receiving air from an external environment, the one or more air intake openings on a first sidewall; and one or more air exhaust openings for exhausting air to the external environment, the one or more air exhaust openings are on a second sidewall opposing the first sidewall, installing a plurality of racks in the transportable datacenter, each rack having a plurality of processor bays for receiving a plurality of processor devices, each processor bay in the plurality of processor bays having a front face and a rear face, wherein at least some of the racks are arranged in pairs, and the pairs include a first pair having a first rack and a second rack; arranging the racks in at least some of the pairs of racks in a v-shaped configuration in a horizontal direction to reduce turbulence in the air flow through pairs of racks arranged in the v-shaped configuration; installing a ventilation system that generates an air flow progressively through the one or more air intake openings, a cold air plenum, the processor bays, one or more hot air plenum and the one or more air exhaust openings; and wherein each of the plurality of racks comprises a plurality of shelves, each shelf in the plurality of shelves having at least two horizontally arranged processor bays in the plurality of processor bays, wherein the front faces of the processor bays are adjacent the cold air plenum and the rear faces of the processor bays are adjacent the one or more hot air plenums, the cold air plenum between the one or more air intake openings and the front faces of the plurality of processor bays, each of the one or more hot air plenums between the rear faces of the processor bays and the air exhaust opening. ### Claim 2 (depends on 1) The method of claim 1 wherein the one or more air exhaust openings are on a roof. ### Claim 3 (depends on 1) The method of claim 1 wherein the one or more air intake openings are on a roof. ### Claim 4 (depends on 3) The method of claim 3 wherein the one or more air exhaust openings are on a second sidewall. ### Claim 5 (depends on 3) The method of claim 3 wherein the one or more air exhaust openings are on the roof. ### Claim 6 (depends on 5) The method of claim 5 wherein one or more hot air mixing fans blow air through an at least one air exhaust opening into an at least one intake opening through ducting. ### Claim 7 (depends on 1) The method of claim 1 wherein the ventilation system includes one or more exhaust fans mounted in at least some of the one or more air exhaust openings. ### Claim 8 (depends on 7) The method of claim 7 wherein the one or more exhaust fans are on an outside of the transportable datacenter. ### Claim 9 (depends on 8) The method of claim 8 wherein the ventilation system includes one or more intake fans mounted in at least some of the one or more air intake openings. ### Claim 10 (depends on 9) The method of claim 9 wherein the one or more intake fans are on an outside of the transportable datacenter. ### Claim 11 (depends on 10) The method of claim 10, further comprising: installing one or more processors; wherein the ventilation system includes one or more processor intake cooling fans mounted to the front faces of the at least one processor of the one or more processors, adjacent the cold air plenum. ### Claim 12 (depends on 11) The method of claim 11 wherein the ventilation system includes one or more processor exhaust cooling fans mounted to the rear faces of at least one processor of the one or more processors, adjacent a hot air plenum in the one or more hot air plenums. ### Claim 13 (depends on 12) The method of claim 12 wherein at least two of the racks in the plurality of racks are arranged into one or more pairs of racks, with the rear faces of the processor bays in each rack in the pair adjacent to a same hot air plenum in the one or more hot air plenums. ### Claim 14 (depends on 13) The method of claim 13 wherein the processor bays have an exhaust flap. ### Claim 15 (depends on 14) The method of claim 14 wherein the processor bays are arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter. ### Claim 16 (depends on 1) The method of claim 1 wherein the housing is a transportable shipping container. ### Claim 17 (depends on 16) The method of claim 16 wherein the transport system includes mounts for mounting the housing on a transport platform or to allow the transportable datacenter to be stacked on top of another transportable datacenter. ### Claim 18 (depends on 1) The method of claim 1 further comprising: installing an electric power system for providing electric power to each of the processor bays, the electric power system including: an electrical power supply; and a power cable assembly including a plurality of power cables, each power cable connecting the electrical power supply and a corresponding processor bay in the first pair. ### Claim 19 (depends on 18) The method of claim 18 further comprising installing a plurality of switches, each switch coupled to a corresponding power cable in the plurality of power cables to selectively enable and disable a supply of electric power to the corresponding processor bay in the first pair. ### Claim 20 (depends on 1) The method of claim 1 further comprising a data network providing network connectivity between an external data communication network and each of the processor bays.