# US 11,908,768 B2 · Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board

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- Number: US 11,908,768 B2
- Document ID: US11908768B2
- Status: Granted
- Kind: B2
- Application number: 17/671,635
- Filed: 2022-02-15
- Published: 2022-06-02
- Granted: 2024-02-20
- Earliest claimed: 2018-03-26
- Assignees: Mitsubishi Materials Corporation
- Applicants: Mitsubishi Materials Corporation
- Inventors: Ryohei Yumoto; Tomoya Oohiraki; Takeshi Kitahara; Yoshiyuki Nagatomo
- Web page: https://patentgrep.com/patent/US11908768B2

## CPC

- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 3/0097: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)}
- H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
- H10W 70/02: of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H05K 3/0052: {Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards}
- H05K 2201/0341: Intermediate metal, e.g. before reinforcing of conductors by plating
- H05K 2201/0379: Stacked conductors
- H05K 2203/068: Features of the lamination press or of the lamination process, e.g. using special separator sheets
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.

## Claims

### Claim 1

A bonded body for an insulation circuit substrate board, comprising
a ceramic substrate board,
a plurality of aluminum circuit layers bonded on one surface of the ceramic substrate board, copper circuit layers bonded on the respective aluminum circuit layers by solid phase diffusion, and
intermetallic compound layers between the aluminum circuit layers and the copper circuit layers, wherein
in the intermetallic compound layers, a boundary is set at a position of 50 μm from an edge part beside a gap between the adjacent copper circuit layers, a thickness ratio t2/t1 is 30% or more where an average thickness in a center side of the boundary is t1 and an average thickness in an edge part side of the boundary is t2.