# US 11,910,154 B2 · MEMS microphone and package with integrated passive acoustic filter, extended soundport > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,910,154 B2 - Document ID: US11910154B2 - Status: Granted - Kind: B2 - Application number: 17/658,546 - Filed: 2022-04-08 - Published: 2022-11-17 - Granted: 2024-02-20 - Earliest claimed: 2021-05-11 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Daniel Neumaier; Niccoló De Milleri - Web page: https://patentgrep.com/patent/US11910154B2 ## CPC - H04R 1/2846: {Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material} - H04R 19/005: {using semiconductor materials} - B81B 3/0059: {Constitution or structural means for controlling the movement not provided for in groups B81B3/0037 - B81B3/0056} - H04R 1/04: Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) - H04R 19/04: Microphones (H04R19/01 takes precedence) - B81B 2201/0257: Microphones or microspeakers - B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function - B81B 2203/0315: Cavities - H04R 1/222: {for microphones (H04R1/24, H04R1/26 take precedence)} - H04R 1/28: Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns H04R1/30)} - H04R 1/2876: {by means of damping material, e.g. as cladding (damping material for tuning desired resonances H04R1/2807, e.g. in vents H04R1/2823, H04R1/2846)} - H04R 2201/003: Mems transducers or their use - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A MEMS device includes a package for providing an inner volume, a MEMS microphone arranged in the inner volume, a sound port through the package to the inner volume, and a passive acoustic attenuation filter acoustically coupled to the sound port. ## Claims ### Claim 1 A MEMS device comprising: a package having an inner volume; a MEMS microphone located in the inner volume; a sound port through the package to the inner volume; and a passive acoustic attenuation filter acoustically coupled to the sound port, wherein the passive acoustic attenuation filter comprises a tube element branching off from the sound port, wherein the sound port and the tube structure are integrated into a substrate portion of the MEMS device, wherein the tube element has a tube inlet acoustically coupled to the sound port, the tube inlet corresponding to a cross-sectional area of the tube having a width, and wherein the width is substantially smaller than a length of the tube element. ### Claim 2 (depends on 1) The MEMS device according to claim 1, wherein the tube length is associated with an attenuation center frequency of the passive acoustic attenuation filter, the attenuation center frequency corresponding to a frequency or frequency range of an acoustic resonance in the inner volume. ### Claim 3 (depends on 1) The MEMS device according to claim 1, wherein the passive acoustic attenuation filter is a passive acoustic notch filter acoustically coupled to the sound port, and wherein the tube length is associated with a notch center frequency of the passive acoustic notch filter, the notch center frequency corresponding to a frequency or frequency range of a Helmholtz resonance or a back-cavity resonance in the inner volume. ### Claim 4 (depends on 1) The MEMS device according to claim 1, wherein the tube element comprises a bypass tube having a bypass tube inlet and a bypass tube outlet, which are acoustically coupled to the sound port, wherein the bypass tube inlet is arranged in the sound port acoustically upstream to the bypass tube outlet. ### Claim 5 (depends on 4) The MEMS device according to claim 4, wherein the bypass tube comprises a spiral tube extending around the sound port. ### Claim 6 (depends on 1) The MEMS device according to claim 1, wherein the passive acoustic attenuation filter comprises a plurality of tube elements, including the tube element, respectively branching off from the sound port. ### Claim 7 (depends on 6) The MEMS device according to claim 6, wherein at least some of the tube elements are parallel to each other and have common first dimensions associated with a first attenuation center frequency. ### Claim 8 (depends on 7) The MEMS device according to claim 7, wherein at least some of the tube elements are parallel to each other and have common second dimensions different from and in addition to the first dimensions, the second dimensions associated with a second attenuation center frequency different than the first attenuation center frequency. ### Claim 9 (depends on 1) The MEMS device according to claim 1, wherein the substrate structure comprises different individual layers, and wherein the tube element is integrated into the different individual layers of the substrate structure. ### Claim 10 (depends on 1) The MEMS device according to claim 1, wherein the tube element of the passive acoustic attenuation filter comprises a spiral tube extending around the sound port. ### Claim 11 (depends on 1) The MEMS device according to claim 1, wherein the tube element of the passive acoustic attenuation filter is filled with a medium having a different speed of sound than of the environmental atmosphere. ### Claim 12 (depends on 1) The MEMS device according to claim 1, wherein the passive acoustic attenuation filter is a notch filter enabled to attenuate an attenuation wavelength or an attenuation wavelength range. ### Claim 13 (depends on 12) The MEMS device according to claim 12, wherein the tube element extends in length a distance of ¼ of the attenuation wavelength. ### Claim 14 A MEMS device comprising: a package for providing an inner volume wherein the package comprises a substrate structure and a lid structure; a MEMS microphone arranged in the inner volume; a sound port through the package to the inner volume; and a passive acoustic attenuation filter acoustically coupled to the sound port, wherein the passive acoustic attenuation filter comprises a tube element branching off from the sound port, wherein the sound port extends through the lid structure, and wherein the passive acoustic attenuation filter is integrated into the lid structure, including the tube structure. ### Claim 15 (depends on 14) The MEMS device according to claim 14, wherein the tube element has a tube inlet acoustically coupled to the sound port, the tube inlet corresponding to a cross-sectional area of the tube having a width, and wherein the width is substantially smaller than a length of the tube element. ### Claim 16 (depends on 14) The MEMS device according to claim 14, wherein the tube element comprises a spiral tube extending around the sound port. ### Claim 17 (depends on 14) The MEMS device according to claim 14, wherein the tube element comprises a bypass tube having a bypass tube inlet and a bypass tube outlet, which are acoustically coupled to the sound port, wherein the bypass tube inlet is located in the sound port acoustically upstream to the bypass tube outlet. ### Claim 18 (depends on 17) The MEMS device according to claim 17, wherein the bypass tube comprises a spiral tube extending around the sound port. ### Claim 19 (depends on 14) The MEMS device according to claim 14, wherein the passive acoustic attenuation filter comprises a plurality of tube elements, including the tube element, respectively branching off from the sound port. ### Claim 20 A method for operating MEMS devices, the method comprising: receiving sound waves at a sound port of a MEMS device formed as a package having an inner volume, a MEMS microphone located in the inner volume, the sound port extending through the package to the inner volume, and a passive acoustic attenuation filter acoustically coupled to the sound port, wherein the sound waves include at least some frequencies of a frequency range; enabling the sound waves to be acoustically coupled by a tube element branching off from the sound port comprising the passive acoustic attenuation filter, wherein the sound port and the tube structure are integrated into a substrate portion of the MEMS device, wherein the tube element has a tube inlet acoustically coupled to the sound port, the tube inlet corresponding to a cross-sectional area of the tube having a width, and wherein the width is substantially smaller than a length of the tube element; and based on the length and the width of the tube structure being associated with the frequency range, enabling at least some of the sound waves in the frequency range to be attenuated by the tube structure before the sound waves are received by the MEMS microphone.