# US 11,910,533 B2 · Profiled thermode

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- Number: US 11,910,533 B2
- Document ID: US11910533B2
- Status: Granted
- Kind: B2
- Application number: 17/269,626
- Filed: 2019-07-30
- Published: 2021-09-30
- Granted: 2024-02-20
- Earliest claimed: 2018-08-22
- Assignees: Pragmatic Printing Ltd.
- Applicants: Pragmatic Printing Ltd.
- Inventors: Neil Davies; Stephen Devenport; Richard Price
- Web page: https://patentgrep.com/patent/US11910533B2

## CPC

- H05K 13/0469: {by applying a glue or viscous material}
- B23K 1/0016: {Soldering of electronic components}
- H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions}
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H05K 2203/0195: Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/07188: {Apparatus chuck}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/30: Die-attach connectors
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The invention relates to a thermode for connecting at least two components, comprising a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of the at least two components; and a support portion having at least one supporting surface portion configured to support a further component (being the other of the at least two components, wherein the contact surface portions and the supporting surface portion are configured to receive the at least two components between them and wherein one or both of the contact surface portions and the supporting surface portion are moveable relative to and towards one another to exert heat and/or pressure on the at least two components located between the contact surface portions and the supporting portion.

## Claims

### Claim 1

A method to connect a flexible chip and an application circuit using conductive adhesive, the flexible chip and the conductive adhesive being adapted to deform into a recess of a thermode during use, that includes a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of at least two components; and a support portion having at least one supporting surface portion configured to support a further component of the at least two components, wherein the at least two contact surface portions and the at least one supporting surface portion are configured to receive the at least two components between the at least two contact surface portions and the at least one supporting surface portion and wherein one or both of the at least two contact surface portions and the at least one supporting surface portion are moveable relative to and towards one another to exert heat and pressure on the at least two components located between the at least two contact surface portions and the at least one supporting portion,
the method comprising:
providing the thermode;
providing a flexible circuit onto the supporting surface portion and forming a layer of conductive adhesive on the flexible circuit;
providing a flexible chip onto the conductive adhesive layer so that a contact pad of the flexible circuit and a contact pad of the flexible chip are aligned with one another; and
applying heat and pressure to the flexible chip and the flexible circuit in a region of the contact pads and forming an electrically conductive joint between the contact pads.

### Claim 2 (depends on 1)

The method according to claim 1, wherein a buffer layer of flexible, porous material is provided on the flexible chip.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the conductive adhesive is provided as a substantially uniform layer.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the conductive adhesive is provided as discrete regions on the flexible circuit.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the flexible chip is picked and placed onto the conductive adhesive.

### Claim 6 (depends on 1)

The method according to claim 1, wherein the thermode performs thermal curing of the conductive adhesive.