# US 11,910,535 B2 · Printed circuit board stack structure and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,535 B2 - Document ID: US11910535B2 - Status: Granted - Kind: B2 - Application number: 17/685,404 - Filed: 2022-03-03 - Published: 2023-07-27 - Granted: 2024-02-20 - Earliest claimed: 2022-01-24 - Assignees: Unimicron Technology Corp. - Applicants: Unimicron Technology Corp. - Inventors: Ming-Hao Wu; Shih-Lian Cheng - Web page: https://patentgrep.com/patent/US11910535B2 ## CPC - H05K 3/0094: {Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement} - H05K 3/4694: {Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density (H05K3/4691 takes precedence)} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 1/181: associated with surface mounted components - H05K 3/4623: {the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence)} - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2201/09909: Special local insulating pattern, e.g. as dam around component - H05K 2203/0169: Using a temporary frame during processing - H05K 2203/061: of previously made multilayered subassemblies - H05K 2203/167: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A printed circuit board stack structure includes a first printed circuit board, a second printed circuit board, and a filling glue layer. The first printed circuit board has at least one overflow groove, and includes first pads and a retaining wall surrounding the first pads. The second printed circuit board is disposed on the first printed circuit board, and includes second pads and conductive pillars located on some of the second pads. The conductive pillars are respectively connected to some of the first pads to electrically connect the second printed circuit board to the first printed circuit board. The filling glue layer fills between the first and the second printed circuit boards, and covers the first pads, the second pads, and the conductive pillars. The retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the overflow groove. ## Claims ### Claim 1 A printed circuit board stack structure, comprising: a first printed circuit board having a first surface and a second surface opposite to each other and at least one overflow groove extending from the first surface toward the second surface, and comprising a plurality of first pads located on the first surface and a retaining wall surrounding the first pads; a second printed circuit board disposed on the first printed circuit board, and comprising a plurality of second pads and a plurality of conductive pillars located on some of the second pads, wherein the conductive pillars are respectively connected to some of the first pads so that the second printed circuit board is electrically connected to the first printed circuit board; and a filling glue layer filled between the first printed circuit board and the second printed circuit board and covering the first pads, the second pads, and the conductive pillars, wherein the retaining wall blocks the filling glue layer so that a portion of the filling glue layer is accommodated in the at least one overflow groove; wherein a size of the first printed circuit board is larger than a size of the second printed circuit board, the second printed circuit board has a first density circuit area and a second density circuit area, and a wiring density in the first density circuit area is greater than a wiring density in the second density circuit area; and wherein the at least one overflow groove is one overflow groove, the retaining wall comprises a first retaining wall and a second retaining wall, a first height of the first retaining wall is greater than a second height of the second retaining wall, the first retaining wall surrounds the first pads, the second retaining wall, and the overflow groove, the first density circuit area is relatively close to the overflow groove and the second density circuit area is relatively close to the second retaining wall, and the overflow groove, the first retaining wall, and the second retaining wall restrict the filling glue layer so that the filling glue layer is located inside the first retaining wall. ### Claim 2 (depends on 1) The printed circuit board stack structure according to claim 1, wherein the first printed circuit board further comprises a plurality of third pads, a plurality of fourth pads, and a plurality of conductive members, the third pads are located on the first surface and surround the retaining wall, the fourth pads are located on the second surface, and the third pads are electrically connected to the fourth pads through the conductive members. ### Claim 3 (depends on 2) The printed circuit board stack structure according to claim 2, wherein the first printed circuit board further comprises a first solder resist layer, a second solder resist layer, a first surface treatment layer, and a second surface treatment layer, the first solder resist layer is located on the first surface and has a plurality of first solder resist openings, the first solder resist openings expose the first pads and some of the third pads, the second solder resist layer is located on the second surface and has a plurality of second solder resist openings, the second solder resist openings expose some of the fourth pads, the first surface treatment layer is located on the fourth pads exposed by the second solder resist openings, and the second surface treatment layer is located on the third pads exposed by the first solder resist openings. ### Claim 4 (depends on 3) The printed circuit board stack structure according to claim 3, wherein the retaining wall is located on the first solder resist layer, and a material of the retaining wall is the same as a material of the first solder resist layer. ### Claim 5 (depends on 1) The printed circuit board stack structure according to claim 1, wherein the second printed circuit board has a third surface and a fourth surface opposite to each other, and comprises a plurality of fifth pads and a plurality of conductive members, the second pads are located on the third surface, the fifth pads are located on the fourth surface, and the second pads are electrically connected to the fifth pads through the conductive members. ### Claim 6 (depends on 5) The printed circuit board stack structure according to claim 5, wherein the second printed circuit board further comprises a solder resist layer and a surface treatment layer, the solder resist layer is located on the fourth surface and has a plurality of solder resist openings, the solder resist openings expose some of the fifth pads, and the surface treatment layer is located on the fifth pads exposed by the solder resist openings.