# US 11,908,982 B2 · Light-emitting diode package and electronic device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,908,982 B2 - Document ID: US11908982B2 - Status: Granted - Kind: B2 - Application number: 17/243,816 - Filed: 2021-04-29 - Published: 2022-04-07 - Granted: 2024-02-20 - Earliest claimed: 2020-10-06 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Jongsup Song; Tetsuo Ariyoshi; Taehyun Lee - Web page: https://patentgrep.com/patent/US11908982B2 ## CPC - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/841: Reflective coatings, e.g. dielectric Bragg reflectors - H10H 20/8506: {Containers} - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A light-emitting diode (LED) package includes an LED chip on a substrate, an adhesive phosphor film on the LED chip, a cell lens on the adhesive phosphor film, and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens, a lateral surface of the lateral reflective layer being coplanar with a lateral surface of the substrate. ## Claims ### Claim 1 A light-emitting diode (LED) package, comprising: a substrate; an LED chip on the substrate; an adhesive phosphor film on the LED chip; a cell lens on the adhesive phosphor film; and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens, a lateral surface of the lateral reflective layer being coplanar with a lateral surface of the substrate. ### Claim 2 (depends on 1) The LED package as claimed in claim 1, wherein the adhesive phosphor film contacts the LED chip, and the cell lens partially contacts an upper surface of the adhesive phosphor film. ### Claim 3 (depends on 1) The LED package as claimed in claim 1, wherein the lateral reflective layer includes a white resin. ### Claim 4 (depends on 1) The LED package as claimed in claim 1, wherein the lateral reflective layer includes Si and TiO2. ### Claim 5 (depends on 1) The LED package as claimed in claim 1, wherein the lateral reflective layer contacts a lower surface of the adhesive phosphor film. ### Claim 6 (depends on 1) The LED package as claimed in claim 1, wherein the respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens are coplanar with each other. ### Claim 7 (depends on 1) The LED package as claimed in claim 1, wherein the lateral reflective layer contacts an upper surface of the LED chip. ### Claim 8 (depends on 1) The LED package as claimed in claim 1, further comprising an air gap between the cell lens and the adhesive phosphor film. ### Claim 9 (depends on 1) The LED package as claimed in claim 1, wherein an upper surface of the lateral reflective layer is coplanar with an upper surface of the cell lens. ### Claim 10 A light-emitting diode (LED) package, comprising: a substrate; an LED chip electrically connected to the substrate; an adhesive phosphor film contacting an upper surface of the LED chip; a cell lens partially contacting an upper surface of the adhesive phosphor film, the cell lens including a Fresnel lens; an air gap between the cell lens and the adhesive phosphor film; and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens. ### Claim 11 (depends on 10) The LED package as claimed in claim 10, wherein the cell lens further includes an adhesive portion contacting the adhesive phosphor film, the air gap being surrounded by the adhesive portion. ### Claim 12 (depends on 10) The LED package as claimed in claim 10, wherein the cell lens includes: a first surface facing the adhesive phosphor film; and a second surface opposite to the first surface, the first surface including grooves recessed toward the second surface. ### Claim 13 (depends on 12) The LED package as claimed in claim 12, wherein the grooves are concentric with respect to a first direction perpendicular to the substrate. ### Claim 14 (depends on 12) The LED package as claimed in claim 12, wherein a height of the grooves is in a range of 35 μm to 65 μm. ### Claim 15 (depends on 10) The LED package as claimed in claim 10, wherein the cell lens further includes a vent hole in fluid communication with the air gap, the vent hole being in a center of the cell lens. ### Claim 16 (depends on 15) The LED package as claimed in claim 15, wherein the vent hole has a planar shape of a circle. ### Claim 17 (depends on 16) The LED package as claimed in claim 16, wherein a diameter of the vent hole is in a range of 50 μm to 100 μm. ### Claim 18 An electronic device, comprising: a cover glass including an optical window; and a light-emitting diode (LED) package configured to emit light through the optical window, the LED package including: a substrate, an LED chip electrically connected to the substrate; an adhesive phosphor film contacting an upper surface of the LED chip; a cell lens partially contacting an upper surface of the adhesive phosphor film, the cell lens including a vent hole in a center of the cell lens, the vent hole having a diameter of 50 μm to 100 μm; an air gap between the cell lens and the adhesive phosphor film, the air gap being in fluid communication with the vent hole, and a diameter of the air gap being in a range of 0.5 mm to 1.4 mm; and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens. ### Claim 19 (depends on 18) The electronic device as claimed in claim 18, wherein a diameter of the optical window is equal to or less than 2 mm. ### Claim 20 (depends on 18) The electronic device as claimed in claim 18, further comprising an ambient light sensor electrically connected to the substrate, the ambient light sensor being adjacent to the LED chip, and the ambient light sensor configured to sense ambient light around the electronic device through the optical window.