# US 11,908,625 B2 · Multilayer ceramic electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,908,625 B2 - Document ID: US11908625B2 - Status: Granted - Kind: B2 - Application number: 17/837,127 - Filed: 2022-06-10 - Published: 2023-05-25 - Granted: 2024-02-20 - Earliest claimed: 2021-06-16 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Tomoaki Hirai - Web page: https://patentgrep.com/patent/US11908625B2 ## CPC - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/005: Electrodes - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/008: Selection of materials - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/1236: {based on zirconium oxides or zirconates (H01G4/1263 takes precedence)} - H01G 4/2325: {characterised by the material of the terminals} - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, first and second main surfaces opposing each other in a height direction, first and second side surfaces opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and first and second end surfaces opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction, and external electrodes connected to the internal conductive layers. The internal conductive layers include holes having a different area equivalent diameter. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes in each of the internal conductive layers becomes about 99% is defined as an area equivalent diameter D99, the area equivalent diameter D99 is about 8.0 μm or less. ## Claims ### Claim 1 A multilayer ceramic electronic component comprising: a multilayer body including a plurality of stacked ceramic layers, a plurality of internal conductive layers stacked on the ceramic layers, a first main surface and a second main surface opposing each other in a height direction, a first side surface and a second side surface opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction; and external electrodes, each connected to the internal conductive layers; wherein the internal conductive layers each include a plurality of holes, each having a different area equivalent diameter; and when an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the plurality of holes existing in each of the internal conductive layers becomes about 99% is defined as an area equivalent diameter D99, the area equivalent diameter D99 is about 8.0 μm or less. ### Claim 2 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the area equivalent diameter D99 is about 4.7 μm or less. ### Claim 3 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the area equivalent diameter D99 is about 3.2 μm or less. ### Claim 4 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the area equivalent diameter D99 is about 2.0 μm or more and about 8.0 μm or less. ### Claim 5 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the area equivalent diameter D99 is about 2.0 μm or more and about 4.0 μm or less. ### Claim 6 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a coverage of the internal conductive layer with respect to the ceramic layer is about 70% or more and about 99% or less. ### Claim 7 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the coverage of the internal conductive layer with respect to the ceramic layer is about 86% or more and about 93% or less. ### Claim 8 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the internal conductive layers each include a thickness of about 0.2 μm or more and about 2.0 μm or less. ### Claim 9 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein the internal conductive layers each include a thickness of about 0.2 μm or more and about 0.3 μm or less. ### Claim 10 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a thickness of each of the internal conductive layers is smaller than the area equivalent diameter D99. ### Claim 11 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein when an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the plurality of holes existing in the internal conductive layers becomes about 90% is defined as an area equivalent diameter D90, a thickness of each of the internal conductive layers is no more than half the area equivalent diameter D90. ### Claim 12 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein when an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the plurality of holes existing in the internal conductive layers becomes about 90% is defined as an area equivalent diameter D90, an average value of circularity of the plurality of holes in a first population of holes each having an area equivalent diameter equal to or larger than the area equivalent diameter D90 is about 0.7 or less. ### Claim 13 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein when an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the plurality of holes existing in the internal conductive layers becomes about 90% is defined as an area equivalent diameter D90, an average value of circularity of the plurality of holes in a first population of holes each having an area equivalent diameter equal to or larger than the area equivalent diameter D90 is about 0.2 or more and about 0.7 or less. ### Claim 14 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein when an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the plurality of holes existing in the internal conductive layers becomes about 90% is defined as an area equivalent diameter D90, an average value of circularity of the plurality of holes in a first population of holes each having an area equivalent diameter equal to or larger than the area equivalent diameter D90 is about 0.2 or more and about 0.46 or less. ### Claim 15 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a dimension of the multilayer body in the length direction is about 0.2 mm or more and about 6 mm or less, a dimension of the multilayer body in the height direction is about 0.05 mm or more and about 5 mm or less, and a dimension of the multilayer body in the width direction is about 0.1 mm or more and about 5 mm or less. ### Claim 16 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein each of the plurality of dielectric layers includes at least one of BaTiO3, CaTiO3, SrTiO3, or CaZrO3 as a main component. ### Claim 17 (depends on 16) The multilayer ceramic electronic component according to claim 16, wherein each of the plurality of dielectric layers includes at least one of a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound as a sub-component. ### Claim 18 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a thickness of each of the plurality of dielectric layers is about 0.2 μm or more and about 10 μm or less. ### Claim 19 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein each of the plurality of internal conductive layers includes at least one of Ni, Cu, Ag, Pd, or Au, or an alloy including at least one of Ni, Cu, Ag, Pd, or Au. ### Claim 20 (depends on 1) The multilayer ceramic electronic component according to claim 1, wherein a thickness of each of the plurality of internal conductive layers is about 0.2 μm or more and 2.0 μm or less.