# US 11,908,971 B1 · Photovoltaic module and manufacturing method thereof

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,908,971 B1
- Document ID: US11908971B1
- Status: Granted
- Kind: B1
- Application number: 18/078,676
- Filed: 2022-12-09
- Granted: 2024-02-20
- Earliest claimed: 2022-10-26
- Assignees: Shanghai Jinko Green Energy Enterprise Management Co., Ltd.; Zhejiang Jinko Solar Co., Ltd.
- Applicants: Shanghai Jinko Green Energy Enterprise Management Co., Ltd.; Zhejiang Jinko Solar Co., Ltd.
- Inventors: Zhiqiu Guo; Yidong Hu; Yichao Yao
- Web page: https://patentgrep.com/patent/US11908971B1

## CPC

- H02S 40/34: comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
- B23K 1/0056: {soldering by means of beams, e.g. lasers, electron beams [EB]}
- H10F 19/00: Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F 77/955: {for photovoltaic devices}
- Y02E 10/50: Photovoltaic [PV] energy
- H02S: GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES (obtaining electrical energy from radioactive sources G21H1/12; light sensitive inorganic semiconductor devices H10F; light sensitive organic semiconductor devices H10K30/00; thermoelectric devices H10N10/00; pyroelectric devices H10N15/00)
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

A photovoltaic module, including a laminate including a solder strip; and a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering. The plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region. A soldering seam formed by laser soldering includes a first soldering seam and a second soldering seam. The first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate. The second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate.

## Claims

### Claim 1

A photovoltaic module, comprising:
a laminate including a solder strip; and
a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering;
wherein the plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region; and
wherein a soldering seam formed by the laser soldering includes a first soldering seam and a second soldering seam, the first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate, the second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate.

### Claim 2 (depends on 1)

The photovoltaic module according to claim 1, wherein the soldering seam formed by the laser soldering further comprises a third soldering seam having one part located in the first region and the other part located in the second region; and
along the thickness direction of the laminate, the one part of the third soldering seam located in the first region extends through the solder strip into the plate, and the other part located in the second region extends directly into the plate.

### Claim 3 (depends on 2)

The photovoltaic module according to claim 2, wherein the plate is provided with at least 6 soldering seams.

### Claim 4 (depends on 2)

The photovoltaic module according to claim 2, wherein a sum of a number of the first soldering seam and a number of the third soldering seam is greater than or equal to three.

### Claim 5 (depends on 2)

The photovoltaic module according to claim 2, wherein, along the thickness direction of the laminate, a ratio n1 of an extension depth of the one part of the third soldering seam located in the first region within the plate to a thickness of the plate satisfies: 5% n1≤60%.

### Claim 6 (depends on 2)

The photovoltaic module according to claim 2, wherein, along the thickness direction of the laminate, a ratio n2 of an extension depth of the other part of the third soldering seam located in the second region within the plate to a thickness of the plate satisfies: 40% n2≤80%.

### Claim 7 (depends on 1)

The photovoltaic module according to claim 1, wherein, along the thickness direction of the laminate, a ratio of an extension depth of the first soldering seam within the plate to the thickness of the plate is in a range of 5% to 60%.

### Claim 8 (depends on 2)

The photovoltaic module according to claim 2, wherein, along the thickness direction of the laminate, a ratio of an extension depth of the first soldering seam within the plate to the thickness of the plate is in a range of 5% to 60%.

### Claim 9 (depends on 5)

The photovoltaic module according to claim 5, wherein, along the thickness direction of the laminate, a ratio of an extension depth of the first soldering seam within the plate to the thickness of the plate is in a range of 5% to 60%.

### Claim 10 (depends on 1)

The photovoltaic module according to claim 1, wherein, along the thickness direction of the laminate, a ratio of an extension depth of the second soldering seam within the plate to the thickness of the plate is in a range of 40% to 80%.

### Claim 11 (depends on 2)

The photovoltaic module according to claim 2, wherein, along the thickness direction of the laminate, a ratio of an extension depth of the second soldering seam within the plate to the thickness of the plate is in a range of 40% to 80%.

### Claim 12 (depends on 6)

The photovoltaic module according to claim 6, wherein, along the thickness direction of the laminate, a ratio of an extension depth of the second soldering seam within the plate to the thickness of the plate is in a range of 40% to 80%.

### Claim 13 (depends on 1)

The photovoltaic module according to claim 1, wherein a width of the solder strip is L1, a width of the plate is L2, and L1, L2 satisfy: 0.2≤L1/L2≤0.8.

### Claim 14 (depends on 2)

The photovoltaic module according to claim 2, wherein a width of the solder strip is L1, a width of the plate is L2, and L1, L2 satisfy: 0.2≤L1/L2≤0.8.

### Claim 15 (depends on 1)

The photovoltaic module according to claim 1, wherein the junction box is arranged on a central line of a long side of the laminate.

### Claim 16

A method for manufacturing a photovoltaic module, wherein the photovoltaic module comprises
a laminate including a solder strip; and a junction box arranged on a surface of the laminate and including a plate connected to the solder strip by laser soldering; wherein the plate has a first region and a second region, in which a region covered by the solder strip on the plate is the first region, and a region not covered by the solder strip on the plate is the second region; and wherein a soldering seam formed by the laser soldering includes a first soldering seam and a second soldering seam, the first soldering seam is located in the first region, and the first soldering seam extends through the solder strip into the plate along a thickness direction of the laminate, the second soldering seam is located in the second region, and the second soldering seam extends directly into the plate along the thickness direction of the laminate,
wherein the method for manufacturing a photovoltaic module comprises:
providing the laminate;
arranging the junction box on the laminate so that the solder strip of the laminate extends into the junction box;
acquiring a position of the plate;
pressing the solder strip against the plate in the junction box;
laser-soldering the solder strip and the plate by using a laser head, so that a first soldering seam formed after soldering extends through the solder strip into the plate, and a second soldering seam extends directly into the plate; and
visually inspecting the first soldering seam.

### Claim 17 (depends on 16)

The method for manufacturing a photovoltaic module according to claim 16, wherein the acquiring a position of the plate comprises:
photographing the junction box; and
acquiring the position of the plate according to a photographing result.

### Claim 18 (depends on 16)

The method for manufacturing a photovoltaic module according to claim 16, wherein
during laser-soldering the solder strip and the plate by using a laser head, the laser head emits lasers to the first region and the second region.

### Claim 19 (depends on 16)

The method for manufacturing a photovoltaic module according to claim 16, wherein, during the laser-soldering the solder strip and the plate by using a laser head, a power P of lasers emitted by the laser head satisfies: 550 W≤P≤750 W; and a soldering speed v of the laser head satisfies: 60 mm/s≤v≤100 mm/s.

### Claim 20 (depends on 16)

The method for manufacturing a photovoltaic module according to claim 16, wherein the visually inspecting the first soldering seam comprises:
photographing the solder strip; and
detecting whether a width d of a soldering seam on the solder strip satisfies: 0.3 mm≤d≤0.4 mm.