# US 11,908,760 B2 · Package with encapsulated electronic component between laminate and thermally conductive carrier > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,908,760 B2 - Document ID: US11908760B2 - Status: Granted - Kind: B2 - Application number: 17/575,015 - Filed: 2022-01-13 - Published: 2022-07-21 - Granted: 2024-02-20 - Earliest claimed: 2021-01-15 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Andreas Grassmann - Web page: https://patentgrep.com/patent/US11908760B2 ## CPC - H10W 74/10: characterised by their shape or disposition - H10W 74/114: {by a substrate and the encapsulations} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 70/69: Insulating materials thereof - H10W 74/01: Manufacture or treatment - H10W 74/40: characterised by their materials - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 72/874: {On different surfaces} - H10W 72/9413: {on encapsulations} - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A package is disclosed. In one example, the package comprises a carrier comprising a thermally conductive and electrically insulating layer, a laminate comprising a plurality of connected laminate layers, an electronic component mounted between the carrier and the laminate. An encapsulant is at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component. ## Claims ### Claim 1 A package, wherein the package comprises: a carrier comprising a thermally conductive and electrically insulating layer, a planar first electrically conductive layer on a first main face of the thermally conductive and electrically insulating layer, and a planar second electrically conductive layer on a second main face of the thermally conductive and electrically insulating layer opposing the first main face; a laminate comprising a plurality of connected laminate layers; an electronic component mounted between the carrier and the laminate; and an encapsulant being at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component. ### Claim 2 (depends on 1) The package according to claim 1, wherein the thermally conductive and electrically insulating layer comprises or consists of a ceramic and/or has a thermal conductivity of at least 10 W/mK. ### Claim 3 (depends on 1) The package according to claim 1, wherein the carrier is configured to thermally couple and electrically insulate the electronic component with respect to an exterior of the package. ### Claim 4 (depends on 1) The package according to claim 1, wherein the first electrically conductive layer of the carrier faces the encapsulant. ### Claim 5 (depends on 1) The package according to claim 1, wherein the laminate layers are configured to form a redistribution structure. ### Claim 6 (depends on 1) The package according to claim 1, wherein the laminate layers are configured to form antiparallel electric connection paths. ### Claim 7 (depends on 1) The package according to claim 1, wherein an electrically conductive layer of the laminate faces the encapsulant. ### Claim 8 (depends on 1) The package according to claim 1, wherein the laminate is a printed circuit board. ### Claim 9 (depends on 1) The package according to claim 1, comprising an electrically conductive through connection extending through the encapsulant and electrically coupling at least one of the electronic component and the carrier with the laminate. ### Claim 10 (depends on 1) The package according to claim 1, wherein the electronic component is a semiconductor power chip. ### Claim 11 (depends on 1) The package according to claim 1, wherein the electronic component experiences a vertical current flow during operation. ### Claim 12 (depends on 1) The package according to claim 1, comprising an electrically conductive connection medium between the electronic component and the carrier. ### Claim 13 (depends on 1) The package according to claim 1, comprising an electrically conductive connection medium between the electronic component and the laminate. ### Claim 14 (depends on 12) The package according to claim 12, wherein the electrically conductive connection medium comprises at least one of the group consisting of a solder, in particular a transient liquid phase solder, a sinter material, and an electrically conductive adhesive. ### Claim 15 (depends on 1) The package according to claim 1, wherein the encapsulant encapsulates at least part of the carrier and/or at least part of the laminate. ### Claim 16 (depends on 1) The package according to claim 1, comprising at least one of the following features: the package comprises at least one further electronic component embedded in and/or surface mounted on the laminate; the package comprises a bolt member mounted on the laminate and being configured for establishing an electrically conductive connection with a counterpart device, in particular by screwing. ### Claim 17 (depends on 1) An electronic device, comprising: a package according to claim 1; and a mounting base on which the package is mounted. ### Claim 18 (depends on 17) The electronic device according to claim 17, comprising at least one of the following features: wherein the mounting base is physically connected with the laminate, in particular by an electrically conductive connection medium; wherein the electronic device comprises a cooling body, in particular a heat sink, physically connected with the carrier, in particular by an electrically conductive connection medium. ### Claim 19 A method of manufacturing a package, wherein the method comprises: providing a carrier comprising a thermally conductive and electrically insulating layer, a planar first electrically conductive layer on a first main face of the thermally conductive and electrically insulating layer, and a planar second electrically conductive layer on a second main face of the thermally conductive and electrically insulating layer opposing the first main face; providing a laminate comprising a plurality of connected laminate layers; mounting an electronic component between the carrier and the laminate; and encapsulating at least part of the electronic component by an encapsulant which is at least partially arranged between the carrier and the laminate. ### Claim 20 (depends on 1) The package according to claim 1, wherein a sidewall of the thermally conductive and electrically insulating layer is aligned with a sidewall of the first electrically conductive layer and a sidewall of the second electrically conductive layer.