# US 11,910,160 B2 · MEMS acoustic sensor

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- Number: US 11,910,160 B2
- Document ID: US11910160B2
- Status: Granted
- Kind: B2
- Application number: 17/550,716
- Filed: 2021-12-14
- Published: 2022-07-07
- Granted: 2024-02-20
- Earliest claimed: 2021-01-07
- Assignees: Shinsung Soundmotion Co., Ltd.
- Applicants: Shinsung SoundMotion Co., Ltd.
- Inventors: Sangwoo Lee; Kyudong Jung; Jinho Kim
- Web page: https://patentgrep.com/patent/US11910160B2

## CPC

- H04R 19/005: {using semiconductor materials}
- H04R 19/04: Microphones (H04R19/01 takes precedence)
- B81B 3/001: {Structures having a reduced contact area, e.g. with bumps or with a textured surface}
- B81B 3/0072: {For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers}
- H04R 7/04: Plane diaphragms
- H04R 7/18: at the periphery
- H04R 7/20: Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
- B81B 2201/0257: Microphones or microspeakers
- B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
- B81B 2203/0307: Anchors
- B81B 2203/0315: Cavities
- B81B 2203/04: Electrodes
- H04R 2201/003: Mems transducers or their use
- H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)

## Abstract

The present invention relates to a MEMS acoustic sensor for sensing variable capacitance between a flexible diaphragm and a back plate. The MEMS acoustic sensor is composed of a substrate comprising a cavity, a back plate supported on the substrate and comprising a plurality of through holes, an electrode formed on the inner surface of the back plate, at least one anchor protruding from the back plate toward the substrate, a diaphragm supported by the at least one anchor and deformed by a sound wave introduced from the outside through the cavity, and a stress release unit extending from the edge portion of the back plate and in contact with the substrate.

## Claims

### Claim 1

A MEMS acoustic sensor comprising:
a substrate having a cavity;
a back plate supported on the substrate and comprising a plurality of through holes;
an electrode formed on an inner surface of the back plate;
at least one anchor protruding from the back plate toward the substrate;
a diaphragm supported by the at least one anchor, the diaphragm being deformable by a sound wave introduced through the cavity; and
a plurality of connection pads exposed to an upper surface of the back plate,
wherein the diaphragm comprises an extension extending upward along the at least one anchor from an upper surface of the diaphragm, and the plurality of connection pads comprise a first connection pad in electrical contact with an upper end of the extension and exposed to an outer surface of the back plate by passing through the back plate, and a second connection pad in electrical contact with the electrode and exposed to the outer surface of the back plate by passing through the back plate.

### Claim 2 (depends on 1)

The MEMS acoustic sensor of claim 1, wherein the at least one anchor is fitted into the extension.

### Claim 3 (depends on 1)

The MEMS acoustic sensor of claim 1, further comprising a stress release unit extending from an edge portion of the back plate and in contact with the substrate.

### Claim 4 (depends on 3)

The MEMS acoustic sensor of claim 3, wherein the stress release unit comprises a support wall bent downward from the back plate and a flange bent outward from the support wall and in surface-contact with the substrate.

### Claim 5 (depends on 4)

The MEMS acoustic sensor of claim 4, wherein the stress release unit further comprises a notch facing inward toward the diaphragm between the back plate and the support wall.

### Claim 6 (depends on 3)

The MEMS acoustic sensor of claim 3, wherein the stress release unit comprises:
a first support wall bent downward from the back plate;
a first flange extending outward from the first support wall and bent parallel to the substrate;
a second support wall bent downward from the first flange; and
a second flange bent outward from the second support wall and in surface-contact with the substrate.

### Claim 7 (depends on 1)

The MEMS acoustic sensor of claim 1, further comprising a bump extending downward from the inner surface of the back plate, wherein the electrode is penetrated by the bump.

### Claim 8 (depends on 1)

The MEMS acoustic sensor of claim 1, further comprising an elastic support connecting the diaphragm and the substrate in a plane direction formed by the diaphragm to elastically support the diaphragm.

### Claim 9 (depends on 8)

The MEMS acoustic sensor of claim 8, wherein one of the plurality of connection pads is formed on the substrate, and
the diaphragm and the one of the plurality of connection pads are electrically connected through the elastic support.