# US 11,908,828 B2 · Contaminant control in thermocompression bonding of semiconductors and associated systems and methods

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- Number: US 11,908,828 B2
- Document ID: US11908828B2
- Status: Granted
- Kind: B2
- Application number: 17/845,635
- Filed: 2022-06-21
- Published: 2022-10-06
- Granted: 2024-02-20
- Earliest claimed: 2019-11-22
- Assignees: Micron Technology, Inc.
- Applicants: Micron Technology, Inc.
- Inventors: Brandon P. Wirz; Jaekyu Song; Sui Chi Huang
- Web page: https://patentgrep.com/patent/US11908828B2

## CPC

- H10W 72/073: {of die-attach connectors}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10P 72/0431: {Apparatus for thermal treatment}
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H10W 72/0198: {batch processes}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07178: {Means for aligning}
- H10W 72/07183: {Means for monitoring}
- H10W 72/07231: {Techniques}
- H10W 72/07232: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/07341: {Controlling the bonding environment, e.g. atmosphere composition or temperature}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Systems and methods for controlling contamination during thermocompression bonding are provided herein. The tool generally includes a bondhead having a first channel extending in a lateral direction from a first port along a second side toward a perimeter of the bondhead. In several examples, the bondhead includes a second channel fluidly coupled to a second port and extending in a lateral direction along an inset surface of the bondhead, where the second channel at least partially surrounds the first channel. In other examples, the tool includes a vacuum manifold having a vacuum opening positioned laterally outward from the bondhead. A first flow unit is coupled to the first channel and is configured to withdraw air. A second flow unit is coupled to the second port or the manifold to withdraw fluid and prevent outgassing bonding materials from entering the first channel, depositing on the bondhead, and/or contaminating neighboring semiconductor components.

## Claims

### Claim 1

A method for inhibiting vaporized bonding material from entering a vacuum system, the method comprising:
withdrawing air, via a first flow unit, from a first port of a bondhead having a first side and a second side spaced at a distance from the first side and defining a thickness of the bondhead, wherein the first port is fluidly coupled to a first channel of the bondhead extending in a lateral direction from the port along the second side toward a perimeter of the bondhead, the first channel forming an elongate opening in the second side of the bondhead; and
withdrawing air, via a second flow unit, from a second port, wherein the second port is fluidly coupled to a second conduit positioned laterally outward from the first channel such that contaminants flow into the second conduit,
wherein the second conduit is a vacuum manifold separate from and disposed around the bondhead, the vacuum manifold having a portion extending along and spaced apart from a side of the bondhead and positioned laterally outward from the perimeter of the bondhead, the second conduit having a second vacuum opening positioned laterally outward from the bondhead.

### Claim 2 (depends on 1)

The method of claim 1, wherein the first flow unit includes a vacuum unit that creates a first pressure in the first channel, and wherein the second flow unit includes a vacuum unit that creates a second pressure in the second conduit.

### Claim 3 (depends on 2)

The method of claim 2, wherein an absolute value of the first pressure is greater than an absolute value of the second pressure.

### Claim 4 (depends on 1)

The method of claim 1, wherein the bondhead is positioned over a die and a bonding material, and wherein withdrawing air from the second conduit at least partially prevents vaporized bonding material from entering the first channel.

### Claim 5 (depends on 1)

The method of claim 1, further comprising:
positioning the bondhead over a die at least partially surrounded by a bonding material,
wherein withdrawing air via the second flow unit includes preventing vapor from the bonding material from flowing through the first port.

### Claim 6 (depends on 1)

The method of claim 1, wherein:
the first port extends from the first side of the bondhead to an intermediate depth of the bondhead, and
the first channel extends from the second side of the bondhead to the intermediate depth of the bondhead.