# US 11,909,099 B2 · Antenna module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,909,099 B2 - Document ID: US11909099B2 - Status: Granted - Kind: B2 - Application number: 17/517,874 - Filed: 2021-11-03 - Published: 2022-02-24 - Granted: 2024-02-20 - Earliest claimed: 2018-07-17 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Won Wook So; Jin Seon Park; Young Sik Hur; Jung Chul Gong; Yong Ho Baek - Web page: https://patentgrep.com/patent/US11909099B2 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/243: {with built-in antennas} - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q 21/08: the units being spaced along or adjacent to a rectilinear path {(waveguide fed H01Q21/0037)} - H10W 20/42: Vias, e.g. via plugs - H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/30: Die-attach connectors - H10W 72/90: Bond pads, in general - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 44/241: {for passive devices or passive elements} - H10W 44/248: {for antennas} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/655: Fan-out layouts - H10W 70/656: Fan-in layouts - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 90/00: Package configurations - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate. ## Claims ### Claim 1 An antenna module comprising: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance, wherein the antenna module further comprises a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate, wherein the semiconductor package includes a frame having a first through-hole, a first semiconductor chip of the at least one semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon, an encapsulant covering the first semiconductor chip and filling the first through-hole, and a connection structure disposed on the frame and the first active surface of the first semiconductor chip and including redistribution layers electrically connected to the first connection pads. ### Claim 2 (depends on 1) The antenna module of claim 1, wherein the electronic component has a thickness greater than a thickness of the at least one semiconductor chip. ### Claim 3 (depends on 1) The antenna module of claim 1, wherein the electronic component includes a passive component. ### Claim 4 (depends on 1) The antenna module of claim 1, wherein the connection substrate is a flexible printed circuit board (FPCB) or a rigid-flexible PCB (RFPCB) connected to the lower surface of the antenna substrate through a low melting point metal. ### Claim 5 (depends on 1) The antenna module of claim 1, wherein the connection substrate is a flexible printed circuit board (FPCB) or a rigid-flexible PCB (RFPCB) integrated with the antenna substrate. ### Claim 6 (depends on 1) The antenna module of claim 1, wherein the at least one semiconductor chip includes a radio frequency integrated circuit (RFIC) and a power management integrated circuit (PMIC). ### Claim 7 (depends on 6) The antenna module of claim 6, wherein at least one passive component is further embedded in the semiconductor package. ### Claim 8 (depends on 1) The antenna module of claim 1, wherein the electronic component is a power inductor (PI). ### Claim 9 (depends on 1) The antenna module of claim 1, wherein the thickness of the electronic component is greater than a thickness of the semiconductor package. ### Claim 10 (depends on 1) The antenna module of claim 1, wherein the semiconductor package includes the frame having the first through-hole, the first semiconductor chip disposed in the first through-hole and having the first active surface having the first connection pads disposed thereon and a first inactive surface opposing the first active surface, the encapsulant covering at least portions of each of the frame and the first inactive surface of the first semiconductor chip and filling at least portions of the first through-hole, and the connection structure disposed on the frame and the first active surface of the first semiconductor chip and including the redistribution layers electrically connected to the first connection pads. ### Claim 11 (depends on 10) The antenna module of claim 10, wherein the frame further has a second through-hole spaced apart from the first through-hole and a third through-hole spaced apart from the first through-hole and the second through-hole, a second semiconductor chip is disposed in the second through-hole, the second semiconductor chip having a second active surface having second connection pads disposed thereon and a second inactive surface opposing the second active surface, and a passive component is disposed in the third through-hole. ### Claim 12 (depends on 11) The antenna module of claim 11, wherein the frame includes a metal layer disposed on walls of the first through-hole, the second through-hole and the third through-hole and extending to a lower surface of the frame, and the semiconductor package further includes a backside metal layer disposed on a lower surface of the encapsulant and backside metal vias penetrating through the encapsulant and connecting the backside metal layer to the metal layer of the frame. ### Claim 13 (depends on 10) The antenna module of claim 10, wherein the frame includes an insulating layer, a first wiring layer disposed on an upper surface of the insulating layer, a second wiring layer disposed on a lower surface of the insulating layer, and connection vias penetrating through the insulating layer and electrically connecting the first wiring layer to the second wiring layer. ### Claim 14 (depends on 13) The antenna module of claim 13, wherein the semiconductor package further includes a backside wiring layer disposed on a lower surface of the encapsulant and backside connection vias penetrating through the encapsulant and connecting the backside wiring layer to the second wiring layer of the frame. ### Claim 15 (depends on 10) The antenna module of claim 10, wherein the frame includes a first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the first insulating layer, a second insulating layer disposed on the upper surface of the first insulating layer and covering the first wiring layer, a third wiring layer disposed on an upper surface of the second insulating layer, a third insulating layer disposed on the lower surface of the first insulating layer and covering the second wiring layer, a fourth wiring layer disposed on a lower surface of the third insulating layer, first connection vias penetrating through the first insulating layer and electrically connecting the first wiring layer to the second wiring layer, second connection vias penetrating through the second insulating layer and electrically connecting the first wiring layer to the third wiring layer, and third connection vias penetrating through the third insulating layer and electrically connecting the second wiring layer to the fourth wiring layer. ### Claim 16 (depends on 10) The antenna module of claim 10, wherein the frame includes a first insulating layer, a first wiring layer embedded in an upper side of the first insulating layer so that an upper surface of the first wiring layer is exposed, a second wiring layer disposed on a lower surface of the first insulating layer, a second insulating layer disposed on the lower surface of the first insulating layer and covering the second wiring layer, a third wiring layer disposed on a lower surface of the second insulating layer, first connection vias penetrating through the first insulating layer and electrically connecting the first wiring layer to the second wiring layer, and second connection vias penetrating through the second insulating layer and electrically connecting the second wiring layer to the third wiring layer. ### Claim 17 An antenna module comprising: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance, wherein the antenna module further comprises a connection substrate connected to the lower surface of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, the electronic component is disposed at the side of the antenna substrate and on the extension portion of the connection substrate, and the electronic component is electrically connected to an inner wiring layer of the antenna substrate through the connection substrate. ### Claim 18 (depends on 17) The antenna module of claim 17, wherein the electronic component is spaced apart from the semiconductor package by the predetermined distance on the extension portion of the connection substrate. ### Claim 19 (depends on 17) The antenna module of claim 17, wherein the thickness of the electronic component is greater than a thickness of the semiconductor package. ### Claim 20 An antenna module comprising: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, wherein the antenna module further comprises a connection substrate connected to a side surface of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, the electronic component is disposed at the side of the antenna substrate and on the extension portion of the connection substrate, and the electronic component is electrically connected to an inner wiring layer of the antenna substrate through the connection substrate.