# US 11,908,753 B2 · Test head connection method

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,908,753 B2
- Document ID: US11908753B2
- Status: Granted
- Kind: B2
- Application number: 17/520,631
- Filed: 2021-11-06
- Published: 2022-03-03
- Granted: 2024-02-20
- Earliest claimed: 2020-11-18
- Assignees: Chroma Ate Inc.
- Applicants: Kao-Shan Yang; Ching-Li Lin
- Inventors: Kao-Shan Yang; Ching-Li Lin
- Web page: https://patentgrep.com/patent/US11908753B2

## CPC

- G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)}
- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- G01R 1/07342: {the body of the probe being at an angle other than perpendicular to test object, e.g. probe card}
- G01R 31/2863: {Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04)}
- G01R 31/2889: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)}
- H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks
- G01R 31/2868: {Complete testing stations; systems; procedures; software aspects}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.

## Claims

### Claim 1

A test head connection method for connecting a test head and a probing machine, comprising:
disposing a load board and a test fixture between the test head and the probing machine;
activating a vacuum function of the test head;
moving the test head to align the test fixture;
moving the test head until touching the load board in the test fixture; and
fixing the test head and the test fixture by at least one engaging member;
wherein the test fixture is disposed in the probing machine, and the test fixture is used to accommodate the load board;
wherein the load board is configured to connect a wafer by direct docking without a pogo tower.

### Claim 2 (depends on 1)

The test head connection method according to claim 1, wherein the test fixture defines a first upper surface, the first upper surface defines a first accommodating space, and the first accommodating space is used for accommodating the load board.

### Claim 3 (depends on 2)

The test head connection method according to claim 2, wherein when the load board is accommodated in the first accommodating space, the load board and the first upper surface form a coplanar surface.

### Claim 4 (depends on 2)

The test head connection method according to claim 2, further comprising:
providing a fixing plate detachably locked to the probing machine;
wherein a second upper surface of the fixing plate defines a second accommodating space, and the second accommodating space is used for accommodating the test fixture.

### Claim 5 (depends on 4)

The test head connection method according to claim 4, wherein the first upper surface and the second upper surface are not coplanar.

### Claim 6 (depends on 4)

The test head connection method according to claim 4, wherein the test fixture is detachably locked in the second accommodating space of the fixing plate.

### Claim 7 (depends on 2)

The test head connection method according to claim 2, wherein the load board is detachably locked in the first accommodating space.

### Claim 8 (depends on 1)

The test head connection method according to claim 1, wherein in the step of moving the test head to align the test fixture further comprises:
providing an alignment member, disposed on the test fixture, to guide the test head to align with the test fixture.

### Claim 9 (depends on 1)

The test head connection method according to claim 1, wherein the test head contacts an upper surface of the load board, and the test fixture contacts a lower surface of the load board.

### Claim 10 (depends on 9)

The test head connection method according to claim 9, wherein the upper surface of the load board defines at least a vacuum area, and the vacuum area is surrounded by a metal strip.