# US 11,908,983 B2 · Display panel and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,908,983 B2 - Document ID: US11908983B2 - Status: Granted - Kind: B2 - Application number: 17/419,731 - Filed: 2021-05-26 - Published: 2023-05-18 - Granted: 2024-02-20 - Earliest claimed: 2021-02-01 - Applicants: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Inventors: Junling Liu - Web page: https://patentgrep.com/patent/US11908983B2 ## CPC - H10H 20/01: Manufacture or treatment - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10W 90/00: Package configurations - H10H 20/0363: {of optical field-shaping means} - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10H 20/853: characterised by their shape - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present application discloses a display panel and a manufacturing method thereof. The display panel manufacturing method includes forming an LED die including a sacrificial layer on an array substrate, and then coating black glue material on the array substrate. The black glue material covers the array substrate and a surface of the sacrificial layer away from the array substrate. Then, the black glue material and the sacrificial layer are heated, and the black glue material is cured to form a black glue layer such that the sacrificial layer is decomposed. The display panel and the manufacturing method thereof provided by the present application are for improving contrast of the display panel. ## Claims ### Claim 1 A display panel manufacturing method, comprising steps as follows: providing an array substrate, wherein the array substrate comprises a first surface and a second surface disposed oppositely; forming a light emitting diode (LED) die including a sacrificial layer on the first surface, wherein the LED die is disposed on the array substrate, and the sacrificial layer is disposed on a surface of the LED die away from the array substrate; coating a black glue material on the array substrate, wherein the black glue material covers the first surface and covers a surface of the sacrificial layer away from the array substrate; and heating the black glue material and the sacrificial layer under a predetermined temperature such that the black glue material is cured to form a black glue layer and the sacrificial layer is decomposed. ### Claim 2 (depends on 1) The display panel manufacturing method according to claim 1, wherein before the step of forming the LED die including the sacrificial layer on the first surface, the method further comprises: coating a material of the sacrificial layer on the LED die to form the LED die including the sacrificial layer. ### Claim 3 (depends on 2) The display panel manufacturing method according to claim 2, wherein the material of the sacrificial layer is citric acid colloid. ### Claim 4 (depends on 3) The display panel manufacturing method according to claim 3, wherein before the step of forming the LED die including the sacrificial layer on the first surface, the method further comprises: coating a precursor fluid of citric acid colloid on the LED die; and disposing the LED die in a vacuum dryer and stoving the LED die under a temperature of 80 degrees Celsius to 120 degrees Celsius to form the LED die including the sacrificial layer. ### Claim 5 (depends on 1) The display panel manufacturing method according to claim 1, wherein the step of forming the LED die including the sacrificial layer on the first surface comprises: forming the LED die including the sacrificial layer on the first surface by a die pick and place process, a die stabbing process, or a laser transferring process. ### Claim 6 (depends on 1) The display panel manufacturing method according to claim 1, wherein after the step of heating the black glue material and the sacrificial layer under the predetermined temperature, the method further comprises: performing a cleaning process and an air drying process on the surface of the LED die away from the array substrate. ### Claim 7 (depends on 6) The display panel manufacturing method according to claim 6, wherein after the step of performing the cleaning process and the air drying process on the surface of the LED die away from the array substrate, the method further comprises: forming a transparent glue layer on a surface of the black glue layer away from the array substrate, wherein the transparent glue layer covers the LED die. ### Claim 8 (depends on 6) The display panel manufacturing method according to claim 6, wherein the step of performing the cleaning process and the air drying process on the surface of the LED die away from the array substrate comprises: cleaning the array substrate by spraying or drenching; and air-drying a detergent remaining on the array substrate by a blower. ### Claim 9 (depends on 1) The display panel manufacturing method according to claim 1, wherein the predetermined temperature is greater than 140 degrees Celsius. ### Claim 10 (depends on 1) The display panel manufacturing method according to claim 1, wherein a thickness of the sacrificial layer ranges from 1 micron to 120 microns. ### Claim 11 (depends on 10) The display panel manufacturing method according to claim 10, wherein a coating thickness of the black glue material is three times less than the thickness of the sacrificial layer. ### Claim 12 (depends on 1) A display panel, wherein the display panel is manufactured by the display panel manufacturing method according to claim 1, the display panel comprises the array substrate, the LED die, and the black glue layer; the array substrate comprises the first surface and the second surface disposed oppositely; the LED die is disposed on the first surface; and the black glue layer is disposed on the first surface. ### Claim 13 (depends on 12) The display panel according to claim 12, wherein the display panel further comprises a transparent glue layer, and the transparent glue layer is disposed on a surface of the black glue layer away from the array substrate. ### Claim 14 A display panel manufacturing method, comprising steps as follows: providing an array substrate, wherein the array substrate comprises a first surface and a second surface disposed oppositely; coating a material of a sacrificial layer on a light emitting diode (LED) die to form the LED die including the sacrificial layer, wherein the LED die is disposed on the array substrate, and the sacrificial layer is disposed on a surface of the LED die away from the array substrate; coating a black glue material on the array substrate, wherein the black glue material covers the first surface and covers a surface of the sacrificial layer away from the array substrate; heating the black glue material and the sacrificial layer under a predetermined temperature such that the black glue material is cured to form a black glue layer and the sacrificial layer is decomposed; performing a cleaning process and an air drying process on the surface of the LED die away from the array substrate; and forming a transparent glue layer on a surface of the black glue layer away from the array substrate, wherein the transparent glue layer covers the LED die. ### Claim 15 (depends on 14) The display panel manufacturing method according to claim 14, wherein the material of the sacrificial layer is citric acid colloid. ### Claim 16 (depends on 14) The display panel manufacturing method according to claim 14, wherein the step of forming the LED die including the sacrificial layer on the first surface comprises: forming the LED die including the sacrificial layer on the first surface by a die pick and place process, a die stabbing process, or a laser transferring process. ### Claim 17 (depends on 14) The display panel manufacturing method according to claim 14, wherein the predetermined temperature is greater than 140 degrees Celsius. ### Claim 18 (depends on 14) The display panel manufacturing method according to claim 14, wherein a thickness of the sacrificial layer ranges from 1 micron to 120 microns. ### Claim 19 (depends on 18) The display panel manufacturing method according to claim 18, wherein a coating thickness of the black glue material is three times less than the thickness of the sacrificial layer. ### Claim 20 (depends on 14) The display panel manufacturing method according to claim 14, wherein the predetermined temperature is greater than 140 degrees Celsius.