# US 11,909,170 B2 · Semiconductor light emitting device and optical subassembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,909,170 B2 - Document ID: US11909170B2 - Status: Granted - Kind: B2 - Application number: 17/357,351 - Filed: 2021-06-24 - Published: 2022-05-19 - Granted: 2024-02-20 - Earliest claimed: 2020-11-17 - Assignees: Lumentum Japan, Inc. - Applicants: Lumentum Japan, Inc. - Inventors: Koichiro Adachi - Web page: https://patentgrep.com/patent/US11909170B2 ## CPC - H01S 5/023: Mount members, e.g. sub-mount members - H01S 5/0207: {Substrates having a special shape} - H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches - H01S 5/02345: Wire-bonding - H01S 5/0239: Combinations of electrical or optical elements - H01S 5/026: Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers (stabilisation of output H01S5/06) - H01S 5/0427: {for applying modulation to the laser} - H01S 5/06226: {Modulation at ultra-high frequencies} - H01S 5/06251: {Amplitude modulation} - H01S 5/0602: {which is an umpumped part of the active layer} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract A semiconductor light emitting device includes a microstrip substrate with a single-ended transmission line on a top surface, wherein the single-ended transmission line extends from a first end portion to a second end portion, the microstrip substrate has a ground plane on a bottom surface, and the ground plane is opposed and bonded to the conductive pattern. The single-ended transmission line includes a first section and a second section, wherein the second section extends from the first section and includes the second end portion. The second section is lower in characteristic impedance than the first section. A load circuit that includes the wire, the optical modulator, and the termination resistor is electrically connected between the second end portion and the conductive pattern. The load circuit is equal to or lower in the characteristic impedance than the second section. ## Claims ### Claim 1 A semiconductor light emitting device comprising: a sub-mount with a conductive pattern on an upper surface of the sub-mount; an optical modulator with an upper electrode on a top surface of the optical modulator and a lower electrode on a bottom surface of the optical modulator, wherein the lower electrode is opposed and bonded to the conductive pattern; a termination resistor connected in parallel to the optical modulator; a microstrip substrate with a single-ended transmission line on a top surface of the microstrip substrate, wherein the single-ended transmission line extends from a first end portion to a second end portion of the microstrip substrate, wherein the microstrip substrate has a ground plane on a bottom surface of the microstrip substrate, and wherein the ground plane is opposed and bonded to the conductive pattern; and a wire that has a pair of ends, wherein one of the pair of ends is bonded to the upper electrode of the optical modulator, and another of the pair of ends is bonded to the second end portion of the single-ended transmission line, wherein: the single-ended transmission line includes a first section and a second section, wherein the second section extends from the first section and includes the second end portion, and wherein the second section is lower in characteristic impedance than the first section, a load circuit that includes the wire, the optical modulator, and the termination resistor is electrically connected between the second end portion and the conductive pattern, and the load circuit is equal to or lower in the characteristic impedance than the second section. ### Claim 2 (depends on 1) The semiconductor light emitting device of claim 1, wherein: the single-ended transmission line includes an external connection section connected to the first section, and the external connection section includes the first end portion, and the microstrip substrate has a pair of ground conductors on the top surface of the microstrip substrate, wherein the pair of ground conductors sandwich the external connection section of the single-ended transmission line, and wherein the microstrip substrate partially constitutes a ground coplanar line. ### Claim 3 (depends on 1) The semiconductor light emitting device of claim 1, further comprising a semiconductor laser, wherein both the optical modulator and the semiconductor laser are monolithically integrated in an optical semiconductor device. ### Claim 4 (depends on 1) The semiconductor light emitting device of claim 1, wherein the top surface of the optical modulator is equivalent in height to the top surface of the microstrip substrate. ### Claim 5 (depends on 1) The semiconductor light emitting device of claim 1, wherein the first section linearly extends with a uniform width. ### Claim 6 (depends on 1) The semiconductor light emitting device of claim 1, wherein the second section has a broad portion wider in width than the first section. ### Claim 7 (depends on 6) The semiconductor light emitting device of claim 6, wherein the broad portion has a gradually increased width. ### Claim 8 (depends on 6) The semiconductor light emitting device of claim 6, wherein the broad portion includes the second end portion. ### Claim 9 (depends on 1) The semiconductor light emitting device of claim 1, wherein the first end portion and the second end portion are at respective ends of the microstrip substrate along a length direction of the single-ended transmission line, and are displaced from each other in a width direction perpendicular to the length direction. ### Claim 10 (depends on 1) The semiconductor light emitting device of claim 1, wherein the first end portion is at one of a pair of ends of the microstrip substrate along a length direction of the first section, and the second end portion is at one of a pair of sides of the microstrip substrate along a width direction perpendicular to the length direction. ### Claim 11 (depends on 1) The semiconductor light emitting device of claim 1, wherein the second section includes a curve portion. ### Claim 12 (depends on 11) The semiconductor light emitting device of claim 11, wherein the curve portion extends along a curve convex in one direction. ### Claim 13 (depends on 11) The semiconductor light emitting device of claim 11, wherein the curve portion extends along a curve convex in multiple directions. ### Claim 14 (depends on 1) The semiconductor light emitting device of claim 1, wherein the first section includes a first connection portion that is connected to the second section and extends from the first connection portion along a first direction, the second section includes a second connection portion that is connected to the first section and extends from the second connection portion along a second direction intersecting the first direction, and the first connection portion and the second connection portion are adjacent to each other in the first direction and are not adjacent to each other in the second direction. ### Claim 15 (depends on 14) The semiconductor light emitting device of claim 14, wherein the single-ended transmission line curves at a right angle. ### Claim 16 (depends on 14) The semiconductor light emitting device of claim 14, wherein the second connection portion has a portion narrower than the first connection portion. ### Claim 17 An optical subassembly comprising: a semiconductor light emitting device comprising: a sub-mount with a conductive pattern on an upper surface of the sub-mount; an optical modulator with an upper electrode on a top surface of the optical modulator and a lower electrode on a bottom surface of the optical modulator, wherein the lower electrode is opposed and bonded to the conductive pattern; a termination resistor connected in parallel to the optical modulator; a microstrip substrate with a single-ended transmission line on a top surface of the microstrip substrate, wherein the single-ended transmission line extends from a first end portion to a second end portion of the microstrip substrate, wherein the microstrip substrate has a ground plane on a bottom surface of the microstrip substrate, and wherein the ground plane is opposed and bonded to the conductive pattern; and a wire that has a pair of ends, wherein one of the pair of ends is bonded to the upper electrode of the optical modulator, and another of the pair of ends is bonded to the second end portion of the single-ended transmission line, wherein: the single-ended transmission line includes a first section and a second section, wherein the second section extends from the first section and includes the second end portion, and wherein the second section is lower in characteristic impedance than the first section, a load circuit that includes the wire, the optical modulator, and the termination resistor is electrically connected between the second end portion and the conductive pattern, and the load circuit is equal to or lower in the characteristic impedance than the second section; and an electrical connector, wherein the electrical connector is electrically connected to the first end portion of the single-ended transmission line.