# US 11,908,778 B2 · Semiconductor module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,908,778 B2 - Document ID: US11908778B2 - Status: Granted - Kind: B2 - Application number: 17/469,303 - Filed: 2021-09-08 - Published: 2021-12-30 - Granted: 2024-02-20 - Earliest claimed: 2019-03-11 - Assignees: Denso Corporation - Applicants: Denso Corporation - Inventors: Hiroshi Ishino; Ryota Miwa; Shoichiro Omae; Takuo Nagase - Web page: https://patentgrep.com/patent/US11908778B2 ## CPC - H10W 70/466: {Tape carriers or flat leads} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 40/778: {in encapsulations} - H10W 70/442: {of multiple leadframes in a single chip} - H10W 70/461: {specially adapted for cooling} - H10W 72/00: Interconnections or connectors in packages - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/00: Package configurations - H10W 90/811: {Multiple chips on leadframes} - H10W 72/07354: {changes in dispositions} - H10W 72/347: {Dispositions of multiple die-attach connectors} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 76/138: having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor module includes: a semiconductor element having a first main electrode and a second main electrode; a first conductive member and a second conductive member connected to the first main electrode and the second main electrode, respectively, and placed to sandwich the semiconductor element; and a main terminal including a first main terminal continuous from the first conductive member and a second main terminal continuous from the second conductive member. The main terminal has a facing portion, a non-facing portion, a first connection portion, and a second connection portion. In a width direction, a formation position of the second connection portion overlaps with a formation position of the first connection portion. ## Claims ### Claim 1 A semiconductor module comprising: a semiconductor element having one surface and a back surface opposite to the one surface, and including a first main electrode placed on the one surface and a second main electrode placed on the back surface; a conductive member placed to sandwich the semiconductor element, and including a first conductive member placed close to the one surface and connected to the first main electrode, and a second conductive member placed close to the back surface and connected to the second main electrode; a main terminal extending from the conductive member and including a first main terminal continuous from the first conductive member and a second main terminal continuous from the second conductive member; and a sealing resin body integrally sealing at least a part of each of the first conductive member and the second conductive member, a part of each of the first main terminal and the second main terminal, and the semiconductor element, wherein the main terminal has: a facing portion that is placed to cancel a magnetic flux generated when a main current flows, and is a portion where a plate surface of the first main terminal and a plate surface of the second main terminal face each other with a predetermined gap therebetween; a non-facing portion that is continuous from the facing portion of the first main terminal on a side opposite to the first conductive member; and a connection portion that includes a first connection portion formed on the plate surface of the first main terminal in the non-facing portion of the first main terminal, and a second connection portion formed on another plate surface of the second main terminal opposite to the plate surface facing the first main terminal and formed in at least the facing portion of the second main terminal, in a width direction orthogonal to an arrangement direction in which the facing portion and the non-facing portion of the first main terminal are arranged, a formation position of the second connection portion overlaps with a formation position of the first connection portion, the sealing resin body is interposed between the first main terminal and the second main terminal that form the facing portion, the second main terminal is placed to straddle the first main terminal in the width direction, the non-facing portion placed in the first main terminal is a first non-facing portion, the main terminal further includes a plurality of second non-facing portions that are continuous from both ends of the facing portion of the second main terminal in the width direction, and the first connection portion and the second connection portion are exposed from the sealing resin body as a connection region connected with an outside. ### Claim 2 (depends on 1) The semiconductor module according to claim 1, wherein in the width direction, a center of the first connection portion coincides with a center of the second connection portion. ### Claim 3 (depends on 1) The semiconductor module according to claim 1, wherein the plate surface on which the first connection portion is formed faces a same direction as the plate surface on which the second connection portion is formed. ### Claim 4 (depends on 1) The semiconductor module according to claim 1, wherein the sealing resin body includes a recess that opens on a surface opposite to a surface close to the connection portion and includes a first recess placed on the first non-facing portion and a second recess placed on the second non-facing portion. ### Claim 5 (depends on 1) The semiconductor module according to claim 1, wherein the second main terminal includes a notch in the second non-facing portion. ### Claim 6 (depends on 1) The semiconductor module according to claim 1, further comprising a bus bar connected to the connection portion of the main terminal and includes a first bus bar connected to the first main terminal and a second bus bar connected to the second main terminal, wherein the bus bar includes: a facing portion that is placed to cancel a magnetic flux generated when a main current flows, and is a portion where a plate surface of the first bus bar and a plate surface of the second bus bar face each other with a predetermined gap therebetween; and a non-facing portion that is continuous from the facing portion of the second bus bar and is connected to the second connection portion. ### Claim 7 (depends on 6) The semiconductor module according to claim 6, wherein in the second bus bar, the non-facing portion extends along the arrangement direction and at least a part extends from an end close to the non-facing portion among ends of the facing portion along the arrangement direction; and in a projection view from a direction orthogonal to the arrangement direction and the width direction, the second bus bar overlaps with the non-facing portion of the first main terminal. ### Claim 8 (depends on 6) The semiconductor module according to claim 6, further comprising a sealing member sealing a periphery of the connection portion between the main terminal and the bus bar. ### Claim 9 (depends on 6) The semiconductor module according to claim 6, further comprising an insulating coating covering the bus bar, and having an opening that exposes a connection portion of the bus bar with the main terminal and a back surface portion of the connection portion of the bus bar.