# US 11,908,789 B2 · Selective formation of conductor nanowires

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- Number: US 11,908,789 B2
- Document ID: US11908789B2
- Status: Granted
- Kind: B2
- Application number: 16/691,898
- Filed: 2019-11-22
- Published: 2020-03-19
- Granted: 2024-02-20
- Earliest claimed: 2014-06-13
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Chao-Hsien Peng; Hsiang-Huan Lee; Shau-Lin Shue
- Web page: https://patentgrep.com/patent/US11908789B2

## CPC

- H10W 20/42: Vias, e.g. via plugs
- H10P 14/43: Chemical deposition, e.g. chemical vapour deposition [CVD]
- H10P 50/71: {using masks for conductive or resistive materials}
- H10W 20/057: {by selectively depositing, e.g. by using selective CVD or plating}
- H10W 20/063: {by forming conductive members before forming protective insulating material}
- H10W 20/0636: {the conductive members being on sidewalls}
- H10W 20/425: {Barrier, adhesion or liner layers}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method includes etching a mandrel layer to form mandrel strips, and selectively depositing metal lines on sidewalls of the mandrel strips. During the selective deposition, top surfaces of the mandrel strips are masked by dielectric masks. The method further includes removing the mandrel layer and the dielectric masks, filling spaces between the metal lines with a dielectric material, forming via openings in the dielectric material, with top surfaces of the metal lines exposed to the via openings, and filling the via openings with a conductive material to form vias.

## Claims

### Claim 1

An integrated circuit structure comprising:
a first metal line over a semiconductor substrate, the first metal line being ring-shaped in a top-down view, the first metal line comprising a first inner sidewall and a second inner sidewall opposite the first inner sidewall, wherein the first inner sidewall has a constant slope from a top portion of the first inner sidewall to a bottom portion of the first inner sidewall, wherein the second inner sidewall has a constant slope from a top portion of the second inner sidewall to a bottom portion of the second inner sidewall, and wherein a distance between the top portion of the first inner sidewall and the top portion of the second inner sidewall is less than a distance between the bottom portion of the first inner sidewall and the bottom portion of the second inner sidewall;
a dielectric layer surrounding the first metal line, wherein the first metal line encircles a portion of the dielectric layer, wherein a top surface of the dielectric layer is disposed above a top surface of the first metal line; and
a conductive via extending through the dielectric layer and connected to the first metal line.

### Claim 2 (depends on 1)

The integrated circuit structure of claim 1, wherein the first metal line further comprises a first outer sidewall opposite the first inner sidewall, wherein the first inner sidewall and the first outer sidewall are tilted at an angle to the semiconductor substrate.

### Claim 3 (depends on 2)

The integrated circuit structure of claim 2, wherein the first metal line further comprises a second outer sidewall opposite the second inner sidewall, wherein the second inner sidewall and the second outer sidewall are tilted at the angle to the semiconductor substrate in a direction opposite the first inner sidewall and the first outer sidewall.

### Claim 4 (depends on 1)

The integrated circuit structure of claim 1, further comprising:
an integrated circuit device over the semiconductor substrate;
an interlayer dielectric over the integrated circuit device, wherein the dielectric layer is disposed over the interlayer dielectric; and
a contact plug extending through the interlayer dielectric, the contact plug connecting the first metal line to the integrated circuit device.

### Claim 5 (depends on 4)

The integrated circuit structure of claim 4, further comprising an etch stop layer between the interlayer dielectric and the dielectric layer, wherein top surfaces of the etch stop layer and the contact plug are coplanar.

### Claim 6 (depends on 1)

The integrated circuit structure of claim 1, wherein top surfaces of the conductive via and the dielectric layer are coplanar.

### Claim 7 (depends on 1)

The integrated circuit structure of claim 1, further comprising a second metal line over the semiconductor substrate and adjacent the first metal line, the second metal line being ring-shaped in the top-down view, the first metal line comprising a first outer sidewall opposite the first inner sidewall, the second metal line comprising a second outer sidewall facing the first outer sidewall, wherein a distance between a top portion of the first outer sidewall and a top portion of the second outer sidewall is greater than a distance between a bottom portion of the first outer sidewall and a bottom portion of the second outer sidewall.

### Claim 8

An integrated circuit structure comprising:
a first etch stop layer over an inter-layer dielectric;
a first metal line over the first etch stop layer, the first metal line having a first sidewall and a second sidewall opposite the first sidewall, wherein the first sidewall is linear from an upper surface of the first metal line to a bottom surface of the first metal line;
a second metal line over the first etch stop layer and adjacent the first metal line, the second metal line having a third sidewall and a fourth sidewall opposite the third sidewall, wherein the third sidewall is linear from an upper surface of the second metal line to a bottom surface of the second metal line, wherein the first sidewall faces the third sidewall, wherein a bottom portion of the first sidewall is separated from a bottom portion of the third sidewall by a first positive distance, wherein a top portion of the first sidewall is separated from a top portion of the third sidewall by a second positive distance, and wherein the second positive distance is greater than the first positive distance; and
a dielectric layer surrounding the first metal line and the second metal line, wherein a portion of the dielectric layer is between the first sidewall and the second sidewall of the first metal line.

### Claim 9 (depends on 8)

The integrated circuit structure of claim 8, further comprising a via contacting a top surface of the first metal line, wherein a top surface of a second etch stop layer over the dielectric layer is level with a top surface of the via.

### Claim 10 (depends on 8)

The integrated circuit structure of claim 8, wherein the dielectric layer comprises a material having a dielectric constant less than 3.0.

### Claim 11 (depends on 8)

The integrated circuit structure of claim 8, wherein the first metal line and the second metal line comprise tungsten, aluminum, or copper.

### Claim 12 (depends on 8)

The integrated circuit structure of claim 8, wherein the first metal line and the second metal line are ring-shaped in a top-down view.

### Claim 13 (depends on 8)

The integrated circuit structure of claim 8, wherein the first metal line and the second metal line comprise a portion of a first ring and a portion of a second ring, respectively, in a top-down view.

### Claim 14 (depends on 8)

The integrated circuit structure of claim 8, further comprising a dielectric barrier layer between the dielectric layer and the etch stop layer, the first metal line, and the second metal line, wherein the first metal line and the second metal line comprise copper, wherein a relative difference between thicknesses of vertical portions of the dielectric barrier layer and horizontal portions of the dielectric barrier layer is less than 10 percent.

### Claim 15

An integrated circuit structure comprising:
a first metal line comprising:
a first tilted sidewall; and
a second tilted sidewall opposite to the first tilted sidewall, wherein the second tilted sidewall is parallel to the first tilted sidewall;
a first via over and in contact with a top surface of the first metal line, wherein the first tilted sidewall and the second tilted sidewall tilt continuously from a bottom surface of the first metal line to an interface between the first metal line and the first via; and
a dielectric layer surrounding and in direct contact with the first tilted sidewall, the second tilted sidewall, and the first via.

### Claim 16 (depends on 15)

The integrated circuit structure of claim 15 further comprising:
a second metal line comprising:
a third tilted sidewall; and
a fourth tilted sidewall opposite to the third tilted sidewall, wherein the fourth tilted sidewall is parallel to the third tilted sidewall, wherein the third tilted sidewall and the fourth tilted sidewall tilt in a direction opposite the first tilted sidewall and the second tilted sidewall; and
a second via over and in contact with a top surface of the second metal line.

### Claim 17 (depends on 16)

The integrated circuit structure of claim 16, wherein the first metal line and the second metal line are immediate neighboring metal lines, wherein the first tilted sidewall of the first metal line and the third tilted sidewall of the second metal line face each other, and wherein a first distance between a top portion of the first tilted sidewall and a top portion of the third tilted sidewall is smaller than a second distance between a bottom portion of the first tilted sidewall and a bottom portion of the third tilted sidewall.

### Claim 18 (depends on 16)

The integrated circuit structure of claim 16, wherein the first metal line and the second metal line are immediate neighboring metal lines, wherein the first tilted sidewall of the first metal line and the third tilted sidewall of the second metal line face each other, and wherein a first distance between a top portion of the first tilted sidewall and a top portion of the third tilted sidewall is greater than a second distance between a bottom portion of the first tilted sidewall and a bottom portion of the third tilted sidewall.

### Claim 19 (depends on 15)

The integrated circuit structure of claim 15, further comprising:
an etch stop layer, wherein the first metal line is disposed over the etch stop layer, and wherein the first metal line further comprises a third tilted sidewall and a fourth tilted sidewall opposite to the third tilted sidewall, wherein the fourth tilted sidewall is parallel to the third tilted sidewall, wherein the third tilted sidewall and the fourth tilted sidewall tilt in a direction opposite the first tilted sidewall and the second tilted sidewall.

### Claim 20 (depends on 19)

The integrated circuit structure of claim 19, wherein the first metal line is ring-shaped in a top-down view, and wherein the first metal line encircles a portion of the dielectric layer.