# US 11,910,536 B2 · Direct-ink-writing method for printing strain gauge array circuit based on insulating strips

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- Number: US 11,910,536 B2
- Document ID: US11910536B2
- Status: Granted
- Kind: B2
- Application number: 17/702,199
- Filed: 2022-03-23
- Published: 2022-07-07
- Granted: 2024-02-20
- Earliest claimed: 2021-11-04
- Assignees: Jiangnan University
- Applicants: Jiangnan University
- Inventors: Peishi Yu; Junhua Zhao; Lixin Qi; Zhiyang Guo; Yu Liu
- Web page: https://patentgrep.com/patent/US11910536B2

## CPC

- H05K 3/125: {by ink-jet printing}
- H05K 3/4664: {Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K3/4647 takes precedence)}
- G01L 1/2287: {constructional details of the strain gauges (adjustable resistors H01C10/00)}
- B33Y 10/00: Processes of additive manufacturing
- H05K 1/167: {incorporating printed resistors}
- H05K 3/1241: {by ink-jet printing or drawing by dispensing}
- H05K 2201/0323: Carbon
- H05K 2201/10151: Sensor
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING

## Abstract

In a direct-ink-writing (DIW) method for printing a strain gauge array circuit, several insulating strips are printed on the upper layer of the first circuit layer after the first circuit layer has been printed and cured, and the second circuit layer is then printed at the insulating strips. The functional layer of a strain gauge is printed and covered thereon without contacting the insulating strips; the head and tail electrodes of the functional layer are respectively connected to two layers of circuit layers; and finally, a layer of insulating material is printed for encapsulation. DIW is used to complete the whole printing. A new insulating method is used in a cross part of two silver lines of a row-column compound circuit. The local glue dispensing is changed to printing the insulating strips in routing regions, and ensures the strain transmission efficiency from the strain gauge substrate to the functional layer.

## Claims

### Claim 1

A direct-ink-writing (DIW) method for printing a strain gauge array circuit based on insulating strips, the method comprising:
forming a first insulating layer by DIW printing on a planar substrate using an insulating material;
forming m parallel spaced first silver lines by DIW printing on the insulating layer using conductive silver paste to form a first circuit layer, wherein one end of each first silver line comprises an electrode lead-out end;
forming n parallel spaced insulating strips by DIW printing on the first circuit layer using an insulating material to form a second insulating layer, wherein the insulating strips are perpendicular to the first silver lines and continuously cover m first silver lines in a region where the insulating strips are located, and the first silver lines in a region between two adjacent insulating strips are exposed with respect to the second insulating layer;
respectively printing a second silver line at each insulating strip of the second insulating layer using the conductive silver paste to form a second circuit layer, wherein each second silver line respectively comprises a main line and m branches connected thereto, and each second silver line is respectively spaced apart; a main line of each second silver line is respectively located on the corresponding insulating strip, is perpendicular to the first silver line, and has one end comprising an electrode lead-out end; a part of each branch of the second silver line is located on the corresponding insulating strip, and the other part of each branch is outside the insulating strip and located on the first insulating layer;
forming m*n strain gauge head electrodes, m*n strain gauge tail electrodes, and m*n connecting wires by DIW printing using conductive carbon paste to form a functional layer, wherein one strain gauge head electrode is respectively printed at a region of each first silver line that is exposed between two adjacent insulating strips and a region that is exposed between the electrode lead-out end and the adjacent insulating strip; one strain gauge tail electrode is respectively printed at the tail end of each branch of each second silver line on the second circuit layer; each strain gauge head electrode corresponds to one strain gauge tail electrode and is connected to the strain gauge tail electrode through a connecting wire;
printing and forming a third insulating layer using an insulating material to complete encapsulation, wherein the third insulating layer covers other regions except the electrode lead-out ends of the first circuit layer, the electrode lead-out ends of the second circuit layer, and the strain gauge head electrodes and the strain gauge tail electrodes on the functional layer.

### Claim 2 (depends on 1)

The method according to claim 1, wherein each strain gauge head electrode, each strain gauge tail electrode and each connecting wire used for forming the functional layer are printed on the first insulating layer and do not contact the insulating strips.

### Claim 3 (depends on 1)

The method according to claim 1, wherein when the second circuit layer is printed, the same branch of the same second silver line is DIW printed twice.