# US 11,909,379 B2 · MEMS device having a connection portion formed of a eutectic alloy > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,909,379 B2 - Document ID: US11909379B2 - Status: Granted - Kind: B2 - Application number: 17/108,007 - Filed: 2020-12-01 - Published: 2021-03-18 - Granted: 2024-02-20 - Earliest claimed: 2018-08-02 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yoshihisa Inoue; Masakazu Fukumitsu; Yuichi Goto - Web page: https://patentgrep.com/patent/US11909379B2 ## CPC - H03H 9/1057: {for microelectro-mechanical devices} - H03H 9/2489: {with more than two fork tines} - B81B 7/0006: {Interconnects} - B81B 7/0038: {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters} - H03H 9/02259: {Driving or detection means} - H03H 9/0595: {the holder support and resonator being formed in one body} - H03H 9/2457: {Clamped-free beam resonators} - B81B 2201/0271: Resonators; ultrasonic resonators - B81B 2207/07: Interconnects - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A MEMS device that includes a substrate including an element and a connection wiring electrically connected to the element, and a connection portion electrically connected to the connection wiring. The connection portion is formed of a eutectic alloy of a first metal and a second metal. A line width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view. ## Claims ### Claim 1 A MEMS device, comprising: a substrate including an element and a connection wiring electrically connected to the element; and a connection portion electrically connected to the connection wiring and formed of a eutectic alloy of a first metal and a second metal, wherein a width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view of the substrate, wherein the substrate further includes a contact electrode that electrically connects the connection wiring and the element, wherein a length of the connection wiring from the connection portion to the contact electrode is five times or more of a linear distance between the connection portion and the contact electrode in the plan view, and wherein the connection wiring further includes an electrode pad between the connection portion and the element in the plan view. ### Claim 2 (depends on 1) The MEMS device according to claim 1, wherein the electrode pad is wider than a line width of the connection wiring. ### Claim 3 (depends on 1) The MEMS device according to claim 1, wherein the connection wiring has a bent shape or a meander shape between the connection portion and the electrode pad in the plan view. ### Claim 4 (depends on 1) The MEMS device according to claim 1, wherein MEMS device further includes a piezoelectric film on the main surface of the substrate, and the connection wiring is on the piezoelectric film. ### Claim 5 (depends on 1) The MEMS device according to claim 1, wherein the first metal is germanium, and the second metal is aluminum. ### Claim 6 (depends on 5) The MEMS device according to claim 5, wherein a material of the connection wiring is aluminum. ### Claim 7 A MEMS device, comprising: a substrate including an element and a connection wiring electrically connected to the element; and a connection portion electrically connected to the connection wiring and formed of a eutectic alloy of a first metal and a second metal, wherein a width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view of the substrate, wherein the substrate further includes a contact electrode that electrically connects the connection wiring and the element, wherein a length of the connection wiring from the connection portion to the contact electrode is three times or more of the width of the connection wiring in the plan view, and wherein the connection wiring further includes an electrode pad between the connection portion and the element in the plan view. ### Claim 8 (depends on 7) The MEMS device according to claim 7, wherein the electrode pad is wider than a line width of the connection wiring. ### Claim 9 (depends on 7) The MEMS device according to claim 7, wherein the connection wiring has a bent shape or a meander shape between the connection portion and the electrode pad in the plan view. ### Claim 10 (depends on 7) The MEMS device according to claim 7, wherein MEMS device further includes a piezoelectric film on the main surface of the substrate, and the connection wiring is on the piezoelectric film. ### Claim 11 (depends on 7) The MEMS device according to claim 7, wherein the first metal is germanium, and the second metal is aluminum. ### Claim 12 (depends on 11) The MEMS device according to claim 11, wherein a material of the connection wiring is aluminum. ### Claim 13 A MEMS device, comprising: a substrate including an element and a connection wiring electrically connected to the element; and a connection portion electrically connected to the connection wiring and formed of a eutectic alloy of a first metal and a second metal, wherein a width of the connection wiring is smaller than a width of the connection portion when a main surface of the substrate is viewed in a plan view of the substrate, and wherein the connection wiring further includes an electrode pad between the connection portion and the element in the plan view. ### Claim 14 (depends on 13) The MEMS device according to claim 13, wherein the width of the connection wiring is less than or equal to ½ of the width of the connection portion. ### Claim 15 (depends on 13) The MEMS device according to claim 13, wherein the electrode pad is wider than a line width of the connection wiring. ### Claim 16 (depends on 13) The MEMS device according to claim 13, wherein the connection wiring has a bent shape or a meander shape between the connection portion and the electrode pad in the plan view. ### Claim 17 (depends on 11) The MEMS device according to claim 11, wherein MEMS device further includes a piezoelectric film on the main surface of the substrate, and the connection wiring is on the piezoelectric film. ### Claim 18 (depends on 11) The MEMS device according to claim 11, wherein the first metal is germanium, and the second metal is aluminum. ### Claim 19 (depends on 18) The MEMS device according to claim 18, wherein a material of the connection wiring is aluminum.