# US 11,910,516 B2 · Electronic device including heat dissipation structure

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- Number: US 11,910,516 B2
- Document ID: US11910516B2
- Status: Granted
- Kind: B2
- Application number: 17/293,280
- Filed: 2019-11-08
- Published: 2021-12-30
- Granted: 2024-02-20
- Earliest claimed: 2018-11-12
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Hongki Moon; Yoonsun Park; Seunghoon Kang; Kyungha Koo; Seyoung Jang; Woojune Jung
- Web page: https://patentgrep.com/patent/US11910516B2

## CPC

- G06F 1/203: {for portable computers, e.g. for laptops}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]}
- G06F 1/1658: {related to the mounting of internal components, e.g. disc drive or any other functional module}
- G06F 1/1698: {the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone (details of antennas disposed inside a computer H01Q1/2266)}
- H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00)
- H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps}
- H04M 1/026: {Details of the structure or mounting of specific components}
- H04M 1/0277: {for a printed circuit board assembly}
- H05K 2201/064: Fluid cooling, e.g. by integral pipes
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08)

## Abstract

Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

## Claims

### Claim 1

An electronic device comprising:
a first printed circuit board arranged in a first direction;
a first thermal diffusion member including at least one of a heat pipe or a vapor chamber and arranged in parallel to the first printed circuit board;
a second printed circuit board arranged in a second direction substantially perpendicular to the first direction to be separated from the first printed circuit board and electrically connected to the first printed circuit board; and
a heat transfer member including
at least one partial area arranged to face the first thermal diffusion member and
at least one other partial area arranged to face one surface of the second printed circuit board,
wherein the at least one other partial area of the heat transfer member is bent from the at least one partial area of the heat transfer member.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein the first printed circuit board includes a first communication circuit arranged thereon, and
wherein the second printed circuit board includes a second communication circuit arranged thereon.

### Claim 3 (depends on 2)

The electronic device of claim 2, wherein the second communication circuit is arranged on the one surface of the second printed circuit board, and
wherein the second communication circuit includes at least one antenna arranged on another surface thereof.

### Claim 4 (depends on 1)

The electronic device of claim 1, wherein an area provided by bending at least a portion of the heat transfer member is arranged to face the one surface of the second printed circuit board, and
wherein at least a portion of another area of the heat transfer member is arranged to face the first thermal diffusion member so as to form a heat transfer path that transfers heat generated from the one surface of the second printed circuit board to the first thermal diffusion member.

### Claim 5 (depends on 1)

The electronic device of claim 1, further comprising:
at least one electronic element arranged on the first printed circuit board;
at least one other electronic element arranged on the second printed circuit board; and
a second thermal diffusion members,
wherein the heat transfer member comprises:
a first heat transfer area arranged in a first direction to correspond to one surface of the at least one other electric element;
a second heat transfer area arranged in the first direction to be stepped from the first heat transfer area; and
a third heat transfer area arranged between the first and second heat transfer areas and bent from the first heat transfer area to a second direction perpendicular to the first,
wherein a first surface of the first heat transfer area is arranged to correspond to one surface of the first printed circuit board, a second surface of the first heat transfer area opposite to the first surface of the first heat transfer area is arranged to correspond to the one surface of the second printed circuit board,
wherein a first surface of the second heat transfer area is arranged to correspond to one surface of the first thermal diffusion member and a second surface of the second heat transfer area opposite to the first surface of the second heat transfer area is arranged to correspond to one surface of the second thermal diffusion member, and
wherein the third heat transfer area interconnects the first and second heat transfer areas, which are arranged to be stepped.

### Claim 6 (depends on 5)

The electronic device of claim 5, wherein the second printed circuit board includes at least one of an antenna modem or an antenna module,
wherein the second printed circuit board includes an antenna array and a communication module,
wherein the second printed circuit board includes a shield member that surrounds the communication module, and
wherein one surface of the shield member includes an antenna-side heat transfer member facing the first surface of the first heat transfer area.

### Claim 7 (depends on 5)

The electronic device of claim 5, wherein the third heat transfer area includes a bending member, and
wherein a shape of the bending member includes at least one of an “L” shape, a “Z” shape, or a thunderbolt shape.

### Claim 8 (depends on 5)

The electronic device of claim 5, wherein
the second thermal diffusion member includes at least one of a heat pipe or a vapor chamber.

### Claim 9 (depends on 8)

The electronic device of claim 8, wherein the vapor chamber includes a chamber heat transfer member arranged to correspond to the first surface of the second heat transfer area, and
a chamber body configured to diffuse or disperse heat transferred to the chamber heat transfer member.

### Claim 10 (depends on 5)

The electronic device of claim 5, wherein the first and second thermal diffusion members include at least one of copper or a ceramic material.

### Claim 11 (depends on 1)

The electronic device of claim 1, wherein:
the second printed circuit board includes a plurality of electric elements arranged in the second direction perpendicular to the first direction,
the heat transfer member includes first and second heat transfer areas arranged in the second direction to correspond to one surfaces of the plurality of electric elements, a third heat transfer area connected to the first heat transfer area and arranged in the first direction, and a fourth heat transfer area interconnecting the second heat transfer area and the third heat transfer area; and
the first thermal diffusion member connected to the third heat transfer area.

### Claim 12 (depends on 11)

The electronic device of claim 11, wherein the plurality of electric elements include at least one of a modular antenna modem or an antenna module.

### Claim 13 (depends on 11)

The electronic device of claim 11, wherein
the first thermal diffusion member is configured to diffuse or disperse heat transferred from the plurality of electric elements to the first, second, third, and fourth heat transfer areas.