# US 11,908,815 B2 · Semiconductor device package

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- Number: US 11,908,815 B2
- Document ID: US11908815B2
- Status: Granted
- Kind: B2
- Application number: 17/724,422
- Filed: 2022-04-19
- Published: 2022-08-04
- Granted: 2024-02-20
- Earliest claimed: 2020-03-27
- Assignees: Advanced Semiconductor Engineering, Inc.
- Applicants: Advanced Semiconductor Engineering, Inc.
- Inventors: Wen Hung Huang
- Web page: https://patentgrep.com/patent/US11908815B2

## CPC

- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 74/016: {using moulds}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 44/248: {for antennas}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

The present disclosure provides a semiconductor device package. The semiconductor device package includes an antenna layer, a first circuit layer and a second circuit layer. The antenna layer has a first coefficient of thermal expansion (CTE). The first circuit layer is disposed over the antenna layer. The first circuit layer has a second CTE. The second circuit layer is disposed over the antenna layer. The second circuit layer has a third CTE. A difference between the first CTE and the second CTE is less than a difference between the first CTE and the third CTE.

## Claims

### Claim 1

An antenna structure, comprising:
an antenna circuit comprising a first dielectric layer, a first antenna disposed on the first dielectric layer and a second antenna disposed on the first dielectric layer, wherein the first dielectric layer has a first dielectric constant (Dk) and the first antenna and the second antenna are configured to be operated with different frequencies; and
a first circuit disposed over the antenna circuit and comprising a second dielectric layer, wherein the second dielectric layer has a second Dk greater than the first Dk of the first dielectric layer.

### Claim 2 (depends on 1)

The antenna structure of claim 1, further comprises:
an adhesive layer disposed between the antenna circuit and the first circuit.

### Claim 3 (depends on 2)

The antenna structure of claim 2, further comprises:
a conductive via penetrating the adhesive layer and electrically connected with the antenna circuit and the first circuit.

### Claim 4 (depends on 1)

The antenna structure of claim 1, further comprises:
an electronic component disposed on the first circuit; and
a package body disposed on the first circuit and encapsulating the electronic component.

### Claim 5 (depends on 1)

The antenna structure of claim 1, further comprises:
a second circuit disposed over the antenna circuit and comprising a third dielectric layer, wherein the third dielectric layer has a third Dk less than the second Dk of the second dielectric layer.

### Claim 6 (depends on 5)

The antenna structure of claim 5, further comprises:
a first conductive via disposed between the antenna circuit and the first circuit and electrically connected with the antenna circuit and the first circuit; and
a second conductive via disposed between the antenna circuit and the second circuit and electrically connected with the antenna circuit and the second circuit.

### Claim 7 (depends on 5)

The antenna structure of claim 5, wherein the first antenna is disposed under the first circuit and the second antenna is disposed under the second circuit.

### Claim 8 (depends on 1)

The antenna structure of claim 1, further comprises:
a third antenna disposed under the first antenna and electrically coupled with the first antenna; and
a fourth antenna disposed under the second antenna and electrically coupled with the second antenna.

### Claim 9

An antenna structure, comprising:
an antenna layer;
a first circuit layer; and
a substrate disposed between the antenna layer and the first circuit layer, wherein the antenna layer and the first circuit layer are collectively configured to mitigate a warpage of the antenna structure.

### Claim 10 (depends on 9)

The antenna structure of claim 9, wherein the antenna layer has a first coefficient of thermal expansion (CTE) and the first circuit layer has a second CTE substantially equal to the first CTE of the antenna layer.

### Claim 11 (depends on 9)

The antenna structure of claim 9, wherein the antenna layer comprises a first dielectric layer having a first Dk and the first circuit layer comprises a second dielectric layer having a second Dk substantially equal to the first Dk of the first dielectric layer.

### Claim 12 (depends on 11)

The antenna structure of claim 11, wherein the antenna layer comprises a first set of dielectric layers including the first dielectric layer and the first circuit layer comprises a second set of dielectric layers including the second dielectric layer, and wherein the number of the first set of dielectric layers is less than the number of the second set of dielectric layers.

### Claim 13 (depends on 9)

The antenna structure of claim 9, further comprises:
a second circuit layer disposed over the antenna layer, wherein the first circuit layer has a first CTE and the second circuit layer has a second CTE greater than the first CTE of the first circuit layer.

### Claim 14 (depends on 9)

The antenna structure of claim 9, further comprises:
a plurality of feeding vias penetrating the substrate and electrically connected with the antenna layer and the first circuit layer.

### Claim 15 (depends on 9)

The antenna structure of claim 9, wherein the antenna layer comprises a first dielectric layer having a first rigidity and the first circuit layer comprises a second dielectric layer having a second rigidity substantially equal to the first rigidity of the first dielectric layer.

### Claim 16

A an antenna structure, comprising:
an antenna circuit comprising a first dielectric layer having a first rigidity;
a first circuit disposed over the antenna circuit and comprising a second dielectric layer having a second rigidity; and
a second circuit disposed over the antenna circuit and comprising a third dielectric layer having a third rigidity;
wherein a difference between the first rigidity and the second rigidity is less than a difference between the first rigidity and the third rigidity.

### Claim 17 (depends on 16)

The antenna structure of claim 16, wherein the first circuit comprises a first set of dielectric layers including the second dielectric layer and the second circuit comprises a second set of dielectric layers including the third dielectric layer, and wherein the number of the first set of dielectric layers is different from the number of the second set of dielectric layers.

### Claim 18 (depends on 17)

The antenna structure of claim 17, wherein the first circuit comprises a plurality of first conductive layers and the second circuit comprises a plurality of second conductive layers, and wherein the number of the plurality of first conductive layers of the first circuit is different from the number of the plurality of second conductive layers of the second circuit.

### Claim 19 (depends on 16)

The antenna structure of claim 16, wherein the second dielectric layer and the third dielectric layer include the same material.

### Claim 20 (depends on 16)

The antenna structure of claim 16, further comprises:
a fourth dielectric layer disposed between the antenna circuit and the first circuit, wherein a thickness of the fourth dielectric layer is greater than a thickness of the first dielectric layer and greater than a thickness of the second dielectric layer.