# US 11,908,756 B2 · Interposer chips and enclosures for quantum circuits

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- Number: US 11,908,756 B2
- Document ID: US11908756B2
- Status: Granted
- Kind: B2
- Application number: 17/644,695
- Filed: 2021-12-16
- Published: 2023-06-22
- Granted: 2024-02-20
- Earliest claimed: 2021-12-16
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: David Abraham; John Michael Cotte
- Web page: https://patentgrep.com/patent/US11908756B2

## CPC

- H10W 76/136: having other interconnections perpendicular to the conductive base
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips}
- H10W 70/668: {Superconducting materials}
- H10W 70/68: Shapes or dispositions thereof
- H10W 70/698: Semiconductor materials that are electrically insulating, e.g. undoped silicon
- H10W 72/071: {Connecting or disconnecting}
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 76/17: characterised by their materials
- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- G06N 10/40: Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G06N: COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS

## Abstract

Techniques regarding qubit chip assemblies are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a qubit chip positioned on an interposer chip. The apparatus can also comprise an electrical connector in direct contact with the interposer chip. The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip.

## Claims

### Claim 1

An apparatus comprising:
a qubit chip positioned on an interposer chip;
an electrical connector in direct contact with the interposer chip, wherein the electrical connector establishes an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip;
an enclosure lid positioned adjacent to the qubit chip and the interposer chip, wherein the electrical connector extends through the enclosure lid; and
an isolation barrier extending from the enclosure lid to the interposer chip, wherein the isolation barrier at least partially surrounds the qubit chip.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the electrical connector is removably connected with the contact pad positioned on the interposer chip.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the interposer chip comprises a superconducting transmission line coupling the qubit chip to the contact pad.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the electrical connector and the interposer chip are in contact with each other via a solderless pressure connection.

### Claim 5 (depends on 1)

The apparatus of claim 1, further comprising:
an enclosure base positioned adjacent to the interposer chip and opposite the enclosure lid, wherein the enclosure base supports the interposer chip.

### Claim 6 (depends on 5)

The apparatus of claim 5, wherein the enclosure lid further comprises a pressing device in contact with the interposer chip, wherein the pressing device presses the interposer chip towards the enclosure base.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein the enclosure lid comprises at least one rigid material selected from a group consisting of tungsten, copper, sapphire, quartz, and boron nitride.

### Claim 8

An apparatus comprising:
a qubit chip enclosure lid;
an electrical connector that extends through the qubit chip enclosure lid, wherein the electrical connector has a pressure connection portion and a wire connection portion positioned at opposite ends of the electrical connector; and
a qubit chip enclosure that comprises a base and a plurality of side walls, wherein the plurality of side walls extend from the base and support the qubit chip enclosure lid.

### Claim 9 (depends on 8)

The apparatus of claim 8, wherein the qubit chip enclosure lid comprises at least one rigid material selected from a group consisting of tungsten, copper, sapphire, quartz, and boron nitride.

### Claim 10 (depends on 8)

The apparatus of claim 8, wherein the pressure connection portion is at a first side of the qubit chip enclosure lid, and wherein the wire connection portion is at a second side of the qubit chip enclosure lid.

### Claim 11 (depends on 10)

The apparatus of claim 10, wherein the qubit chip enclosure lid further comprises a pressing device positioned on the first side of the qubit chip enclosure lid.

### Claim 12 (depends on 8)

The apparatus of claim 8, wherein the qubit chip enclosure lid further comprises an isolation barrier that blocks electromagnetic radiation.

### Claim 13 (depends on 8)

The apparatus of claim 8, further comprising:
a qubit chip assembly positioned adjacent to the qubit chip enclosure lid, wherein the qubit chip assembly comprises an interposer chip directly coupled to the electrical connector via the pressure connection portion.

### Claim 14

A method comprising:
positioning a qubit chip assembly within a qubit chip enclosure such that the qubit chip assembly is positioned between side walls of the qubit chip enclosure; and
directly coupling an interposer chip of the qubit chip assembly to an electrical connector, wherein the electrical connector extends through a qubit chip enclosure lid, and wherein the interposer chip is further coupled to a qubit chip.

### Claim 15 (depends on 14)

The method of claim 14, further comprising:
positioning the qubit chip enclosure lid onto the qubit chip enclosure such that the electrical connector is aligned with a contact pad on the interposer chip.

### Claim 16 (depends on 15)

The method of claim 15, further comprising:
pressing the qubit chip assembly towards the qubit chip enclosure via a pressing device, wherein the qubit chip enclosure lid comprises the pressing device on a side of the qubit chip enclosure lid that faces the qubit chip assembly.

### Claim 17 (depends on 16)

The method of claim 16, further comprising:
shielding the qubit chip of the qubit chip assembly from electromagnetic interference via an isolation barrier that extends from the qubit chip enclosure lid.

### Claim 18 (depends on 17)

The method of claim 17, wherein the isolation barrier comprises a microwave gasket.

### Claim 19 (depends on 16)

The method of claim 16, wherein the directly coupling the interposer chip to the electrical connector employs a removable coupling mechanism.

### Claim 20 (depends on 16)

The method of claim 16, wherein the qubit chip enclosure lid comprises at least one rigid material selected from a group consisting of tungsten, copper, sapphire, quartz, and boron nitride.