# US 11,910,530 B2 · Method for manufacturing electronics assembly and electronics assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,530 B2 - Document ID: US11910530B2 - Status: Granted - Kind: B2 - Application number: 17/704,264 - Filed: 2022-03-25 - Published: 2023-09-28 - Granted: 2024-02-20 - Earliest claimed: 2022-03-25 - Assignees: Tactotek Oy - Applicants: TactoTek Oy - Inventors: Vinski Bräysy; Ilpo Hänninen; Pälvi Apilo; Mikko Heikkinen; Topi Wuori; Mikko Sippari; Heikki Alamäki - Web page: https://patentgrep.com/patent/US11910530B2 ## CPC - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/181: associated with surface mounted components - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} - H05K 3/305: {Affixing by adhesive} - H05K 3/321: by conductive adhesives - H05K 3/4617: {characterized by laminating only or mainly similar single-sided circuit boards} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/32: electrically connecting electric components or wires to printed circuits - H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers} - H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)} - H05K 2201/0108: Transparent - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/09018: Rigid curved substrate - H05K 2201/09027: Non-rectangular flat PCB, e.g. circular - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections - H05K 2201/09181: Notches in edge pads - H05K 2201/09872: Insulating conformal coating - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/10189: Non-printed connector - H05K 2201/10977: Encapsulated connections - H05K 2201/2036: Permanent spacer or stand-off in a printed circuit or printed circuit assembly - H05K 2203/0126: Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes - H05K 2203/1316: Moulded encapsulation of mounted components - H05K 2203/1322: Encapsulation comprising more than one layer - H05K 2203/1327: Moulding over PCB locally or completely - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry. ## Claims ### Claim 1 A method for manufacturing an electronics assembly, the method comprising: obtaining or producing an electronics module, wherein the electronics module comprises: a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board and in electrical connection with the first circuitry, and at least one first connection portion on an adjacent side surface relative to the first surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is at least one of electrically connected to or comprised in the first circuitry; arranging the electronics module on a second substrate including a thermoformable film or sheet comprising a second connection portion connected to a second circuitry on a surface of the second substrate, wherein the second connection portion is spaced-apart from the at least one first connection portion, wherein a second surface of the circuit board, being on the opposite second side than the first surface, faces the second substrate, arranging, subsequent to said arranging of the electronics module on the second substrate, electrically conductive joint material onto the at least one first connection portion and the second connection portion such that the electrically conductive joint material extends from the at least one first connection portion to the second connection portion to connect the at least one first connection portion to the second connection portion for electrically connecting the electronics module to the second circuitry via the electrically conductive joint material, the electrically conductive joint material including melted or stencil printed solder material, conductive adhesive, or conductive ink, wherein the melted or stencil printed solder material, the conductive adhesive, or the conductive ink, extends from the at least one first connection portion to the second connection portion, and arranging a third substrate comprising at least one of a thermoformable film or sheet on the opposite side of the electronics module relative to the second substrate, wherein the at least one electronics component comprises a segment display and wherein the third substrate is attached to a surface of the segment display being on the opposite side of the segment display than the circuit board. ### Claim 2 (depends on 1) The method of claim 1, wherein the electrically conductive joint material is at least initially dispensable, and the arranging of the electrically conductive joint material comprises dispensing the electrically conductive joint material on the first and the second connection portions. ### Claim 3 (depends on 1) The method of claim 1, wherein the first connection portion comprises one or a plurality of conductive pads at the peripheral portion on the first surface at the first side of the circuit board. ### Claim 4 (depends on 1) The method of claim 1, wherein the first connection portion includes one or several castellated or plated edges or half-holes. ### Claim 5 (depends on 1) The method of claim 1, wherein the first connection portion comprises one or several vias or plated holes. ### Claim 6 (depends on 1) The method of claim 1, wherein the arranging of the electronics module comprises attaching the electronics module to the second substrate by a second adhesive provided on the second side of the electronics module. ### Claim 7 (depends on 1) The method of claim 1, further comprising applying at least one of a conformal coating, an encapsulant or a glop top layer onto the first surface to embed at least the electronics component. ### Claim 8 (depends on 1) The method of claim 1, further comprising forming the second substrate at least locally from a planar shape to exhibit a non-planar or 3D shape prior to or after the arranging of the electronics module on the second substrate. ### Claim 9 (depends on 1) The method of claim 1, further comprising providing a trench to the second substrate, the trench having a shape and a lateral size such that the electronics module fits laterally into the trench. ### Claim 10 (depends on 9) The method of claim 9, wherein the trench is provided by thermoforming the second substrate. ### Claim 11 (depends on 1) The method of claim 1, wherein the circuit board comprises a rigid portion and a flex portion attached to each other, wherein the at least one first connection portion is comprised in the peripheral portion of the flex portion. ### Claim 12 (depends on 1) The method of claim 1, wherein the at least one electronics component comprises a connector for providing electrical connection between an external entity and the first circuitry. ### Claim 13 (depends on 1) The method of claim 1, further comprising removing a portion of the second substrate to expose the circuit board for arranging the at least one electronics component on the exposed portion of the second surface. ### Claim 14 (depends on 1) The method of claim 1, wherein the circuit board comprises a cavity on the first surface, the method further comprising removing a portion of the third substrate to expose the cavity for arranging one or several electronics components. ### Claim 15 (depends on 14) The method of claim 14, further comprising: attaching a second circuit board to the third substrate on the side facing or to be facing the electronics module, wherein the second circuit board comprises a through-hole, and removing a portion of the third substrate to expose the through-hole for arranging one or several electronics components to a cavity defined by the through-hole and the circuit board. ### Claim 16 (depends on 1) The method of claim 1, further comprising molding onto a side of the second substrate having the electronics module and at least partly embedding the electronics module. ### Claim 17 (depends on 1) The method of claim 1, wherein the at least one electronics component comprises at least one of a capacitive element, an inductive element, or force sensing elements. ### Claim 18 (depends on 17) The method of claim 17, wherein the electronics module comprises a ground layer on the opposite side thereof relative to the one or more capacitive, inductive, or force sensing elements. ### Claim 19 (depends on 1) The method of claim 1, further comprising arranging a protective ring onto the circuit board and around the at least one electronics component, the protective ring comprising a cover on the opposite side relative to the circuit board. ### Claim 20 (depends on 19) The method of claim 19, wherein the circuit board comprises an antenna element. ### Claim 21 (depends on 19) The method of claim 19, further comprising providing potting material into a space defined by the protective ring and the circuit board. ### Claim 22 (depends on 1) The method of claim 1, wherein the electronics module further comprises an electrical energy storage. ### Claim 23 (depends on 1) The method of claim 1, further comprising at least one of: arranging a gas sensor onto the circuit board, and providing a gas vent in fluid communication with the gas sensor by removing a portion of the third substrate, arranging an audio device on the circuit board, or arranging a display to a space left by the removed portion of the third substrate. ### Claim 24 (depends on 1) The method of claim 1, wherein the circuit board comprises at least a rigid portion, being selected from the group consisting of a printed circuit board, a low temperature, co-fired ceramic circuit board, and an FR4 circuit board. ### Claim 25 A method for manufacturing an electronics assembly, the method comprising: obtaining or producing an electronics module, wherein the electronics module comprises: a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board and in electrical connection with the first circuitry, and at least one first connection portion on an adjacent side surface relative to the first surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is at least one of electrically connected to or comprised in the first circuitry; arranging the electronics module on a second substrate including a thermoformable film or sheet comprising a second connection portion connected to a second circuitry on a surface of the second substrate, wherein the second connection portion is spaced-apart from the at least one first connection portion, wherein a second surface of the circuit board, being on the opposite second side than the first surface, faces the second substrate, arranging, subsequent to said arranging of the electronics module on the second substrate, electrically conductive joint material onto the at least one first connection portion and the second connection portion such that the electrically conductive joint material extends from the at least one first connection portion to the second connection portion to connect the at least one first connection portion to the second connection portion for electrically connecting the electronics module to the second circuitry via the electrically conductive joint material, the electrically conductive joint material including melted or stencil printed solder material, conductive adhesive, or conductive ink, wherein the melted or stencil printed solder material, the conductive adhesive, or the conductive ink, extends from the at least one first connection portion to the second connection portion, and arranging a third substrate comprising at least one of a thermoformable film or sheet on the opposite side of the electronics module relative to the second substrate, wherein the third substrate is attached to the first surface of the circuit board and/or the at least one electronics component by a third adhesive comprising at least one of a transparent adhesive or film.