# US 11,910,544 B2 · Assembly of printed circuit board with overmolded epoxy to baseplate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,544 B2 - Document ID: US11910544B2 - Status: Granted - Kind: B2 - Application number: 17/661,652 - Filed: 2022-05-02 - Published: 2023-11-02 - Granted: 2024-02-20 - Earliest claimed: 2022-05-02 - Assignees: Vitesco Technologies USA, LLC - Applicants: Vitesco Technologies USA, LLC - Inventors: Uwe Stephan; Donald J. Zito - Web page: https://patentgrep.com/patent/US11910544B2 ## CPC - H05K 5/0034: {having an overmolded housing covering the PCB} - H05K 5/0082: {specially adapted for transmission control units, e.g. gearbox controllers} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A control unit having a connection structure for connecting components of the control unit to a base plate which eliminates the need for separate fasteners. The control unit includes circuitry mounted to a PCB, and the PCB is pre-assembled to a base plate, to form a pre-assembly. During assembly, the PCB and the base plate are aligned when placed in a tooling device which clamps and holds the pre-assembly in place during the over molding process. The circuitry is over molded with an epoxy material, such that the epoxy material flows from a top side of the PCB to underneath the base plate, and the PCB is fixed to the base plate without the use of fasteners such as screws, or adhesive materials. ## Claims ### Claim 1 An apparatus, comprising: a control unit, including: a base plate; a printed circuit board (PCB) connected to the base plate; circuitry mounted to the PCB; at least one flow aperture integrally formed as part of the base plate; and an encapsulation housing including: an epoxy overmolded around portions of the base plate, portions of the circuitry, and portions of the PCB, a first layer disposed on a side of the PCB, and a second layer disposed on a side of the base plate, the first layer and the second layer are connected together and connect the PCB to the base plate; wherein the base plate and the PCB are connected together by the encapsulation housing, and wherein at least a portion of the encapsulation housing is disposed in the at least one flow aperture, in between the first layer and the second layer. ### Claim 2 (depends on 1) The apparatus of claim 1, further comprising: at least one recess formed as part of the second layer of the encapsulation housing; wherein a portion of the base plate is adjacent the at least one recess. ### Claim 3 (depends on 1) The apparatus of claim 1, further comprising: a first plurality of assembly apertures integrally formed as part of the PCB; and a second plurality of assembly apertures integrally formed as part of the base plate; wherein each of the first plurality of assembly apertures is aligned with a corresponding one of the second plurality of assembly apertures, and a portion of the encapsulation housing extends through each of the first plurality of assembly apertures and the second plurality of assembly apertures. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein at least a portion of the circuitry is covered by the encapsulation housing. ### Claim 5 (depends on 1) The apparatus of claim 1, further comprising: a connector shroud mounted to the PCB in an area of the PCB unoccupied by the encapsulation housing; and at least one circumferential flange being part of the connector shroud and in contact with the PCB; wherein the at least one circumferential flange is disposed between a portion of the encapsulation housing and the PCB, securing the connector shroud to the PCB. ### Claim 6 (depends on 1) The apparatus of claim 1, further comprising: a cover integrally formed as part of the base plate; and a cavity integrally formed as part of the cover; wherein a portion of the encapsulation housing is adjacent the cover, and the cover is adjacent the PCB in an area of the PCB unoccupied by the encapsulation housing. ### Claim 7 (depends on 6) The apparatus of claim 6, further comprising: a circumferential lip integrally formed as part of the base plate such that the circumferential lip circumscribes the cover; wherein a portion of the encapsulation housing is adjacent the circumferential lip. ### Claim 8 (depends on 1) The apparatus of claim 1, further comprising: at least one groove integrally formed as part of the encapsulation housing; wherein a portion of the base plate is disposed in the at least one groove, connecting the base plate and the encapsulation housing. ### Claim 9 A method for making a control unit, comprising the steps of: providing a base plate; providing a printed circuit board (PCB); and providing circuitry mounted to the PCB; providing a connector shroud; providing at least one circumferential flange being part of the connector shroud; placing the PCB in contact with the base plate; overmolding an epoxy around portions of the base plate, portions of the circuitry, and portions of the PCB to form an encapsulation housing which connects the base plate to the PCB; mounting the connector shroud to the PCB in an area unoccupied by the encapsulation housing such that the at least one circumferential flange is in contact with the PCB, and a portion of the circuitry is surrounded by the connector shroud; and over molding the epoxy is around portions of the base plate and the PCB such that the at least one circumferential flange is disposed between a portion of the encapsulation housing and the PCB, securing the connector shroud to the PCB. ### Claim 10 (depends on 9) The method of claim 9, further comprising the steps of overmolding the epoxy around portions of the base plate and the PCB such that a first layer of the encapsulation housing is disposed on a side of the PCB, and a second layer of the encapsulation housing is disposed on a side of the base plate. ### Claim 11 (depends on 10) The method of claim 10, further comprising the steps of: providing at least one flow aperture integrally formed as part of the base plate; overmolding the epoxy around portions of the base plate and the PCB such that at least a portion of the encapsulation housing is disposed in the at least one flow aperture, in between the first layer and the second layer. ### Claim 12 (depends on 11) The method of claim 11, further comprising the steps of providing at least one recess formed as part of the second layer of the encapsulation housing when the epoxy is overmolded around portions of the base plate and the PCB, such that a portion of the base plate is adjacent the at least one recess. ### Claim 13 (depends on 9) The method of claim 9, further comprising the steps of: providing a first plurality of assembly apertures integrally formed as part of the PCB; and providing a second plurality of assembly apertures integrally formed as part of the base plate; aligning each of the first plurality of assembly apertures with a corresponding one of the second plurality of assembly apertures as the PCB is placed in contact with the base plate, such that a portion of the encapsulation housing extends through each of the first plurality of assembly apertures and the second plurality of assembly apertures once the epoxy is overmoled around portions of the base plate and the PCB. ### Claim 14 (depends on 9) The method of claim 9, further comprising the steps of: providing a cover integrally formed as part of the base plate; and providing a cavity integrally formed as part of the cover, such that a portion of the encapsulation housing is adjacent the cover as the epoxy is overmolded around portions of the base plate and the PCB. ### Claim 15 (depends on 9) The method of claim 9, further comprising the steps of: providing at least one groove integrally formed as part of the encapsulation housing; overmolding the epoxy around portions of the base plate and the PCB to form the encapsulation housing such that a portion of the base plate is disposed in the at least one groove.