# US 11,910,517 B2 · Point of load module and heatsink therefor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,517 B2 - Document ID: US11910517B2 - Status: Granted - Kind: B2 - Application number: 17/550,707 - Filed: 2021-12-14 - Published: 2023-06-15 - Granted: 2024-02-20 - Earliest claimed: 2021-12-14 - Assignees: AcLeap Power Inc. - Applicants: AcLeap Power Inc. - Inventors: John Andrew Trelford; Alok K. Lohia; Arturo Silva - Web page: https://patentgrep.com/patent/US11910517B2 ## CPC - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - G06F 1/20: Cooling means - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/181: associated with surface mounted components - H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)} - H05K 2201/1003: Non-printed inductor - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A system including a point of load converter module (POL). The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The point of load converter module is configured to be surface mounted. The system includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL and configured to connect to the power network. The power network may be a PGND network. ## Claims ### Claim 1 A system, comprising: a point of load converter module (POL), comprising: a point of load printed circuit board; at least one inductor mounted to the point of load printed circuit board; and a power network; wherein the POL is configured to be surface mounted; and a heat sink, comprising: a first leg configured to be surface mounted adjacent the point of load printed circuit board; at least one second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg; and a cap portion connecting the first leg to the at least one second leg; wherein the heat sink is sized and shaped to encompass the POL, and wherein the heat sink is configured to connect to the power network. ### Claim 2 (depends on 1) The system of claim 1 wherein the power network is a PGND network. ### Claim 3 (depends on 1) The system of claim 1 wherein the first leg is positioned halfway between a first end and a second end of the POL. ### Claim 4 (depends on 3) The system of claim 3 wherein the heat sink has precisely two second legs, each of the second legs respectively disposed adjacent one of the first end or the second end. ### Claim 5 (depends on 4) The system of claim 4 wherein the POL has precisely one inductor and one of the two second legs is adjacent and aligned with the one inductor. ### Claim 6 (depends on 4) The system of claim 4 wherein the POL has precisely two inductors, the two inductors disposed on opposite ends of the point of load printed circuit board. ### Claim 7 (depends on 6) The system of claim 6 wherein each of the two second legs is disposed adjacent and aligned with a respective one of the two inductors. ### Claim 8 (depends on 1) The system of claim 1 wherein the POL has precisely four inductors and precisely four second legs. ### Claim 9 (depends on 8) The system of claim 8 wherein each of the four second legs is disposed adjacent and aligned with a respective one of the four inductors. ### Claim 10 (depends on 9) The system of claim 9 wherein distal ends of the four second legs are formed into a unitary base. ### Claim 11 (depends on 1) The system of claim 1 wherein the cap portion includes at least one slot formed therethrough that is adjacent and aligned with the at least one inductor. ### Claim 12 (depends on 11) The system of claim 11 wherein the at least one slot is configured to reduce magnetic fringing. ### Claim 13 (depends on 12) The system of claim 12 wherein the at least one slot is a rectangular opening formed through the cap portion. ### Claim 14 (depends on 13) The system of claim 13 wherein the cap portion includes a planar rectangular shape. ### Claim 15 (depends on 14) The system of claim 14 wherein the cap portion is at least an area of the point of load printed circuit board. ### Claim 16 (depends on 1) The system of claim 1 wherein the first leg is precisely one first leg. ### Claim 17 A system, comprising: a main circuit board, comprising: a plurality of conductive pads; a point of load converter module (POL), comprising: a point of load printed circuit board surface mounted to the main circuit board; at least one inductor mounted to the point of load printed circuit board; and a power network in communication with the main circuit board; and a heat sink, comprising: a first leg surface mounted to the main circuit board adjacent the point of load printed circuit board; at least one second leg surface mounted to the main circuit board adjacent the point of load printed circuit board opposite the first leg; and a cap portion connecting the first leg to the at least one second leg; wherein the heat sink is sized and shaped to encompass the POL, and wherein the heat sink is connected to the power network. ### Claim 18 (depends on 17) The system of claim 17 wherein the POL and the heat sink are surface mounted to the main circuit board via the plurality of conductive pads. ### Claim 19 (depends on 17) The system of claim 17 wherein the heat sink is configured to dissipate heat generated by the POL through the connection to the power network. ### Claim 20 (depends on 17) The system of claim 17 wherein the cap portion includes at least one slot formed therethrough that is adjacent and aligned with the at least one inductor.