# US 11,908,879 B2 · Semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,908,879 B2 - Document ID: US11908879B2 - Status: Granted - Kind: B2 - Application number: 17/547,787 - Filed: 2021-12-10 - Published: 2022-04-21 - Granted: 2024-02-20 - Earliest claimed: 2017-06-29 - Assignees: Sony Semiconductor Solutions Corporation - Applicants: Sony Semiconductor Solutions Corporation - Inventors: Hajime Yamagishi - Web page: https://patentgrep.com/patent/US11908879B2 ## CPC - H10F 39/809: {of hybrid image sensors} - H10F 39/018: {of hybrid image sensors} - H10F 39/182: {Colour image sensors} - H10F 39/199: {Back-illuminated image sensors} - H10F 39/811: {Interconnections} - H10F 39/18: Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors - H10F 39/1935: {of the hybrid type} - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract An imaging device includes a first substrate including a pixel array and a first multilayer wiring layer. The first multilayer wiring layer includes a first wiring that receives electrical signals based on electric charge generated by at least one photoelectric conversion unit, and a plurality of second wirings. The imaging device includes a second substrate including a second multilayer wiring layer and a logic circuit that processes the electrical signals. The second multilayer wiring layer includes a third wiring bonded to the first wiring, and a plurality of fourth wirings. At least one of the plurality of fourth wirings being bonded to at least one of the plurality of second wirings. The second multilayer wiring layer includes at least one fifth wiring that is connected to the plurality of fourth wirings and that receives a power supply signal. ## Claims ### Claim 1 An imaging device, comprising: a first substrate, including a pixel array and a first multilayer wiring layer, the first multilayer wiring layer including: a plurality of first substrate wirings disposed in a first interlayer insulating film; and a plurality of first substrate connection wirings; and a second substrate including a second multilayer wiring layer and a logic circuit, the second multilayer wiring layer including: a plurality of second substrate wirings disposed in a second interlayer insulating film; a plurality of second substrate connection wirings; and a plurality of intermediate wirings connecting at least some of the connection wirings to at least one of the wirings disposed in the interlayer insulating film, wherein at least one of the first substrate connection wirings is bonded to at least one of the second substrate connection wirings along a bonding surface between the first and second substrates, and wherein the intermediate wirings have an aspect ratio that is greater than 1 in a plan view taken along a line that is perpendicular to a plane of the bonding surface. ### Claim 2 (depends on 1) The imaging device of claim 1, wherein the intermediate wirings are trench shaped. ### Claim 3 (depends on 1) The imaging device of claim 1, wherein a first intermediate wiring included in the plurality of intermediate wirings connects a first connection wiring included in the plurality of second substrate connection wirings to a first wiring included in the plurality of second substrate wirings, and wherein a second intermediate wiring included in the plurality of intermediate wirings connects a second connection wiring included in the plurality of second substrate connection wirings to the first wiring included in the plurality of second substrate wirings. ### Claim 4 (depends on 3) The imaging device of claim 3, wherein each connection wiring included in the plurality of second substrate connection wirings has a width dimension in a first direction parallel to the plane of the bonding surface, wherein each intermediate wiring included in the plurality of intermediate wirings has a width dimension in the first direction parallel to the plane of the bonding surface, wherein a width of the first connection wiring is greater than a width of the first intermediate wiring, and wherein a width of the second connection wiring is greater than a width of the second intermediate wiring. ### Claim 5 (depends on 4) The imaging device of claim 4, wherein the first wiring included in the plurality of second substrate wirings has a width dimension in the first direction parallel to the plane of the bonding surface, wherein a width of the first wiring included in the plurality of second substrate wirings is greater than the width of any of the intermediate wirings, the first connection wiring, or the second connection wiring. ### Claim 6 (depends on 4) The imaging device of claim 4, wherein each intermediate wiring included in the plurality of intermediate wirings has a length dimension in a second direction parallel to the plane of the bonding surface, wherein the first direction parallel to the plane of the bonding surface is perpendicular to the second direction parallel to the plane of the bonding surface, wherein a length of the intermediate wirings included in the plurality of intermediate wirings is greater than a width of the intermediate wirings. ### Claim 7 (depends on 6) The imaging device of claim 6, wherein each connection wiring included in the plurality of second substrate connection wirings has a length dimension in the second direction parallel to the plane of the bonding surface, wherein a length of each of the connection wirings included in the plurality of second substrate connection wirings is greater than a width of the connection wiring. ### Claim 8 (depends on 7) The imaging device of claim 7, wherein a width of the first connection wiring is greater than a width of the first intermediate wiring, and wherein a width of the second connection wiring is greater than a width of the second intermediate wiring. ### Claim 9 (depends on 7) The imaging device of claim 7, wherein each connection wiring included in the plurality of first substrate connection wirings has a width dimension in the first direction parallel to the plane of the bonding surface, wherein each connection wiring included in the plurality of first substrate connection wirings has a length dimension in the second direction parallel to the plane of the bonding surface, wherein a length of each of the connection wirings included in the plurality of first substrate connection wirings is greater than a width of the connection wiring. ### Claim 10 (depends on 1) The imaging device of claim 1, further comprising: a third substrate bonded to the second substrate, wherein the third substrate includes a memory. ### Claim 11 An imaging device, comprising: a first substrate, including a pixel array and a first multilayer wiring layer, the first multilayer wiring layer including: a plurality of first substrate wirings disposed in a first interlayer insulating film; and a plurality of first substrate connection wirings; and a second substrate including a second multilayer wiring layer and a logic circuit, the second multilayer wiring layer including: a plurality of second substrate wirings disposed in a second interlayer insulating film; a plurality of second substrate connection wirings; and a plurality of intermediate wirings connecting at least some of the connection wirings to at least one of the wirings disposed in the interlayer insulating film, wherein at least one of the first substrate connection wirings is bonded to at least one of the second substrate connection wirings, and wherein the intermediate wirings have a width dimension in a first direction parallel to a plane of a front surface side of the first substrate and a length dimension in a second direction parallel to the plane of the front surface side of the first substrate, and wherein the length of the intermediate wirings is greater than a width of the intermediate wirings. ### Claim 12 (depends on 11) The imaging device of claim 11, wherein the intermediate wirings are trench shaped. ### Claim 13 (depends on 11) The imaging device of claim 11, wherein a first intermediate wiring included in the plurality of intermediate wirings connects a first connection wiring included in the plurality of second substrate connection wirings to a first wiring included in the plurality of second substrate wirings, and wherein a second intermediate wiring included in the plurality of intermediate wirings connects a second connection wiring included in the plurality of second substrate connection wirings to the first wiring included in the plurality of second substrate wirings. ### Claim 14 (depends on 13) The imaging device of claim 13, wherein each connection wiring included in the plurality of second substrate connection wirings has a width dimension in the first direction parallel to the plane of the front surface, wherein a width of the first connection wiring is greater than a width of the first intermediate wiring, and wherein a width of the second connection wiring is greater than a width of the second intermediate wiring. ### Claim 15 (depends on 14) The imaging device of claim 14, wherein the first wiring included in the plurality of second substrate wirings has a width dimension in the first direction parallel to the plane of the front surface, wherein a width of the first wiring included in the plurality of second substrate wirings is greater than the width of any of the intermediate wirings, the first connection wiring, or the second connection wiring. ### Claim 16 (depends on 14) The imaging device of claim 14, wherein each connection wiring included in the plurality of second substrate connection wirings has a length dimension in the second direction parallel to the plane of the front surface, and wherein a length of each of the connection wirings included in the plurality of second substrate connection wirings is greater than a width of the connection wiring. ### Claim 17 (depends on 16) The imaging device of claim 16, wherein a width of the first connection wiring is greater than a width of the first intermediate wiring, and wherein a width of the second connection wiring is greater than a width of the second intermediate wiring. ### Claim 18 (depends on 17) The imaging device of claim 17, wherein each connection wiring included in the plurality of first substrate connection wirings has a width dimension in the first direction parallel to the plane of the front surface, wherein each connection wiring included in the plurality of first substrate connection wirings has a length dimension in the second direction parallel to the plane of the front surface, wherein a length of each of the connection wirings included in the plurality of first substrate connection wirings is greater than a width of the connection wiring. ### Claim 19 (depends on 11) The imaging device of claim 11, further comprising: a third substrate bonded to the second substrate, wherein the third substrate includes a memory.