# US 11,909,158 B2 · Circuit board fixing structure and light irradiation device having same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,909,158 B2
- Document ID: US11909158B2
- Status: Granted
- Kind: B2
- Application number: 16/775,232
- Filed: 2020-01-28
- Published: 2020-07-30
- Granted: 2024-02-20
- Earliest claimed: 2019-01-30
- Assignees: Hoya Corporation
- Applicants: Hoya Candeo Optronics Corporation
- Inventors: Hiroaki Watanabe; Katsumi Ashida
- Web page: https://patentgrep.com/patent/US11909158B2

## CPC

- H01R 43/015: {Handtools}
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H01R 4/26: Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact ({H01R4/188, H01R4/203, H01R4/5075 take precedence}; using shape memory materials H01R4/01)
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/181: associated with surface mounted components
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 3/4046: {using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire}
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2201/10409: Screws
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Provided is a small-sized circuit board fixing structure capable of enabling a circuit board on a base to be easily replaced. A circuit board fixing structure configured to fix a circuit board onto a surface of a base includes a wire pattern formed on a surface of the circuit board, a first through hole penetrating from a front surface to a rear surface of the circuit board, a second through hole penetrating from a front surface to a rear surface of the base so as to communicate with the first through hole, an electrode penetratively inserted into the second through hole, and a fixing member engaged with the electrode mounted on the surface of the circuit board and configured to fix the circuit board to the base, in which when the fixing member and the electrode are engaged, the wire pattern and the electrode are electrically connected through the fixing member.

## Claims

### Claim 1

A circuit board fixing structure configured to fix a circuit board onto a surface of a base, the circuit board fixing structure comprising:
a wire pattern formed on a surface of the circuit board;
a first through hole penetrating from a front surface to a rear surface of the circuit board;
a second through hole penetrating from a front surface to a rear surface of the base so as to communicate with the first through hole;
an electrode penetratively inserted into the second through hole; and
a fixing member engaged with the electrode mounted on the surface of the circuit board and configured to fix the circuit board to the base, wherein when the fixing member and the electrode are engaged, the wire pattern and the electrode are electrically connected through the fixing member;
wherein, when the electrode is mounted in the second through hole, a tip of the electrode is positioned on substantially a same plane as the front surface of the base, and a base end of the electrode is disposed to protrude from the rear surface of the base.

### Claim 2 (depends on 1)

The circuit board fixing structure of claim 1, wherein an end of the electrode at a side of the circuit board is fitted with the first through hole.

### Claim 3 (depends on 2)

The circuit board fixing structure of claim 2, wherein the base has conductivity and wherein the circuit board fixing structure further has, in the second through hole, an insulating member configured to insulate the electrode and the base.

### Claim 4 (depends on 3)

The circuit board fixing structure of claim 3, wherein the multiple electrodes are provided, and the insulating member is formed to support the multiple electrodes.

### Claim 5 (depends on 1)

The circuit board fixing structure of claim 1, wherein the base has conductivity and wherein the circuit board fixing structure further has, in the second through hole, an insulating member configured to insulate the electrode and the base.

### Claim 6 (depends on 5)

The circuit board fixing structure of claim 5, wherein the multiple electrodes are provided, and the insulating member is formed to support the multiple electrodes.

### Claim 7 (depends on 1)

The circuit board fixing structure of claim 1, wherein the base has insulation.

### Claim 8 (depends on 1)

The circuit board fixing structure of claim 1, wherein the fixing member is a screw, and the electrode has a screw hole thread-coupled to the screw.

### Claim 9 (depends on 1)

The circuit board fixing structure of claim 1, wherein the base is a heat sink configured to cool the circuit board.

### Claim 10 (depends on 1)

The circuit board fixing structure of claim 1, wherein the rear surface of the circuit board is in contact with the front surface of the base.

### Claim 11

A light irradiation device comprising:
a circuit board fixing structure configured to fix a circuit board onto a surface of a base; and
multiple light emitting elements disposed on the circuit board,
wherein the circuit board fixing structure comprises,
a wire pattern formed on a surface of the circuit board;
a first through hole penetrating from a front surface to a rear surface of the circuit board;
a second through hole penetrating from a front surface to a rear surface of the base so as to communicate with the first through hole;
an electrode penetratively inserted into the second through hole; and
a fixing member engaged with the electrode mounted on the surface of the circuit board and configured to fix the circuit board to the base, wherein when the fixing member and the electrode are engaged, the wire pattern and the electrode are electrically connected through the fixing member;
wherein, when the electrode is mounted in the second through hole, a tip of the electrode is positioned on substantially a same plane as the front surface of the base, and a base end of the electrode is disposed to protrude from the rear surface of the base.

### Claim 12 (depends on 11)

The light irradiation device of claim 11, wherein light emitted from the light emitting element is light having a wavelength in an ultraviolet region.

### Claim 13 (depends on 11)

The light irradiation device of claim 11, wherein an end of the electrode at a side of the circuit board is fitted with the first through hole.

### Claim 14 (depends on 13)

The light irradiation device of claim 13, wherein the base has conductivity and wherein the circuit board fixing structure further has, in the second through hole, an insulating member configured to insulate the electrode and the base.

### Claim 15 (depends on 14)

The light irradiation device of claim 14, wherein the multiple electrodes are provided, and the insulating member is formed to support the multiple electrodes.

### Claim 16 (depends on 11)

The light irradiation device of claim 11, wherein the base has conductivity and wherein the circuit board fixing structure further has, in the second through hole, an insulating member configured to insulate the electrode and the base.

### Claim 17 (depends on 16)

The light irradiation device of claim 16, wherein the multiple electrodes are provided, and the insulating member is formed to support the multiple electrodes.

### Claim 18 (depends on 11)

The light irradiation device of claim 11, wherein the base has insulation.

### Claim 19 (depends on 11)

The light irradiation device of claim 11, wherein the fixing member is a screw, and the electrode has a screw hole thread-coupled to the screw.

### Claim 20 (depends on 11)

The light irradiation device of claim 11, wherein the base is a heat sink configured to cool the circuit board.
