# US 11,908,762 B2 · Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,908,762 B2 - Document ID: US11908762B2 - Status: Granted - Kind: B2 - Application number: 16/979,678 - Filed: 2019-03-01 - Published: 2021-02-18 - Granted: 2024-02-20 - Earliest claimed: 2018-03-12 - Assignees: Resonac Corporation - Applicants: Hitachi Chemical Company, Ltd. - Inventors: Naoki Tomori; Tomohiro Nagoya; Takahiro Kuroda - Web page: https://patentgrep.com/patent/US11908762B2 ## CPC - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10W 74/127: {characterised by arrangements for sealing or adhesion} - B32B 7/027: Thermal properties - B32B 27/00: Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)} - C08G 73/14: Polyamide-imides - C09J 7/29: Laminated material (metallised plastics C09J7/22) - C09J 7/38: Pressure-sensitive adhesives [PSA] - C09J 201/00: Adhesives based on unspecified macromolecular compounds - H10W 70/456: {Materials} - H10W 72/00: Interconnections or connectors in packages - H10W 74/014: {using batch processing} - C09J 201/02: characterised by the presence of specified groups {, e.g. terminal or pendant functional groups} - H10W 70/421: {Shapes or dispositions} - H10W 70/453: {comprising flexible metallic tapes} - H10W 72/0198: {batch processes} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) ## Abstract A temporary protective film comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film is disclosed. The coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film may be greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film. ## Claims ### Claim 1 A temporary protective film for semiconductor sealing molding, comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film, wherein the adhesive layer contains an aromatic polyether amideimide, wherein the support film comprises a film of an aromatic polyimide, wherein an elastic modulus at 30° C. of the temporary protective film is 9 GPa or less, and wherein a coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film is greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film. ### Claim 2 (depends on 1) The temporary protective film for semiconductor sealing molding according to claim 1, wherein an elastic modulus at 230° C. of the adhesive layer is 1 MPa or more. ### Claim 3 (depends on 1) The temporary protective film for semiconductor sealing molding according to claim 1, wherein the adhesive layer is provided on the one surface of the support film, and a ratio of a thickness of the adhesive layer to a thickness of the support film is 0.2 or less. ### Claim 4 (depends on 1) The temporary protective film for semiconductor sealing molding according to claim 1, wherein the adhesive layer is provided on the one surface of the support film, and the temporary protective film further includes a non-adhesive layer provided on a surface of the support film, the surface being on the opposite side of the surface provided with the adhesive layer. ### Claim 5 (depends on 4) The temporary protective film for semiconductor sealing molding according to claim 4, wherein a ratio of a thickness of the adhesive layer to a thickness of the non-adhesive layer is 1.0 to 2.0. ### Claim 6 (depends on 1) A reel body, comprising a winding core and the temporary protective film for semiconductor sealing molding according to claim 1 wound around the winding core. ### Claim 7 (depends on 6) A package, comprising the reel body according to claim 6; and a packaging bag accommodating the reel body. ### Claim 8 (depends on 7) A packing material, comprising the package according to claim 7; and a packing box accommodating the package. ### Claim 9 (depends on 1) A temporary protective film-attached lead frame, comprising: a lead frame having a die pad and an inner lead; and the temporary protective film for semiconductor sealing molding according to claim 1, wherein the temporary protective film is attached to the lead frame in a direction in which the adhesive layer of the temporary protective film comes into contact with one surface of the lead frame, wherein the temporary protective film runs parallel to a shorter side of the lead frame in a case where the outer periphery of the lead frame has a rectangular shape, and parallel to any one side in a case where the outer periphery of the lead frame has a square shape. ### Claim 10 (depends on 1) A temporary protective film-attached sealing molded body, comprising: a lead frame having a die pad and an inner lead; a semiconductor element mounted on the die pad; a wire connecting the semiconductor element and the inner lead; a sealing layer sealing the semiconductor element and the wire; and the temporary protective film according to claim 1, wherein the adhesive layer of the temporary protective film is attached to a surface of the lead frame, the surface being on the opposite side of the surface where the semiconductor element is mounted. ### Claim 11 (depends on 1) A method for producing a semiconductor device, comprising, in the following order: a step of attaching the temporary protective film for semiconductor sealing molding according to claim 1 on one surface of a lead frame having a die pad and an inner lead, in a direction in which an adhesive layer of the temporary protective film comes into contact with the lead frame, wherein the temporary protective film runs parallel to a shorter side in a case where the outer periphery of the lead frame is a rectangular shape, and parallel to any one side in a case where the outer periphery of the lead frame has a square shape; a step of mounting a semiconductor element on a surface of the die pad, the surface being on the opposite side of the temporary protective film; a step of providing a wire for connecting the semiconductor element and the inner lead; a step of forming a sealing layer sealing the semiconductor element and the wire, and thereby obtaining a sealing molded body having the lead frame, the semiconductor element, and the sealing layer; and a step of peeling off the temporary protective film from the sealing molded body. ### Claim 12 (depends on 1) The temporary protective film for semiconductor sealing molding according to claim 1, wherein a thickness of the support film is 100 μm or less, and a ratio of a thickness of the adhesive layer to a thickness of the support film is 0.2 or less. ### Claim 13 (depends on 1) The temporary protective film for semiconductor sealing molding according to claim 1, wherein a thickness of the support film is 50 μm or less. ### Claim 14 (depends on 13) The temporary protective film for semiconductor sealing molding according to claim 13, wherein a ratio of a thickness of the adhesive layer to a thickness of the support film is 0.1 or less. ### Claim 15 (depends on 1) The temporary protective film for semiconductor sealing molding according to claim 1, wherein a ratio of a thickness of the adhesive layer to a thickness of the support film is more than 0.05 and less than or equal to 0.2. ### Claim 16 A temporary protective film for semiconductor sealing molding, comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film, wherein the adhesive layer contains an aromatic polyether amideimide, wherein the support film comprises a film of a an aromatic polyimide, wherein a ratio of a thickness of the adhesive layer to a thickness of the support film is 0.2 or less wherein an elastic modulus at 30° C. of the temporary protective film is 9 GPa or less, and wherein a coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film is greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.