# US 11,910,520 B2 · Thermal management in circuit board assemblies > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,520 B2 - Document ID: US11910520B2 - Status: Granted - Kind: B2 - Application number: 17/201,528 - Filed: 2021-03-15 - Published: 2021-07-22 - Granted: 2024-02-20 - Earliest claimed: 2018-02-02 - Assignees: Kuprion Inc. - Applicants: Kuprion, Inc. - Inventors: Alfred A. Zinn - Web page: https://patentgrep.com/patent/US11910520B2 ## CPC - H05K 1/0206: {by printed thermal vias} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/112: {directly combined with via connections} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/4053: {by thick-film techniques} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/097: {Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence)} - H05K 2201/0257: Nanoparticles - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper. ## Claims ### Claim 1 A printed circuit board (PCB) comprising: a substrate having one or more vias extending therethrough between a first face and a second face, walls of the one or more vias having a coating thereon; and a monolithic metal body in each via in contact with the coating and filling the one or more vias, the monolithic metal body in each via having a uniform nanoporosity ranging from about 2% to about 30%, and the monolithic metal body in each via being formed from consolidation of a metal nanoparticle paste composition comprising a) metal nanoparticles coated with one or more surfactants, b) one or more organic solvents, and c) about 10 wt. % to about 35 wt. % micron-scale particles. ### Claim 2 (depends on 1) The PCB of claim 1, further comprising: a heat sink upon at least one of the first face or the second face, the heat sink contacting each monolithic metal body. ### Claim 3 (depends on 2) The PCB of claim 2, wherein a first heat sink is located upon the first face and a second heat sink is located upon the second face. ### Claim 4 (depends on 2) The PCB of claim 2, wherein a first heat sink is located upon the first face and contacts each monolithic metal body, and an electronic component is bonded to at least one monolithic metal body via a bonding layer upon the second face, a second heat sink contacting the electronic component. ### Claim 5 (depends on 4) The PCB of claim 4, wherein the bonding layer comprises a fused metal nanoparticle layer. ### Claim 6 (depends on 2) The PCB of claim 2, wherein the heat sink is metallurgically bonded to each monolithic metal body. ### Claim 7 (depends on 1) The PCB of claim 1, wherein the monolithic metal body in each via comprises copper and the metal nanoparticle paste composition comprises copper nanoparticles. ### Claim 8 (depends on 7) The PCB of claim 7, wherein the coating comprises tin. ### Claim 9 (depends on 7) The PCB of claim 7, wherein the coating comprises bismuth, gallium, zinc, tin solder alloys, Babbit alloys having a melting point below about 260° C., selenium, or indalloys. ### Claim 10 (depends on 7) The PCB of claim 7, wherein the monolithic metal body in each via further comprises a plurality of diamond particles. ### Claim 11 (depends on 1) The PCB of claim 1, wherein the monolithic metal body in each via further comprises a plurality of diamond particles. ### Claim 12 (depends on 1) The PCB of claim 1, wherein at least a portion of the one or more vias contain a reinforcement material extending through at least a portion of the monolithic metal body. ### Claim 13 (depends on 1) The PCB of claim 1, wherein the one or more vias are about 1 mm or larger in diameter. ### Claim 14 A method comprising: providing a printed circuit board (PCB) defined upon a substrate and having one or more vias extending through the substrate between a first face and a second face, walls of the one or more vias having a coating thereon; filling the one or more vias with a metal nanoparticle paste composition comprising a) metal nanoparticles coated with one or more surfactants, b) one or more organic solvents, and c) about 10 wt. % to about 35 wt. % micron-scale particles and that is adapted to limit shrinkage during metal nanoparticle consolidation; and consolidating metal nanoparticles of the metal nanoparticle paste composition within the one or more vias to form a monolithic metal body filling each of the one or more vias and contacting the coating therein, the monolithic metal body in each via having a uniform nanoporosity ranging from about 2% to about 30%. ### Claim 15 (depends on 14) The method of claim 14, further comprising: placing a heat sink upon at least one of the first face or the second face, the heat sink contacting each monolithic metal body. ### Claim 16 (depends on 15) The method of claim 15, wherein a first heat sink is located upon the first face of the PCB and a second heat sink is located upon the second face of the PCB. ### Claim 17 (depends on 15) The method of claim 15, wherein the heat sink is placed in contact with the metal nanoparticle paste composition before consolidating the metal nanoparticles, and becomes metallurgically bonded to the monolithic metal body in each via as the metal nanoparticles undergo consolidation. ### Claim 18 (depends on 14) The method of claim 14, wherein the metal nanoparticles comprise copper nanoparticles. ### Claim 19 (depends on 18) The method of claim 18, wherein the coating comprises tin. ### Claim 20 (depends on 18) The method of claim 18, wherein the coating comprises bismuth, gallium, zinc, tin solder alloys, Babbit alloys having a melting point below about 260° C., selenium, or indalloys. ### Claim 21 (depends on 18) The method of claim 18, wherein the metal nanoparticle paste composition further comprises at least one additive selected from the group consisting of diamond particles, micron-scale metal particles, and any combination thereof. ### Claim 22 (depends on 14) The method of claim 14, wherein the metal nanoparticle paste composition further comprises at least one additive selected from the group consisting of diamond particles, micron-scale metal particles, and any combination thereof. ### Claim 23 (depends on 14) The method of claim 14, further comprising: placing a reinforcement material in at least a portion of the one or more vias prior to filling the one or more vias with the metal nanoparticle paste composition, the reinforcement material extending through at least a portion of the monolithic metal body in each via where placed after consolidation of the metal nanoparticles. ### Claim 24 (depends on 14) The method of claim 14, further comprising: forming the coating upon walls of the one or more vias by electroless plating. ### Claim 25 (depends on 14) The method of claim 14, further comprising: forming the coating upon walls of the one or more vias by contacting the vias with a liquid metal, metal alloy, or metalloid.