# US 11,910,526 B2 · Wired circuit board, casing, and board containing set > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,526 B2 - Document ID: US11910526B2 - Status: Granted - Kind: B2 - Application number: 17/636,251 - Filed: 2020-06-11 - Published: 2022-09-08 - Granted: 2024-02-20 - Earliest claimed: 2019-08-21 - Assignees: Nitto Denko Corporation - Applicants: Nitto Denko Corporation - Inventors: Hayato Takakura; Daigo Tsubai; Hiroaki Machitani - Web page: https://patentgrep.com/patent/US11910526B2 ## CPC - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - H01B 1/026: {Alloys based on copper} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 2201/0154: Polyimide - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) ## Abstract A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 μm or more. ## Claims ### Claim 1 A wired circuit board comprising: a metal supporting layer; an insulating base layer; and a conductor layer from bottom to top, wherein a peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer, wherein the metal supporting layer has a thickness of 50 μm or more, and wherein the extension part has an extension length of 5 μm or more and 100 μm or less. ### Claim 2 (depends on 1) The wired circuit board according to claim 1, wherein a ratio of the thickness of the metal supporting layer to a thickness of the insulating base layer is 5 or more and 40 or less. ### Claim 3 (depends on 1) The wired circuit board according to claim 1, wherein the extension part has a thickness of 1 μm or more and 50 μm or less. ### Claim 4 (depends on 1) The wired circuit board according to claim 1, further comprising a peripheral edge having a first side and a second side facing the first side, wherein the first side and the second side include the extension part. ### Claim 5 (depends on 1) The wired circuit board according to claim 1, further comprising a peripheral edge having a first corner portion, and a second corner portion facing the first corner portion, wherein the first corner portion and the second corner portion include the extension part. ### Claim 6 (depends on 1) The wired circuit board according to claim 1, wherein a material of the metal supporting layer is copper or a copper alloy. ### Claim 7 (depends on 1) The wired circuit board according to claim 1, wherein a material of the extension part is a polyimide resin. ### Claim 8 (depends on 1) A casing for containing the wired circuit board according to claim 1, the casing comprising: a bottom wall; and a peripheral side wall extending upward from a peripheral edge of the bottom wall, wherein the peripheral side wall has a first part that can be brought into contact with the extension part when the wired circuit board is placed on the bottom wall. ### Claim 9 A casing for containing a wired circuit board, wherein the wired circuit board includes: a metal supporting layer; an insulating base layer; and a conductor layer from bottom to top, wherein a peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer, wherein the metal supporting layer has a thickness of 50 μm or more; wherein the casing includes: a bottom wall; and a peripheral side wall extending upward from a peripheral edge of the bottom wall, wherein the peripheral side wall has a first part that can be brought into contact with the extension part when the wired circuit board is placed on the bottom wall, wherein a peripheral edge of the metal supporting layer has a second extension part extending further outward relative to the insulating base layer, and wherein the peripheral side wall has a second part that is separated from the second extension part by an interval when the first part is brought into contact with the extension part. ### Claim 10 A casing for containing a wired circuit board, wherein the wired circuit board includes: a metal supporting layer; an insulating base layer; and a conductor layer from bottom to top, wherein a peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer, wherein the metal supporting layer has a thickness of 50 μm or more; wherein the casing includes: a bottom wall; and a peripheral side wall extending upward from a peripheral edge of the bottom wall, wherein the peripheral side wall has a first part that can be brought into contact with the extension part when the wired circuit board is placed on the bottom wall, wherein the bottom wall includes: a contact portion that can be brought into contact with an internal part disposed inside with respect to a peripheral edge of the metal supporting layer, and an interval portion that can be separated from the peripheral edge of the metal supporting layer by an interval. ### Claim 11 A board containing set comprising: a wired circuit board comprising: a metal supporting layer; an insulating base layer; and a conductor layer from bottom to top, wherein a peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer, wherein the metal supporting layer has a thickness of 50 μm or more, wherein the extension part has an extension length of 5 μm or more and 100 μm or less; and a casing comprising: a bottom wall; and a peripheral side wall extending upward from a peripheral edge of the bottom wall, wherein the peripheral side wall has a first part that can be brought into contact with the extension part when the wired circuit board is placed on the bottom wall, wherein the case contains the wired circuit board.